Journal Articles
Bournias-Varotsis, A,
Wang, S, Hutt, D, Engstrom, D (2018)
The effect of ultrasonic additive manufacturing on integrated printed electronic conductors,
Electronic Materials Letters, ISSN: 1738-8090. DOI:
10.1007/s13391-018-0053-y.
Gao, Y, Fang, X, Cheng, Z, Xu, L, Lu, Z,
Wang, S (2015)
Exothermic effects and related surface properties of the ex situ presulfurized catalysts in fabrication and activation,
Journal of Industrial and Engineering Chemistry, 26, pp.202-209, ISSN: 1226-086X. DOI:
10.1016/j.jiec.2014.11.030.
Tong, Y, Lin, Y,
Wang, S, Song, M (2015)
A study of crystallisation of poly (ethylene oxide) and polypropylene on graphene surface,
Polymer, ISSN: 0032-3861. DOI:
10.1016/j.polymer.2015.07.025.
Conferences
Hutt, D, Coggrave, C, Whalley, D, Riches, S, Cannon, K, Wu, K,
Wang, S, Jones, L, Tyrer, J, Wise, R (2019)
Additive Manufacture of Interconnects with Copper Filled Adhesives and Pastes. In
IMAPS MicroTech 2019 Annual Conference ”Power in Packaging”, Cambridge.
Wang, S, Hutt, D, Whalley, D, Critchlow, G (2018) An Evaluation of the Electrical Stability of Copper Filled Isotropic Conductive Adhesives in High Moisture Environments. In
Electronics Packaging Technology Conference, Singapore.
