Journal Articles

Chen, Y, Liu, C, Zhou, Z, Liu, C (2022) Transient liquid phase bonding with Ga-based alloys for electronics interconnections, Journal of Manufacturing Processes, 84, pp.1310-1319, ISSN: 1526-6125. DOI: 10.1016/j.jmapro.2022.11.005.

Liang, S, Zhong, Y, Robertson, S, Liu, A, Jiang, H, Liu, C, Zhou, Z, Liu, C (2022) Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding, Microelectronics Reliability, 138, 114654, ISSN: 0026-2714. DOI: 10.1016/j.microrel.2022.114654.

Liu, C, Liu, A, Jiang, H, Liang, S, Zhou, Z, Liu, C (2022) Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging, Microelectronics Reliability, 138, 114688, ISSN: 0026-2714. DOI: 10.1016/j.microrel.2022.114688.

Su, Y, Fu, G, Liu, C, Liu, C, Long, X (2021) Fatigue crack evolution and effect analysis of Ag sintering die-attachment in SiC power devices under power cycling based on phase-field simulation, Microelectronics Reliability, 126, ISSN: 0026-2714. DOI: 10.1016/j.microrel.2021.114244.

Conferences

Chen, Y, Liang, S, Liu, C, Liu, C, Zhou, Z (2021) Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding. In , 2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021, pp.451-459, ISBN: 9781665416191. DOI: 10.1109/EPTC53413.2021.9663953.

Thesis/Dissertation

Liu, C (2022) Advanced Pb-free interconnect materials and manufacture processes to enable high-temperature electronics packaging.