Journal Articles
Hamid, Y, Hutt, D,
Whalley, D, Craddock, R (2020)
Relative contributions of packaging elements to the thermal hysteresis of a MEMS pressure sensor,
Sensors, 20(6), 1727, DOI:
10.3390/s20061727.
Pryde, J,
Whalley, D, Malalasekera, W (2016)
Comparison of heatsinks used for the thermal management of LEDs,
Electronics cooling, pp.22-27.
Zhang, Y, Liu, C,
Whalley, D (2015)
A mechanism of the penetration limit for producing holes in poly(4-vinyl phenol) films by inkjet etching,
Journal of Physics D: Applied Physics, 48(45), 455501, ISSN: 0022-3727. DOI:
10.1088/0022-3727/48/45/455501.
Pryde, J,
Whalley, D, Malalasekera, W (2014)
An assessment of computational fluid dynamic simulations and appropriate simplifications used for the development of LED luminaires,
20th International Workshop on Thermal Investigations of ICs and Systems, DOI:
10.1109/therminic.2014.6972485.
Jain, S,
Whalley, DC, Cottrill, M, Helland, T, Kristiansen, H, Redford, K, Liu, C (2013)
The effect of coating thickness on the electrical performance of novel isotropic conductive adhesives prepared using metallised polymer micro-spheres,
Proceedings - Electronic Components and Technology Conference, pp.796-802, ISSN: 0569-5503. DOI:
10.1109/ECTC.2013.6575664.
Zhang, Y, Liu, C,
Whalley, DC (2013)
The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers,
Applied Physics Letters, 102(10), p.103303, DOI:
10.1063/1.4795447.
Zhang, Y, Liu, C,
Whalley, DC (2012)
The penetration limit of poly(4-vinyl phenol) thin films for etching via holes
by inkjet printing,
Applied Physics Letters, 101(25), pp.253302-1-253302-4, DOI:
10.1063/1.4772796.
Sugden, MW, Hutt, DA,
Whalley, DC, Liu, C (2012)
A novel flip-chip interconnection process for integrated circuits,
Circuit World, 38(4), pp.214-218, ISSN: 0305-6120. DOI:
10.1108/03056121211280422.
Maligno, AR,
Whalley, DC, Silberschmidt, VV (2012)
Thermal fatigue life estimation and delamination mechanics studies of multilayered MEMS structures,
Microelectronics Reliability, 52(8), pp.1665-1678, ISSN: 0026-2714. DOI:
10.1016/j.microrel.2012.03.023.
Zhang, Y, Liu, C,
Whalley, DC (2012)
The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin films,
Journal of Physics D: Applied Physics, 45(12), pp.125303-1-125303-8.
Whalley, DC, Kristiansen, H, Halbo, L (2011) Polymer cored BGA ball reliability optimisation,
EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings.
Maligno, AR,
Whalley, DC, Silberschmidt, VV (2011)
Damage assessment in multilayered MEMS structures under thermal fatigue,
Journal of Physics: Conference Series, 305(1), ISSN: 1742-6588. DOI:
10.1088/1742-6596/305/1/012046.
Dou, G,
Whalley, DC, Liu, CC, Chan, YC (2010)
An experimental methodology for the study of co-planarity variation effects in anisotropic conductive adhesive assemblies,
Soldering and Surface Mount Technology, 22(1), pp.47-55, ISSN: 0954-0911. DOI:
10.1108/09540911011015148.
Maligno, AR,
Whalley, DC, Silberschmidt, V (2010)
Interfacial failure under thermal fatigue loading in multilayered MEMS structures,
IOP Conference Series: Materials Science and Engineering, Vol 10(012105), . DOI:
10.1088/1757-899X/10/1/012087.
Hegde, P,
Whalley, DC, Silberschmidt, V (2009)
Creep damage study at powercycling of lead-free surface mount device,
Computational Materials Science, 45(3), pp.638-645, DOI:
10.1016/j.commatsci.2008.05.005.
Li, JF, Mannan, SH, Clode, MP, Liu, CC, Chen, K,
Whalley, DC, Hutt, DA, Conway, PP (2008)
Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects,
IEEE Transactions on Components and Packaging Technologies, 31(3), pp.574-585, DOI:
10.1109/TCAPT.2008.2001160.
Dou, G,
Whalley, DC, Liu, C (2008)
Mechanical characterization of individual NiAu coated microsize polymer particles,
Applied Physics Letters, 92(10), ISSN: 0003-6951. DOI:
10.1063/1.2898219.
Hegde, P, Ochana, AR,
Whalley, DC, Silberschmidt, V (2008)
Finite element analysis of lead-free surface mount devices,
Computational Materials Science, 43(1), pp.212-220, ISSN: 0927-0256. DOI:
10.1016/j.commatsci.2007.07.046.
Hedge, P,
Whalley, DC, Silberschmidt, V (2008)
3D Study of thermal stresses in lead-free surface mount devices,
Journal of Thermal Stresses, 31, pp.1039-1055, ISSN: 0149-5739. DOI:
10.1080/01495730802250763.
Chen, K, Liu, C,
Whalley, DC, Hutt, DA, Li, JF, Mannan, SH (2008)
A comparative study of the interfacial reaction between Electroless Ni-P coatings and molten tin,
Acta Materialia, 56(), pp.5668-5676.
Li, JF, Mannan, SH, Clode, MP, Chen, K,
Whalley, DC, Liu, CC, Hutt, DA (2007)
Comparison of interfacial reactions of Ni and Ni-P in extended contact with liquid Sn-Bi-based solders,
Acta Materialia, 55(2), pp.737-752, ISSN: 1359-6454. DOI:
10.1016/j.actamat.2006.09.003.
Sarvar, F,
Whalley, DC, Hutt, DA, Palmer, PJ, Teh, NJ (2007)
Thermal and Thermo-Mechanical Modelling of Polymer Overmoulded Electronics,
Microelectronics International, 24(3), pp.66-75, ISSN: 1356-5362. DOI:
10.1108/13565360710818439.
Liu, C, Hendriksen, MW, Hutt, DA, Conway, PP,
Whalley, DC (2006)
Materials and Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection,
IEEE Transactions on Components and Packaging Technologies, 29(4), pp.869-876, ISSN: 1521-3331. DOI:
10.1109/TCAPT.2006.885973.
Li, J, Mannan, SH, Clode, MP, Fenner, DN,
Whalley, DC, Chen, K (2006) Reliability and failure analysis of dummy IGBT assembles using liquid solder joints under thermal cycling,
Proceedings - 2006 IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2006, pp.390-397.
Li, JF, Mannan, SH, Clode, MP,
Whalley, DC, Hutt, DA (2006)
Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects,
Acta Materialia, 54(11), pp.2907-2922, ISSN: 1359-6454. DOI:
10.1016/j.actamat.2006.02.030.
Dou, G, Chan, YC, Morris, JE,
Whalley, DC (2006)
RLC effects in fine pitch antisotropic conductive film connections,
Soldering and Surface Mount Technology, 18(1), pp.3-10.
Hyslop, SM, Palmer, PJ,
Whalley, DC (2005)
A software tool for estimation of PCB substrate utilisation efficiency statistics from scanned images,
Circuit World, 31(3), pp.10-16, ISSN: 0305-6120. DOI:
10.1108/03056120510585018.
Whalley, DC (2004)
A Simplified Reflow Soldering Process Model,
Journal of Materials Processing Technology, 150(1-2), pp.134-144, ISSN: 0924-0136. DOI:
10.1016/j.jmatprotec.2004.01.029.
Yi, S,
Whalley, DC, Conway, PP (2003)
Foreword,
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 26(3), pp.198-199, ISSN: 1521-334X. DOI:
10.1109/TEPM.2003.822298.
Zhong, CH, Yi, S,
Whalley, DC (2002) Solder Ball Failure Mechanisms in Plastic Ball Grid Array Packages,
Soldering and Surface Mount Technology, 14(No. 2), pp.40-50.
Hutt, DA, Liu, C, Conway, PP,
Whalley, DC, Mannan, SH (2002)
Electroless Nickel Bumping of Aluminium Bondpads. I. Surface Pre-treatment and Activation,
IEEE Transactions on Components and Packaging Technologies, 25(1), pp.87-97, ISSN: 1521-3331. DOI:
10.1109/6144.991180.
Hutt, DA, Liu, C, Conway, PP,
Whalley, DC, Mannan, SH (2002)
Electroless Nickel Bumping of Aluminium Bondpads. II. Electroless Nickel Plating,
IEEE Transactions on Components and Packaging Technologies, 25(1), pp.98-105, ISSN: 1521-3331. DOI:
10.1109/6144.991181.
Whalley, DC and Hyslop, SM (2002) A simplified model of the reflow soldering process,
Soldering and Surface Mount Technology, 14(No. 1), pp.30-37.
Sarvar, F,
Whalley, DC, Low, MK (2001)
IGBT Package Design for High Power Aircraft Electronic Systems,
Journal of Electronic Packaging, 123(4), pp.338-343, ISSN: 1528-9044. DOI:
10.1115/1.1390341.
Mannan, SH, Hutt, DA,
Whalley, DC, Conway, PP (2001) Solder Paste Reflow Modeling for Flip Chip Assembly,
TAPtechnology, Third Edition, pp.107-113.
Liu, C, Hutt, DA,
Whalley, DC, Conway, PP, Mannan, SH (2000) Under Bump Metallisation of Fine Pitch Flip-chip Using Electroless Nickel Deposition,
Journal of Electronics Manufacturing, 10(No 3), pp.161-170.
Hutt, DA, Rhodes, DG, Conway, PP, Mannan, SH,
Whalley, DC, Holmes, AS (2000) Investigation of a Solder Bumping Technique for Flip-Chip Interconnection,
Soldering and Surface Mount Technology, 12(1), pp.7-14, ISSN: 0954-0911.
Mannan, SH, Hutt, DA,
Whalley, DC (1999)
Electrical Method of Monitoring Percolation and Abrasion of Conducting Spheres Due to Shear Flow of a Dense Suspension in a Narrow Gap,
Applied Physics Letters, 75(6), pp.871-872, ISSN: 0003-6951.
Stennett, AD and
Whalley, DC (1999)
Novel Rework Techniques for Electronic Assemblies,
Soldering and Surface Mount Technology, 11(2), pp.7-11, ISSN: 0954-0911.
Whalley, DC, Mannan, SH, Williams, DJ (1999) Anisotropic Conducting Adhesives for Electronic Assembly,
Microelectronics International, 16(2), pp.44-48, ISSN: 1356-5362.
Sarvar, F and
Whalley, DC (1999) Thermal Design of High Power Semiconductor Packages for Aircraft Systems,
Journal of Electronics Manufacturing, 9(4), pp.269-274, ISSN: 0960-3131.
Oguibe, CN, Mannan, SH,
Whalley, DC, Williams, DJ (1998) Conduction Mechanisms in Anisotropic Conductive Adhesive Assemblies,
IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A, 21(2), pp.235-242, ISSN: 1083-4400.
Conway, P,
Whalley, D, Wilkinson, M, Hyslop, SM (1998)
The application of IR thermography to process monitoring and control of reflow soldering,
Soldering & Surface Mount Technology, 10(1), pp.13-18, ISSN: 0954-0911. DOI:
10.1108/09540919810203766.
Conway, PP,
Whalley, DC, Wilkinson, M, Hyslop, SM (1998) The Application of IR Thermography to Process Monitoring and Control of Reflow Soldering,
Soldering and Surface Mount Technology, 10(1), pp.13-18, ISSN: 0954-0911.
Mannan, SH, Oguibe, CN,
Whalley, DC, Williams, DJ (1997) Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies,
Journal of Electronics Manufacturing, 7(3), pp.211-224, ISSN: 0957-4522.
Mannan, SH, Williams, DJ,
Whalley, DC (1997) Some Optimum Anisotropic Conductive Adhesive Properties for Flip-Chip Interconnection,
Journal of Materials Science: Materials in Electronics, 8(4), pp.223-231.
Whalley, DC, Mannan, SH, Williams, DJ (1997) Anisotropic Conducting Adhesives for Electronic Assembly,
Assembly Automation, 17(1), pp.66-74, ISSN: 0144-5154.
Ogunjimi, AO, Mannan, SH,
Whalley, DC, Williams, DJ (1996)
Assembly of Planar Array Components Using Anisotropic Conducting Adhesives - A Benchmark Study: Part I - Experiment,
IEEE Transactions on Components, Packaging and Manufacturing Technology - Part C, 19(4), pp.257-263, ISSN: 1083-4400.
Mannan, SH,
Whalley, DC, Ogunjimi, AO, Williams, DJ (1996)
Assembly of Planar Array Components Using Anisotropic Conducting Adhesives - A Benchmark Study: Part II - Theory,
IEEE Transactions on Components, Packaging and Manufacturing Technology - Part C, 19(4), pp.264-269, ISSN: 1083-4400.
Whalley, DC and Conway, PP (1996) Simulation and interpretation of wetting balance tests using The Surface Evolver,
Transactions of the ASME: Journal of Electronic Packaging, 118(3), pp.134-141, ISSN: 1043-7398.
Whalley, DC and Conway, PP (1996)
Simulation and interpretation of wetting balance tests using the surface evolver,
JOURNAL OF ELECTRONIC PACKAGING, 118(3), pp.134-141, ISSN: 1043-7398. DOI:
10.1115/1.2792143.
Whalley, DC (1996) A Model to Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges,
Journal of Electronics Manufacturing, 6(1), pp.39-44, ISSN: 0960-3131.
Ogunjimi, AO, Mannan, SH,
Whalley, DC, Williams, DJ (1995) The Assembly Process for Anisotropic Conductive Joints - Some New Experimental and Theoretical Results,
Journal of Electronics Manufacturing, 5(4), pp.263-272, ISSN: 0960-3131.
Whalley, DC, Conway, PP, Sarvar, F, Williams, DJ (1995) Modelling of Solder Joint Geometry for Quality and Reliability,
Soldering and Surface Mount Technology, 21, pp.10-12, ISSN: 0954-0911.
Goward, JM,
Whalley, DC, Williams, DJ (1995) Understanding Anisotropic Conducting Adhesives Behaviour,
Microelectronics International, 37, pp.55-59, ISSN: 1356-5362.
Kalantary, MR, Sarvar, F, Conway, PP, Williams, DJ,
Whalley, DC (1994) Observed Phenomenology of the Interaction Between Solder Paste and Soldering Processes,
Soldering and Surface Mount Technology, 18, pp.8-11, ISSN: 0954-0911.
Goward, JM, Williams, DJ,
Whalley, DC (1993) Properties of Anisotropic Conductive Adhesive Pastes for Fine Pitch Surface Mount Technology,
Journal of Electronics Manufacturing, 3(4), pp.179-190, ISSN: 0960-3131.
Whalley, DC, Williams, DJ, Boyle, OA, Ogunjimi, AO, Goward, JM (1993) A Comparison of the Behaviour of Isotropic and Anisotropic Conducting Adhesives for Surface Mount,
Proceedings of ASME Winter Meeting, Manufacturing Aspects of Electronic Packaging, 65, pp.81-91.
Williams, DJ and
Whalley, DC (1993) The Effects of Conducting Particle Distribution on the Behaviour of Anisotropic Conducting Adhesives - Non Uniform Conductivity and Shorting Between Connections,
Journal of Electronics Manufacturing, 3(2), pp.85-94, ISSN: 0960-3131.
Williams, DJ,
Whalley, DC, Boyle, OA, Ogunjimi, AO (1993) Anisotropic Conducting Adhesives for Electronic Interconnection,
Soldering and Surface Mount Technology, 14, pp.4-8.
Williams, DJ, Conway, PP,
Whalley, DC (1993) Making Circuits More Than Once: The Manufacturing Challenges of Electronics Intensive Products,
Proceedings of the Institution of Mechanical Engineers, 207, pp.83-90.
Ogunjimi, AO, Boyle, O,
Whalley, DC, Williams, DJ (1992) A Review of the Impact of Conductive Adhesive Technology on Interconnection,
Journal of Electronics Manufacturing, 2(3), pp.109-118, ISSN: 0960-3131.
Whalley, DC, Ogunjimi, AO, Conway, PP, Williams, DJ (1992) The Process Modelling of the Infra-red Reflow Soldering of Printed Circuit Board Assemblies,
Journal of Electronics Manufacturing, 2(1), pp.23-29, ISSN: 0960-3131.
Whalley, DC (1991) Reliability Prediction Tools for SMD Solder Joints,
Soldering and Surface Mount Technology, (9), 8,9,15, ISSN: 0954-0911.
Conway, PP, Ogunjimi, AO, Sargent, PM, Tang, ACT,
Whalley, DC, Williams, DJ (1991) SMD Reflow Soldering: A Thermal Process Model,
Annals of the CIRP, 40/1/1991, pp.21-24.
Conway, PP, Williams, DJ,
Whalley, DC (1991) Experiments to Allow the Interpretation of a Computer Based Model of the Solder Paste Reflow Process,
Journal of Processing of Advanced Materials, 1(3), pp.175-180, ISSN: 0960-3158.
Whalley, DC and Campbell, DS (1987)
Temperature cycling of surface mounted thick-film zero-ohm jumpers,
Hybrid Circuits, (14), pp.68-70.
Whalley, DC and Campbell, DS (1987)
Temperature Cycling of Surface Mounted Thick Film ‘Zero‐ohm’ Jumpers,
Microelectronics International, 4(3), pp.68-70, ISSN: 1356-5362. DOI:
10.1108/eb044293.
Conferences
Hamid, Y, Hutt, D,
Whalley, D, Craddock, R (2019)
Packaging effects on MEMS pressure sensor hysteresis. In
2019 21st Electronics Packaging Technology Conference; 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), Singapore, pp.111-115, ISBN: 9781728138350. DOI:
10.1109/EPTC47984.2019.9026707.
Hamid, Y, Hutt, D,
Whalley, D, Craddock, R (2019)
Effect of thin film interconnect inelasticity on MEMS pressure sensor hysteresis. In
Fifth International Conference on Sensors and Electronic Instrumentation Advances (SEIA' 2019), Canary Islands (Tenerife), Spain, pp.174-176.
Kyranaki, N, Whalley, D, Hutt, D, Gottschalg, R, Betts, T (Accepted for publication) Direct measurement of moisture ingress in PV laminates. In 36th European Photovoltaic Solar Energy Conference and Exhibition, Marseille, pp.1049-1053, ISBN: 3936338604. DOI: 10.4229/EUPVSEC20192019-4AV.1.24.
Hutt, D, Coggrave, C,
Whalley, D, Riches, S, Cannon, K, Wu, K, Wang, S, Jones, L, Tyrer, J, Wise, R (2019)
Additive Manufacture of Interconnects with Copper Filled Adhesives and Pastes. In
IMAPS MicroTech 2019 Annual Conference ”Power in Packaging”, Cambridge.
Wang, S, Hutt, D,
Whalley, D, Critchlow, G (2018) An Evaluation of the Electrical Stability of Copper Filled Isotropic Conductive Adhesives in High Moisture Environments. In
Electronics Packaging Technology Conference, Singapore.
Wu, K, Hou, S, Qi, S, Hutt, D, Tyrer, J,
Whalley, D (2017)
Laser processing of printed copper interconnects on polymer substrates. In
Electronics Packaging Technology Conference (EPTC), Singapore, pp.834-839, ISBN: 9781509043699. DOI:
10.1109/EPTC.2016.7861597.
Sugden, MW, Tao, J, Liu, C, Hutt, DA,
Whalley, DC, Lietaer, N (2016)
Characterisation of thermocompression bonds formed using metal coated polymer core particles for fine pitch interconnections. In
2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble. DOI:
10.1109/estc.2016.7764690.
Jain, S,
Whalley, DC, Redford, K (2016)
Characterisation of curing shrinkage for isotropic conductive adhesives containing silver coated polymer spheres. In
2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble. DOI:
10.1109/estc.2016.7764486.
Tao, J, Whally, DC, Liu, C (2016)
Electrophoretic Deposition of Ni/Au Coated Particles for Ultra-Fine Pitch Interconnection. In
, Proceedings - Electronic Components and Technology Conference, pp.2119-2125, ISBN: 9781509012039. DOI:
10.1109/ECTC.2016.360.
Pryde, J,
Whalley, D, Malalasekera, W (2016)
Observations on the implementation of LEDs for general lighting. In
ITherm 2016, Las Vegas, NV, USA,ISBN: 9781467381222. DOI:
10.1109/ITHERM.2016.7517634.
Wang, X,
Whalley, D, Silberschmidt, V (2016)
Non-destructive defect detection for MEMS devices using transient thermography. In
, Grenoble, France,ISBN: 9781509014026. DOI:
10.1109/ESTC.2016.7764459.
Tao, J,
Whalley, D, Liu, C, Wu, F, Kristiansen, H (2015)
Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections. In
2015 Electronic Components & Technology Conference, San Diego, pp.1154-1159, DOI:
10.1109/ECTC.2015.7159740.
Liu, J, Redei, R, Qi, S, Hutt, DA,
Whalley, D (2014)
Electrical performance of isotropic conductive adhesives with copper and copper coated iron fillers. In
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). DOI:
10.1109/eptc.2014.7028407.
Pryde, J, Malalasekera, W,
Whalley, D (2014) An Assessment of CFD Simulation and Appropriate Simplifications Used for the Development of LED Luminaires, 20th International Workshop on Thermal Investigations of ICs and Systems. In
An Assessment of CFD Simulation and Appropriate Simplifications Used for the Development of LED Luminaires, 20th International Workshop on Thermal Investigations of ICs and Systems, Greenwich, London, UK, pp.1-6.
Pryde, JR,
Whalley, DC, Malalasekera, W (2014)
A review of LED technology trends and relevant thermal management strategies. In
2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). DOI:
10.1109/itherm.2014.6892261.
Pryde, J,
Whalley, D, Malalasekera, W (2014)
A review of LED technology trends and relevant thermal management strategies. In
, Florida, USA, pp.31-38, ISBN: 9781479952670. DOI:
10.1109/ITHERM.2014.6892261.
Tao, J,
Whalley, D, Liu, C, He, JY (2014)
Process and performance modelling for individual ACA conductor particles. In
Electronics System-Integration Technology Conference (ESTC), 2014, Helsinki, pp.1-6, DOI:
10.1109/ESTC.2014.6962798.
Tao, J,
Whalley, D, Liu, C (2014)
Magnetic deposition of Ni/Au coated polymer core particles for flip-chip interconnection. In
2014 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, pp.409-413, DOI:
10.1109/ICEPT.2014.6922684.
Nobeen, N, Ahmad, K,
Whalley, DC, Hutt, D, Haworth, B (2013) Polymeric Packaging of High Power Semiconductor Devices: Material Selection & Reliability Assessment. In
EPTC, Singapore, pp.123-128.
Jain, S,
Whalley, DC, Cottrill, M, Kristiansen, H, Redford, K, Helland, S, Helland, T, Kalland, E, Liu, C (2013) Factors affecting conduction in novel isotropic conductive adhesives filled with silver coated polymer spheres. In
EMPC, Grenoble, pp.1-6.
Nobeenr, NS, Ahmad, K,
Whalley, DC, Hutt, DA, Haworth, B, IEEE, (2013)
Polymeric Packaging of High Power Semiconductor Devices: Material Selection & Reliability Assessment. In
, PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), pp.118-123, ISBN: 978-1-4799-2832-3.
Sugden, MW, Liu, C, Hutt, D,
Whalley, D, Kristiansen, H (2012)
Metal-coated mono-sized polymer core particles for fine pitch flip-chip interconnects. In
2012 IEEE 62nd Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd Electronic Components and Technology Conference. DOI:
10.1109/ectc.2012.6248831.
Nobeen, NS,
Whalley, DC, Hutt, DA, Haworth, B (2012)
Finite Element Analysis of a High Voltage Semiconductor Polymeric Package Design using a Taguchi Based Experimental Design. In
4th Electronic System-Integration Technology Conference (ESTC), 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), Amsterdam, NETHERLANDS,ISBN: 978-1-4673-4645-0.
Zhang, Y, Liu, C,
Whalley, DC (2012)
Influence of etching solvent evaporation on the size of micro-via holes in PVP thin films. In
.
Jain, S,
Whalley, DC, Cottrill, M, Kristiansen, H, Redford, K, Nilsen, CB, Helland, T, Liu, C (2011) Electrical properties of an Isotropic Conductive Adhesive filled with silver coated polymer spheres. In
, EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings,ISBN: 9780956808608.
Jain, S,
Whalley, DC, Cottrill, MCW, Kristiansen, H, Redford, K, Nilsen, CB, Helland, T, Liu, CC (2011)
Electrical properties of an Isotropic Conductive Adhesive filled with silver coated polymer spheres. In
Proceedings of the 18th IMAPS European Microelectronics and Packaging Conference (EMPC), Brighton, UK, pp.240-246, ISBN: 978-0-9568086-0-8.
Huertas Quintero, LAM, Conway, PP,
Whalley, DC, West, AA (2010) Deployment of a Reflow Process Model to Support Quality and Reliability in PCA Manufacturing. In
Proceedings of the 12th IEEE Electronics Packaging Technology Conference (EPTC 2010), IEEE catalog No CFP10453-USB, Singapore, p.6, ISBN: 978-1-4244-8561-1.
Maligno, AR,
Whalley, DC, Silberschmidt, V (2010)
A 3D numerical study to investigate the effects of temperature variation and residual stresses in representative volume MEMS elements. In
Proceedings of the ASME 10th Biennial Conference on Engineering Systems Design and Analysis, Istanbul, Turkey, pp.511-518, ISBN: 978-0-7918-4915-6. DOI:
10.1115/ESDA2010-24740.
Maligno, AR,
Whalley, DC, Silberschmidt, V (2010) A 3D numerical study to investigate the effects of temperature variation and residual stresses in representative volume MEMS elements. In
Proceedings of the ASME 2010 10th Biennial Confeence on Engineering Systems Design and Analysis (ESDA2010), Istanbul, Turkey, pp.1-8, ISBN: 978-0-7918-3877-8.
Nobeen, NS,
Whalley, DC, Hutt, DA, Haworth, B (2010)
Computational modelling of electrical field intensity for high voltage semiconductor package design. In
APM '10, International Symposium on Advanced Packaging: Microtech 2010, Cambridge, UK, pp.54-59, ISBN: 978-1-4244-6756-3. DOI:
10.1109/ISAPM.2010.5441380.
Whalley, DC and Kristiansen, H (2010)
Current density simulations for polymer cored CSP interconnects. In
Proceedings of the 3rd IEEE CPMT Electronic Systemintegration Technology Conference, Berlin, Germany, p.5, ISBN: 978-1-4244-8553-6. DOI:
10.1109/ESTC.2010.5642932.
Zhang, Y, Liu, C,
Whalley, D (2010)
The effect of droplet ejection frequency on inkjet-etched micro via holes. In
,ISBN: 9781424485604. DOI:
10.1109/EPTC.2010.5702639.
Zhang, Y, Liu, C,
Whalley, DC (2010) The effect of droplet ejection frequency on inkjet-etched micro via holes. In
Electronics Packaging Technology Conference (EPTC), Singapore, pp.236-239.
Hegde, P,
Whalley, DC, Silberschmidt, V (2009) Size and Microstructure Effects on the Stress-Strain Behaviour of Lead-Free Solder Joints. In
Proceedings of the 17th IMAPS European Microelectronics and Packaging Conference, Paper No P8, Rimini, Italy, p.9, ISBN: 0615298680.
Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP,
Whalley, DC (2009)
Integrated modelling for simulation in the electronics manufacturing domain. In
Proceedings of the 11th Electronics Packaging Technology Conference, Singapore, pp.260-266, ISBN: 978 1 4244 5099 2. DOI:
10.1109/EPTC.2009.5416541.
Zhang, Y, Liu, C,
Whalley, DC (2009)
Direct-write techniques for maskless production of microelectronics: A review of current state-of-the-art technologies. In
International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP '09), Beijing, China, pp.497-503, ISBN: 978 1 4244 4658 2. DOI:
10.1109/ICEPT.2009.5270702.
Zhang, Y, Liu, C,
Whalley, DC (2009) Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologies. In
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), China, pp.497-503.
Kristiansen, H,
Whalley, DC, Tyldum, H, Redford, K (2009)
Characterisation of metal coated polymer balls for BGA and CSP applications. In
Proceedings of the 59th Electronic Components and Technology Conference (ECTC 2009), San Diego, CA, pp.1563-1568, ISBN: 978 1 4244 4475 5. DOI:
10.1109/ECTC.2009.5074221.
Zhang, Y, Liu, C,
Whalley, D (2009)
Direct-write Techniques for Maskless Production of Microelectronics: A Review of Current State-of-the-art Technologies. In
, 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), pp.421-427, ISBN: 978-1-4244-4658-2.
Segura Velandia, DM, Pourtafreshi Monfared, R, West, AA, Conway, PP,
Whalley, DC, Huertas Quintero, LAM (2008) Role of CAD Post-Processing in a Quality Tool for Low Volume High-Complexity Electronics Manufacture. In
Proceedings of the 10th International IEEE Electronics Packaging Technology Conference, Singapore, pp.1436-1441, ISBN: 978-1-4244-2118-3.
Kristiansen, H, Redford, K, Zhang, Z,
Whalley, D (2008) Development of metal coated polymer particles with extremely narrow size distribution. In
, IMAPS Nordic Annual Conference 2008, pp.164-169, ISBN: 9781622764044.
Guillen Marin, F,
Whalley, DC, Kristiansen, H, Zhu, Z (2008) Mechanical performance of polymer cored BGA interconnects. In
10th IEEE Electronics Packaging Technology Conference, Proceedings of the 10th IEEE Electronics Packaging Technology Conference, Singapore, pp.316-321.
Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP,
Whalley, DC, Wilson, C, Pourtafreshi Monfared, R (2008) Component Based Simulation as a Predictive Tool for High Value Added Electronics. In
Proceedings of the 2008 European Electronis Assembly Reliability, Tallin.
Wilson, AR, West, AA, Segura Velandia, DM, Conway, PP,
Whalley, DC, Huertas Quintero, LAM, Pourtafreshi Monfared, R (2008) Characterization of Printed Solder Paste Excess and Bridge Related Defects. In
Proceedings of the 2nd IEEE CPMT Electronic Systemintegration Technology Conference, Greenwich, UK, pp.1305-1310, ISBN: 978-1-4244-2813-7.
Hegde, P,
Whalley, DC, Silberschmidt, V (2008)
Thermo-mechanical Damage Accumulation during Power Cycling of Lead-Free Surface Mount Solder Joints. In
Proceedings of the 2nd IEEE CPMT Electronic Systemintegration Technology Conference, Greenwich, pp.1081-1090, ISBN: 978-1-4244-2813-7.
Dou, G, Webb, DP,
Whalley, DC, Hutt, DA, Wilson, AR (2008)
Current Leakage Failure of Conformally Coated Electronic Assemblies. In
Proceedings of the 2nd IEEE CPMT Electronic Systemintegration Technology Conference, Greenwich, pp.1213-1218, ISBN: 978-1-4244-2813-7.
Wilson, AR, West, AA, Segura Velandia, DM, Conway, PP,
Whalley, DC, Huertas Quintero, LAM, Pourtafreshi Monfared, R (2008)
Characterization of Printed Solder Paste Excess and Bridge Related Defects. In
Proceedings of the 2nd IEEE CPMT Electronic Systemintegration Technology Conference, Greenwich, pp.1305-1310, ISBN: 978-1-4244-2813-7.
Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP,
Whalley, DC, Wilson, AR, Pourtafreshi Monfared, R (2008)
A simulation module for supporting the manufacture of high value added electronics manufacturing. In
Proceedings of the 2nd IEEE CPMT Electronic System integration Technology Conference, Greenwich, pp.365-370, ISBN: 978-1-4244-2813-7.
Webb, DP, Hutt, DA,
Whalley, DC, Palmer, PJ (2008)
A Substrateless Process for Sustainable Manufacture of Electronic Assemblies. In
Proceedings of the 2nd IEEE CPMT Electronic Systemintegration Technology Conference, Greenwich, pp.511-516, ISBN: 978-1-4244-2813-7.
Whalley, DC, Kristiansen, H, Guillen Marin, F (2008)
Thermal and Electrical Modelling of Polymer Cored BGA Interconnects. In
Proceedings of the 2nd IEEE CPMT Electronic Systemintegration Technology Conference, Greenwich, pp.1009-1016, ISBN: 978-1-4244-2813-7.
Segura Velandia, DM, West, AA, Conway, PP, Wilson, AR,
Whalley, DC, Pourtafreshi Monfared, R, Huertas Quintero, LAM (2008)
Integration Issues in the Development of a Modelling and Simulation Tool for Low Volume High-Complexity Electronics Manufacture. In
Proceedings of the 2nd IEEE CPMT Electronic Systemintegration Technology Conference, Greenwich, UK, pp.1097-1102, ISBN: 978-1-4244-2813-7.
Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP,
Whalley, DC, Wilson, AR, Pourtafreshi Monfared, R (2008) A simulation module for supporting the manufacture of high value added electronics manufacturing. In
Proceedings of the 2nd IEEE CPMT Electronic System integration Technology Conference, Greenwich, UK, pp.365-370, ISBN: 978-1-4244-2813-7.
Thompson, M,
Whalley, DC, Hopkinson, N (2008) Investigating dielectric properties of sintered polymers for Rapid Manufacturing. In
Proceedings of the Solid Freeform Fabrication Symposium, Austin, Texas, USA, pp.79-93.
Kristiansen, H and
Whalley, D (2008)
Development and Application of Polymer Particles for “Green Electronics” Manufacturing. In Bukat, K, Gromek, J, Gonera, M (ed)
Progress in Eco-Electronics, Monographies of Tele & Radio Research Institute: Volume 1 Progress in Eco-Electronics, Warsaw, pp.61-67.
Kristiansen, H and
Whalley, D (2008)
Development and application of polymer particles for “green electronics” manufacturing. In Bukat, K, Gromek, J, Gonera, M (ed)
Progress in Eco-Electronics, Warsaw, pp.61-67, ISBN: 978-83-926599-0-7.
Whalley, DC, Silberschmidt, V, Hegde, P (2008) Experimental and analytical study of lead-free solder joint reliability in surface mount devices. In
Proceedings of the Eighth International Conference on Fundamentals of Fracture (ICFF VIII), Hong Kong & Guangzhou, China, pp.301-302.
Segura Velandia, DM, Pourtafreshi Monfared, R, West, AA, Conway, PP,
Whalley, DC, Huertas Quintero, LAM (2008) Role of CAD Post-Processing in a Quality Tool for Low Volume High-Complexity Electronics Manufacture. In
10th International IEEE Electronics Packaging Technology Conference, Proceedings of the 10th International IEEE Electronics Packaging Technology Conference, Singapore, 9th - 12th December 2008, pp.1436-1441, ISBN: 9781424421183.
Li, J, Sarvar, F,
Whalley, DC, Hutt, DA, Clode, MP, Mannan, SH (2007)
Failure Mechanisms of Dummy IGBT Assembles Constructed Using Liquid In-Sn/Nb System. In
Proceedings of the 9th Electronics Packaging Technology Conference, EPTC, Singapore, pp.43-46, ISBN: 1-4244-1323-0.
Segura Velandia, DM, West, AA, Conway, PP, Wilson, AR,
Whalley, DC (2007)
Complex Low Volume Electronics Simulation Tool to Improve Yield and Reliability. In
Proceedings of the 32nd International Electronics Manufacturing Technology (IEMT), Session 1: Manufacturing and Test Technology, San Jose, California, USA, pp.1-7.
Andersen, O, Anderssen, HI, Liu, J,
Whalley, DC, Kristiansen, H, Gronlund, TO, Bukat, K, Lu, X (2007) Advances in Europe - China Green Electronics Collaboration. In
Proceedings of the International Symposium on High Density Packaging and Microsystem Integration, HDP'07, Shanghai, PRC, pp.1-4, ISBN: 1-4244-1253-6.
Hegde, P,
Whalley, DC, Silberschmidt, V (2007) Thermal Stress Study of Lead Free Surface Mount Device. In Chao, CK and eds, CYL (ed)
Proceedings of the Seventh International Congress on Thermal Stresses, TS2007, Taipei, Taiwan, pp.661-614, ISBN: 978-986-00-9556-2.
Hegde, P,
Whalley, DC, Silberschmidt, V (2007)
Creep Analysis of a Lead-free Surface Mount Device. In
Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics amd Micro-Systems, London, UK, pp.356-362, ISBN: 1-4244-1105-X.
Segura Velandia, DM, West, AA, Conway, PP,
Whalley, DC (2007) A Modelling Framework for the Reliability of Safety Critical Electronics, Keynote Paper. In
Proceedings of the 8th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE, London, UK, pp.2-6, ISBN: 1-4244-1106-8.
Andersen, O, Anderssen, IH, Liu, J,
Whalley, D, Kristiansen, H, Gronlund, TO, Bukat, K, Lu, X, IEEE, (2007)
Advances in Europe-China green electronics collaboration. In
, HDP'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION, pp.131-+, ISBN: 978-1-4244-1252-5.
Dou, G,
Whalley, DC, Liu, CC (2006)
Mechanical and Electrical Characterisation of Individual ACA Conductor Particles. In
Proceedings of the 8th IEEE CPMT International Symposium on Electronics Materials and Packaging (EMAP), Hong Kong, pp.667-675, ISBN: 1-4244-0834-2.
Segura Velandia, DM, West, AA, Conway, PP,
Whalley, DC (2006)
A Case-Based Reasoning Approach for Low Volume, High Added Value Electronics. In
Proceedings of the 8th IEEE Electronics Packaging Technology Conference, Singapore, pp.843-848, ISBN: 1-4244-0665-X.
Chen, K, Liu, C,
Whalley, DC, Hutt, DA, Li, JF, Mannan, SH (2006)
Electroless Ni-W-P Alloys as Barrier Coatings for Liquid Solder Interconnects. In
Proceedings of the 1st IEEE Electronic Systemintegration Technology Conference, Dresden, Sept 5 - 7 ology Conference, Dresden, Germany, pp..p.421-427, ISBN: 1-4244-0553-X.
Sarvar, F,
Whalley, DC, Conway, PP (2006)
Thermal Interface Materials - A Review of the State of the Art. In
Proceedings of the 1st IEEE Electronic Systemintegration Technology Conference, Dresden, Sept 5 - 7, 2006, Dresden, pp..p. 1292-1302, ISBN: 1-4244-0553-X.
Dou, G,
Whalley, DC, Liu, C (2006)
Deformation Property Measurement for Single Anisotropic Conductive Adhesive Particles. In
Proceedings of the 1st IEEE Electronic Systemintegration Technology Conference,Dresden,Sept 5 - 7, 2006, Dresden, pp..p. 840-847, ISBN: 1-4244-0553-X.
Dou, G,
Whalley, DC, Liu, C (2006)
Effects of Co-planarity Variation on Conduction in Antisotropic conductive Adhesive Assemblies. In
Proceedings of the 56th IEEE Electronics Components and Technology Conference (ECTC'55), San Diego, pp.932-938.
Ochana, AR, Hutt, DA,
Whalley, DC, Sarvar, F, Al Habaibeh, A (2006)
Modelling of the Power Cycling Performance of a Si on Si Flip Chip Assembly. In
ITHERM 2006, Proceedings of the 10th Intersociety Conference on Thermal and Thermochanical Phenomena in Electronics Systems, San Diego, USA, pp.243-250, DOI:
10.1109/ITERM.2006.1645349.
Dou, G,
Whalley, D, Liu, C, IEEE, (2006)
Mechanical and electrical characterisation of individual ACA conductor particles. In
, 2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, pp.1052-1060, ISBN: 978-1-4244-0833-7.
Chen, K, Liu, C,
Whalley, DC, Hutt, DA (2005)
Stablility of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tin. In
Proceedings of the 7th IEEE CPMT International Symposium on Electronics Materials and Packaging (EMAP), Tokyo, pp.107-111, ISBN: 1-4244-0107-0.
Hutt, DA, Teh, NJ, Sarvar, F,
Whalley, DC, Palmer, PJ, Anderson, P, Kandasubramanian, B, Morris, P, Prosser, S, O'Brien, P (2005)
Overmoulding of Electronics for End-of-Life Recovery. In
Proceedings of the 5th IEEE CPMT International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic), Wroclaw, Poland, p.133, ISBN: 0-7803-9553-0.
Sarvar, F,
Whalley, DC, Hutt, DA, Teh, NJ, Palmer, PJ (2005) Thermal and Thermo-Mechanical Modelling of Polymer Overmoulded Electronics. In
Proceedings of the 11th International Workshop on Thermal Investigations of ICs and Systems, Belgirate, Lake Maggiore, Italy, pp.98-105, ISBN: 2-916187-01-4.
Li, J, Mannan, SH, Clode, MP, Liu, C, Chen, K,
Whalley, DC, Hutt, DA, Conway, PP (2005) Molten Solder Interconnects I: Evaluation of Sn-Bi-X/Cu systems and failure mechanisms of LGA assemblies. In
Proceedings of The International Conference on High Temperature Electronics, Paris, France.
Chen, K, Li, J, Liu, C,
Whalley, DC, Hutt, DA, Conway, PP, Mannan, SH, Clode, MP, Lobato, HM (2005) Molten Solder Interconnects II: Reactions between Ni-P substrates and Sn-Bi based solders. In
Proceedings of The International Conference on High Temperature Electronics, Paris, France.
Li, J, Mannan, SH, Clode, MP, Lobato, HM, Liu, C,
Whalley, DC, Lawrence, FT, Jackson, GJ, Steen, HAH (2005)
Interactions between liquid Sn-Bi based solders and contact metals in high temperature applications. In
Proceedings of the 55th Electronics Components and Technology Conference (ECTC'55), Lake Buena Vista, Fl, USA, pp.441-451.
Hutt, DA,
Whalley, DC, Sarvar, F, Palmer, PJ, Teh, NJ (2004) Overmoulding of electronics with recyclable polymers. In
Lead Free Technologies Conference, SSTC Winter Meeting, NPL, pp.-.
Dou, G,
Whalley, DC, Liu, CC (2004)
Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles. In
Proceedings of the 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC, Binghamton, USA, pp.132-136, ISBN: 0-7803-8744-9.
Dou, G,
Whalley, DC, Liu, C (2004)
Electrical Conductive Characteristics of ACA Bonding: A Review of the Literature, Current Challenges and Future Prospects. In
IEE Catalog No 04EX905C, Proceedings of 6th Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04), Shanghai, China, pp.465-472, ISBN: 0-7803-8621-3.
Sarvar, F, Teh, NJ,
Whalley, DC, Hutt, DA, Palmer, PJ (2004)
Thermo-mechanical Modeling of Polymer Encapsulated Electronics. In
Proceedings of the 9th IEEE I-THERM Conference, Las Vegas, USA, pp.465-472, ISBN: 0-7803-8357-5.
Liu, C, Hendriksen, MW, Hutt, DA, Conway, PP,
Whalley, DC (2004)
Materials and processes issues in fine pitch eutectic solder flip chip interconnection. In
6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP 04), PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), Shanghai, PEOPLES R CHINA, pp.213-220, ISBN: 0-7803-8620-5. DOI:
10.1109/HPD.2004.1346700.
Whalley, DC, Kristiansen, H, Liu, J (2003) Characterisation of Anisotropic Conductive Adhesive Compression During the Assembly Process. In
Proceedings of the IMAPS MicroTech 2003 Microelectronics and Medicine and Polymers for Advanced Microelectronics Conference, Stratford, UK, p.7.
Whalley, DC, Kristiansen, H, Liu, J (2003) Characterisation of anisotropic conductive adhesive compression during the assembly process. In
Proceedings of the ASME InterPack2003 International Electronic Packaging Technical Conference, Maui, Hawaii, USA, pp.183-189, ISBN: 0-7918-3674-6.
Whalley, DC (2002) A Simplified Reflow Soldering Process Model. In
Proceedings of the 9th ISPE International Conference on Concurrent Engineering: Research and Applications, Cranfield, U.K, pp.313-322, ISBN: 90 5809 502 9.
Sarvar, F, Hutt, DA,
Whalley, DC (2002)
Application of Adhesives in MEMS and MOEMS Assembly: A Review. In
Proceedings of the 2nd Int. IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic), Zalaegerszeg, Hungary, pp.22-28, ISBN: 0-7803-7567-X.
Whalley, DC (2002)
Reflow Soldering Process Simulation: A Simplified Model. In
Proceedings of the 25th ISSE Conference, Prague, Czech Republic, pp.323-328, ISBN: 0-7803-9824-6.
Whalley, DC (2002) A Simplified Model of the Reflow Soldering Process. In
Proceedings of the 8th IEEE I-THERM Conference, San Diego, California, USA, pp.84-837, ISBN: 0-7803-7152-6.
Whalley, DC (2002) A Simplified Reflow Soldering Process Model. In
Proceedings of the Seventh Annual Pan Pacific Microelectronics Symposium, Maui'i, Hawaii, pp.220-228.
Whalley, DC (2002)
A simplified model of the reflow soldering process. In Amon, CH, Ramakrishna, K, Sammakia, BG, Subbarayan, G, Sathe, SB, Joshi, YK (ed)
8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS, SAN DIEGO, CA, pp.840-847, ISBN: 0-7803-7152-6. DOI:
10.1109/ITHERM.2002.1012542.
Whalley, DC and Liu, J (2001) Thermal Performance of a System in Package Design Concept. In
Proceedings of APACK 2001 International Conference on Advances in Packaging, Singapore, pp.461-467, ISBN: 981-04-4638-1.
Whalley, DC, Glinsky, G, Bailey, CJ, Liu, J (2001)
Computational Modelling of the Anisotropic Conductive Adhesive Assembly Process. In
Proceedings of the Korea Micro-Joining Association Symposium on Micro-Soldering, Seoul.
Whalley, DC, Glinsky, G, Bailey, CJ, Liu, J (2001) Computational Modelling of the Anisotropic Conductive Adhesive Assembly Process. In
Proceedings of the 3rd International Symposium on Electronics Materials and Packaging, Jeju, Korea, pp.393-398, ISBN: 0-7803-7157-7.
Whalley, DC, Chen, L, Liu, J (2001) Modelling of the Anisotropic Adhesive Assembly Process. In
Proceedings of the Fourth International Symposium on Electronic Packaging Technology, Beijing, pp.319-324, ISBN: 0-7803-9811-4.
Whalley, DC and Hyslop, SM (2001) A Simplified Model of the Reflow Soldering Process. In
InterPACK '01, ASME EEP-Vol. Advances in Electronic Packaging 2001, Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, Kauii, Hawaii,ISBN: 0-7918-3530-8.
Mannan, SH, Wheeler, D, Hutt, DA,
Whalley, DC, Conway, PP, Bailey, C (2000)
Solder Paste Reflow Modeling for Flip Chip Assembly. In
Proceedings of the 3rd Electronics Packaging and Technology Conference (EPTC 2000), IEEE Catalog No. 00EX456, Singapore, pp.103-109, ISBN: 0-7803-6644-1. DOI:
10.1109/EPTC.2000.906357.
Liu, C, Hutt, DA,
Whalley, DC, Conway, PP, Mannan, SH (2000)
Under Bump Metallisation of Fine Pitch Flip-chip Using Electroless Nickel Deposition. In
Proceedings of the International Symposium on Electronic Materials and Packaging 2000 (EMAP2000), IEEE Catalog No 00EX458, Hong Kong, pp.64-71, ISBN: 0-7803-6654-9.
Mannan, SH, Hutt, DA,
Whalley, DC, Conway, PP (2000)
Observations of Solder Paste Reflow by Means of Electrical Measurements. In
Proceedings of the International Symposium on Electronic Materials and Packaging 2000 (EMAP2000), IEEE Catalog No 00EX458, Hong Kong, pp.175-180, ISBN: 0-7803-6654-9.
Hutt, DA, Webb, DP, Hung, KC, Tang, CW, Conway, PP,
Whalley, DC, Chan, YC (2000)
Scanning Acoustic Microscopy Investigation of Engineered Flip-chip Delamination. In
Proceedings of the Twenty-Sixth IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, IEEE Catalog No 00CH37146, Santa Clara, California, USA, pp.191-199.
Whalley, DC (2000)
Low Cost Flip-Chip Assembly. In
IEEE CPMT Switzerland Chapter Seminar on Advanced Packaging, Zurich, Abstract.
Sarvar, F and
Whalley, DC (2000)
IGBT Package Design for High Power Aircraft Electronic Systems. In
Proceedings of the Seventh InterSociety IEEE/ASME Conference on Thermal Phenomena in Electronic Systems, ITHERM-2000, Las Vegas, USA, pp.391-397, ISBN: 0-7803-5912-7.
Sarvar, F and
Whalley, DC (1999) Heatsink design for high power aircraft electronic systems. In
, American Society of Mechanical Engineers, EEP.
Sarvar, F and
Whalley, DC (1999)
Thermal Design of High Power Semiconductor Packages for Aircraft Electronic Systems. In
Proceedings of the IEE Colloquium on Electrical Machines and Systems for the More Electric Aircraft, London, pp.6/1-6/5.
Hutt, DA, Rhodes, DG, Conway, PP, Mannan, SH,
Whalley, DC, Holmes, AS (1999)
Investigation of a Low-Cost Solder Bumping Technique for Flip-Chip Interconnection. In
Proceedings of the Twenty-Fourth IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, Austin, Texas, pp.334-342.
Whalley, DC and Sarvar, F (1999) Thermal Design of High Power Semiconductor Packages for Aircraft Systems, Invited Paper. In
Proceedings of the 1st International Workshop on Electronic Materials and Packaging, Singapore, pp.71-77.
Hutt, DA, Mannan, SH,
Whalley, DC, Conway, PP (1999) A Maskless, Low-Cost, Multi-Chip-Module Assembly Process. In
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, InterPACK '99, Advances in Electronic Packaging 1999, Maui, Hawaii, USA, pp.1705-1711, ISBN: 0-7918-1612-5.
Sarvar, F and
Whalley, DC (1999) Heatsink Design for High Power Aircraft Electronic Systems. In
Proceedings of the Pacific Rim/ASME International Intersociety Electronics and Photonic Packaging Conference, InterPACK '99, Advances in Electronic Packaging 1999, Hawaii, pp.2015-2021, ISBN: 0-7918-1612-5.
Stennett, AD and
Whalley, DC (1998)
Novel Rework Techniques for Electronic Assemblies. In
Proceedings of the 2nd Electronic Packaging Technology Conference, Singapore, pp.196-201, ISBN: 0-7803-5141-X.
Whalley, DC, Watts, JD, Lovelady, M (1998) Solder Jetting. In
Proceedings of the 7th NIST Solder Interconnect Design Team Meeting, Gaithersburg, USA, p.11.
Oguibe, CN, Mannan, SH,
Whalley, DC, Williams, DJ (1998)
Conduction mechanisms in anisotropic conducting adhesive assembly. In
1st IEEE International Symposium on Polymeric Electronics Packaging, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, LOUIS DE GEER CONGRESS CTR, NORRKOPING, SWEDEN, pp.235-242, DOI:
10.1109/95.705469.
Whalley, DC and Hutt, DA (1998) Development of a Low-Cost Flip Chip Assembly Process. In
Proceedings of the 6th NIST Solder Interconnect Design Team Meeting, Gaithersburg, USA, p.9.
Oguibe, CN, Mannan, SH,
Whalley, DC, Williams, DJ (1998) Flip Chip Assembly with Anisotropic Conducting Adhesives: Experimental and Modelling Results. In
Proceedings of the 3rd International Conference on Adhesives Joining and Coating Technology in Electronics Manufacturing, Binghamton, USA, pp.27-33, ISBN: 0-7803-4934-2.
Conway, PP,
Whalley, DC, Wilkinson, M, Williams, DJ (1997)
Automated Adaptive Control of the Reflow Soldering of Electronic Assemblies. In
Proceedings of the 21st IEEE International Electronic Manufacturing Technology Symposium, Austin, Texas, pp.229-236, ISBN: 0-7803-3929-0.
Oguibe, CN, Mannan, SH,
Whalley, DC, Williams, DJ (1997) Conduction Mechanisms in Anisotropic Conducting Adhesive Assemblies. In
Proceedings of the 1st IEEE International Symposium on Polymeric Electronic Packaging, Norrkoping, Sweden, pp.249-258.
Mannan, SH,
Whalley, DC, Ogunjimi, AO, Williams, DJ (1997) Electrical Contact Reliability in Anisotropic Conducting Adhesives Connections for Flip Chip Technology. In
Advances in Electronic Packaging 1997, ASME EEP-Vol 10-1: Proc of the Pacific Rim/ASME Int Intersociety Electronic and Photonic Packaging Conference - INTERpack '97, Hawaii, pp.167-176, ISBN: 0-7918-1559-5.
Whalley, DC and Teo, KC (1997) The Relationship Between Opens and Shorts in Surface Mount Technology. In
Advances in Electronic Packaging 1997, ASME EEP-Vol 10-1: Proc of the Pacific Rim/ASME Int Intersociety Electronic and Photonic Packaging Conference - INTERpack '97, Hawaii, pp.1391-1396, ISBN: 0-7918-1559-5.
Caldicott, AS and
Whalley, DC (1997) Design Analysis of a Forced Water Cooled Heatsink. In
Advances in Electronic Packging 1997, ASME EEP-Vol 10-1: Proc of the Pacific Rim/ASME Int Intersociety Electronic and Photonic Packaging Conference - INTERpack '97, Hawaii, pp.2071-2076, ISBN: 0-7918-1559-5.
Whalley, DC (1997) Adaptive Intelligent Reflow (AIR) Using Infra-Red Thermography. In
Proceedings of the 5th NIST Solder Interconnect Design Team Meeting, Gaithersburg, USA, p.13.
Gustafsson, K, Mannan, SH, Lai, Z, Liu, J,
Whalley, DC, Williams, DJ (1997)
The Effect of Temperature Ramp Rate on Flip-Chip Joint Quality and Reliability Using Anisotropic Conductive Adhesive on FR-4 Substrate. In
Proceedings of the 47th Electronic Components and Technology Conference, San Jose, pp.561-566, ISBN: 0-7803-3857-X.
Whalley, DC (1997) Trends and Challenges in Electronic Packaging and Interconnection. In
Proceedings of the Physics of Packaging Conference, IOP Congress, Leeds, p.144.
Whalley, DC, Mannan, SH, Williams, DJ, Ogunjimi, AO, Watts, JD (1997) Anisotropic Conducting Adhesives for Flip-Chip Assembly. In
Proceedings of the ISHM European MCM Conference, Heathrow, p.10.
Whalley, DC (1996) The Effect of Solder Volume on Opens and Shorts. In
Proceedings of the NPL SSTC Summer Meeting, London, p.2.
Ogunjimi, AO, Mannan, SH,
Whalley, DC, Williams, DJ (1996) Assembly of Planar Array Components Using Anisotropic Conducting Adhesives - a Benchmark Study. In
Proceedings of Adhesives in Electronics '96, Stockholm, pp.270-284.
Ogunjimi, AO, Mannan, SH,
Whalley, DC, Williams, DJ (1995)
The assembly process for anisotropic conductive joints - Some new experimental and theoretical results. In
International Seminar on Latest Achievements in Conductive Joining in Electronics Packaging, JOURNAL OF ELECTRONICS MANUFACTURING, PHILIPS, NETHERLANDS, pp.263-271, DOI:
10.1142/S096031319500027X.
Ogunjimi, AO, Mannan, SH,
Whalley, DC, Williams, DJ (1995) The Assembly Process for Anisotropic Conductive Joints - Some New Experimental and Theoretical Results. In
Proceedings of the Third International Seminar on Conductive Adhesives in Electronics Packaging - Latest Achievements in Conductive Adhesive Joining in Electronics Packaging, Eindhoven, pp.135-143.
Whalley, DC, Conway, PP, Sarvar, F, Kalantary, MR (1995) The Globule Block Wetting Balance Test. In
INTERpack '95, Proceedings of the International Intersociety Electronic Packaging Conference, Hawaii, pp.89-94.
Mannan, SH,
Whalley, DC, Ogunjimi, AO, Williams, DJ (1995)
Modelling of the Initial Stages of the Anisotropic Adhesive Joint Assembly Process. In
Proceedings of 1995 Japan International Electronic Manufacturing Symposium, Japan, pp.142-145.
Goward, JM,
Whalley, DC, Williams, DJ (1994) Conducting adhesives for high density interconnection. In
Proceedings of the 2nd IEE Symposium on Interconnection Technology, London, pp.1-4.
Whalley, DC, Conway, PP, Sarvar, F, Williams, DJ (1994) Modelling of Solder Joint Geometry for Quality and Reliability. In
Proceedings of the European Surface Mount Conference, Brighton, pp.C5.1-8.
Sarvar, F, Kalantary, MR, Conway, PP, Williams, DJ,
Whalley, DC (1994) Effects of Ground Planes and Tracks on the Simulation of the Reflow Process for Surface Mount Technology. In
Proceedings of the First International Symposium on Microelectronic Package and PCB Technology, Beijing, pp.35-40.
Goward, JM, Williams, DJ,
Whalley, DC (1994) Understanding Anisotropic Conducting Adhesives Behaviour. In
Proceedings of the Conference on Surface Mount International, San Jose, CA, pp.303-312.
Kalantary, MR, Sarvar, F, Conway, PP, Williams, DJ,
Whalley, DC (1994) Understanding the Interaction Between Solder Pastes and the Soldering Process. In
Proceedings of the ISHM International Conference on Electronics Technologies, Windsor, pp.123-130.
Williams, DJ,
Whalley, DC, Ogunjimi, AO, Goward, JM (1993) Leitkleber - eine Alternative zum Loten. In
Proceedings of Productronica '93, Flexible Produktionssysteme fur Innovative Electronik, Munich, pp.119-125.
Goward, JM, Williams, DJ,
Whalley, DC (1993) Properties of Anisotropic Conductive Adhesive Pastes for Fine Pitch Surface Mount Technology. In
Proceedings of IVF International Seminar on Recent Advances in Conductive Adhesive Joining Technology in Electronic Manufacturing, Gothenburg, pp.1-18.
Boyle, OA,
Whalley, DC, Williams, DJ (1993) Environmental Performance of Conductive Adhesive Joints. In ISHM, (ed)
Proceedings of the 9th ISHM European Hybrid Microelectronics Conference, Nice, pp.75-82.
Ogunjimi, AO,
Whalley, DC, Williams, DJ (1993)
A Comparison of Modelling Methods for Electronic Interconnect Structures. In
43rd IEEE Electronic Components Technology Conference, Proceedings of the 43rd IEEE Electronic Components Technology Conference, Orlando, pp.871-876.
Ogunjimi, AO,
Whalley, DC, Williams, DJ (1993)
Thermal Stress Analysis of Conductive Adhesive Joints. In IEEE, (ed)
Proceedings of the IEEE Japan International Electronic Manufacturing Technology Symposium, Kanazawa, pp.349-353.
Whalley, DC, Conway, PP, Williams, DJ (1993) A Process Model of the Infra-red Reflow Soldering of Printed Circuit Assemblies. In
IEE Colloquium on CAD Tools for Thermal Management, CAD Tools for Thermal Management, London, pp.3/1-3/3.
Whalley, DC and Chambers, DJ (1992) Thermal and Mechanical Modelling of Electronic Interconnects for the Automotive Environment. In Smith, JRE (ed)
Mathematics in the Automotive Industry, IMA Conference on Mathematics in the Automotive Industry, University of Warwick, pp.283-297.
Ogunjimi, AO,
Whalley, DC, Williams, DJ (1992) The Influence of Adhesive Matrix and Curing Temperature and Residual Stresses in Conductive Adhesive Joints. In
AEI/IEEE 6th Conference on Interconnection Technologies for Extreme Integration: Fine Pitch and Beyond, Proceedings of AEI/IEEE 6th Conference on Interconnection Technologies for Extreme Integration: Fine Pitch and Beyond, Milan, pp.115-128.
Boyle, O,
Whalley, DC, Williams, DJ (1992) A Study of Process Parameters Involved in the Manufacture of Conductive Adhesive Joints. In Norlyng, SEAE (ed)
30th ISHM Nordic Conference, Proceedings of the ISHM Nordic Conference, Obusgaard Hotel, Oslo, Norway, pp.138-149.
Williams, DJ, Conway, PP,
Whalley, DC (1992) Invited Keynote - Challenges in the Manufacture of Electronic Products. In Eyada, K, O, Ahmad, eds, MM (ed)
2nd FAIM Conference, Virginia, pp.47-58.
WILLIAMS, D, CONWAY, P,
WHALLEY, D (1992) CHALLENGES IN THE MANUFACTURE OF ELECTRONIC PRODUCTS. In Eyada, OK and Ahmad, MM (ed)
2ND INTERNATIONAL CONF ON FLEXIBLE AUTOMATION AND INFORMATION MANAGEMENT ( FAIM 92 ), FLEXIBLE AUTOMATION AND INFORMATION MANAGEMENT 1992, FALLS CHURCH, VA, pp.47-58, ISBN: 0-8493-0138-6.
Whalley, DC and Chambers, DJ (1992) Thermal and mechanical modelling of electronic interconnects for the automotive environment. In
IMA Conference on Mathematics in the Automotive Industry, Mathematics in the Automotive Industry, Warwick, pp.283-297, ISBN: 0-19-853660-7.
Hartless, PCM and
Whalley, DC (1991) Automated Thermographic Inspection of Surface Mount Solder Joints. In
8th International Conference on Automotive Electronics, Proceedings of the 8th International Conference on Automotive Electronics, London, pp.178-181.
Whalley, DC, Conway, PP, Ogunjimi, AO, Williams, DJ (1991)
A Process Model of the Infra-red Reflow Soldering of Printed Circuit Board Assemblies. In
11th International IEEE CHMT International Electronic Manufacturing Technology Symposium Conference, Proceedings of the 11th International IEEE IEMTS Conference, San Francisco, USA, pp.122-125.
Whalley, DC (1991) Reliability Prediction Tools for SMD Solder Joints. In
BABS 6th International Conference: High Technology Joining, Proceedings of BABS 6th International Conference: High Technology Joining, Stratford-upon-Avon, Paper 19.
Whalley, DC (1991) Process Modelling of Infra-Red Relow Soldering. In
TWI/BABS Seminar on the Metallurgy of Soldered Joints in Electronic Assemblies, Proceedings of the TWI/BABS Seminar on the Metallurgy of Soldered Joints in Electronic Assemblies, London, UK.
Conway, PP, Williams, DJ,
Whalley, DC (1991) Joint-Level Thermal Modelling of Infra Red Reflow for Different Termination Geometries. In
Proceedings of the 1st Joint International Conference on Factory Automation and Information Management, Limerick, Ireland, pp.219-228.
Conway, PP, Williams, DJ,
Whalley, DC (1990) Experiments to Allow the Interpretation of a Computer Based Model of the Solder Paste Reflow Process. In
Proceedings of the 6th International Conference on Computer Aided Production Engineering, London, pp.481-489.
Whalley, DC, Williams, DJ, Conway, PP (1990) The Development of a Thermal Model of the Infra Red Reflow Soldering of Electronic Assemblies. In
IDEAS-CAEDS Users Conference, Proceedings of the IDEAS-CAEDS Users Conference, London, pp.9-19.
Tang, ACT,
Whalley, DC, Williams, DJ (1990)
Tailoring Thermal Profiles for the Reflow of SMD Assemblies. In
9th IEEE CHMT International Electronic Manufacturing Technology Symposium, Proceedings of the 9th IEEE International Electronic Manufacturing Technology Symposium, Washington, USA, pp.77-81.
Conway, PP, Williams, DJ, Tang, ACT, Sargent, PM,
Whalley, DC (1990) Process Variables in the Reflow Soldering of Surface Mount. In
8th IEEE CHMT International Electronic Manufacturing Technology Symposium, Proceedings of the 8th IEEE CHMT Symposium, IEEE Cat.No. 90CH2833-2, Library of Congress No. 89-82530, Stresa, Italy, pp.385-394.
Whalley, DC, Conway, PP, Williams, DJ (1990) Thermal Modelling of Temperature Development During the Reflow Soldering of SMD Assemblies. In
Proceedings of the 6th International Microelectronics Conference, Tokyo, Japan, pp.120-124.
Whalley, DC and Chambers, DJ (1989) Evaluation of SMD solder joints using finite element analysis. In
7th ISHM European Hybrid Microelectronics Conference, Proceedings of the 7th ISHM European Hybrid Microelectronics Conference, Hamburg, pp.1.1.1-1.1.8.
