Loughborough University
Leicestershire, UK
LE11 3TU
+44 (0)1509 263171
Loughborough University

Loughborough University Research Publications


Publications for Paul Conway

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Journal Articles

Ghanizadeh, Peiris, TA, Hutt, D, Jayathilake, S, Wijayantha Kahagala Gamage, Southee, DJ, Conway, P, Marchand, P, Darr, JA, Parkin, I, Carmalt, C Dispersion and microwave processing of nano-sized ITO powder for the fabrication of transparent conductive oxides, Ceramics International, ISSN: 1873-3956. DOI: 10.1016/j.ceramint.2016.08.157.

Sharpe, R, Van Lopik, K, Neal, AD, Goodall, P, Conway, P, West, A (Accepted for publication) An industrial evaluation of an Industry 4.0 reference architecture demonstrating the need for the inclusion of security and human components, Computers in Industry.

Liu, J, Huang, Z, Zhang, Y, Conway, PP (Accepted for publication) Mechanisms of Copper Protrusion in Through-silicon-via Structures at the Nanoscale, Japanese Journal of Applied Physics, ISSN: 0021-4922.

Neal, AD, Sharpe, RG, Conway, PP, West, AA (Accepted for publication) smaRTI—A cyber-physical intelligent container for industry 4.0 manufacturing, Journal of Manufacturing Systems, 52, pp.63-75, ISSN: 0278-6125. DOI: 10.1016/j.jmsy.2019.04.011.

Pantazis, D, Goodall, P, Conway, PP, West, AA (2019) An automated feature extraction method with application to empirical model development from machining power data, Mechanical Systems and Signal Processing, 124, pp.21-35, ISSN: 1096-1216. DOI: 10.1016/j.ymssp.2019.01.023.

Pease, SG, conway, PP, west, AA (2018) An intelligent real-time cyber-physical toolset for energy and process prediction and optimisation in the future industrial Internet of Things, Future Generation Computer Systems, DOI: 10.1016/j.future.2017.09.026.

Sharpe, R, Goodall, P, Neal, A, Conway, P, West, A (2018) Cyber-Physical Systems in the re-use, refurbishment and recycling of Used Electrical and Electronic Equipment, Journal of Cleaner Production.

Pease, SG, Conway, PP, West, AA (2017) Hybrid ToF and RSSI Real-Time Semantic Tracking with an Adaptive Industrial Internet of Things Architecture, Journal of Network and Computer Applications, DOI: 10.1016/j.jnca.2017.10.010.

Torres-Sanchez, C, Conway, P, yendall, Mushref, F, Norrito, M, Liu, Y (2017) The effect of pore size and porosity on mechanical properties and biological response of porous titanium scaffolds, Materials Science and Engineering C, 77, pp.219-228, ISSN: 0928-4931. Full text: http://doi.org/10.1016/j.msec.2017.03.249. DOI: 10.1016/j.msec.2017.03.249.

Peiris, N, Ghanizadeh, S, Jayathilake, DSY, Hutt, DA, Wijayantha Kahagala Gamage, U, Conway, PP, Southee, DJ, Parkin, IP, Marchand, P, Darr, JA, Carmalt, CJ (2016) Aerosol-assisted fabrication of tin-doped indium oxide ceramic thin films from nanoparticle suspensions, Journal of Materials Chemistry C, pp.1-8, ISSN: 2050-7534. DOI: 10.1039/c6tc00812g.

Segura Velandia, DM, Kaur, N, Whittow, WG, Conway, PP, West, AA (2016) Towards industrial internet of things: Crankshaft monitoring, traceability and tracking using RFID, Robotics and Computer-Integrated Manufacturing, 41, pp.66-77, ISSN: 0736-5845. DOI: 10.1016/j.rcim.2016.02.004.

Graham, I, Goodall, P, Peng, Y, Palmer, C, West, A, Conway, P, Mascolo, JE, Dettmer, FU (2015) Performance measurement and KPIs for remanufacturing, Journal of Remanufacturing, 5(1), 10, DOI: 10.1186/s13243-015-0019-2.

Goodall, P, Graham, I, Harding, J, Conway, P, Schleyer, S, West, A (2015) Cost estimation for remanufacture with limited and uncertain information using case based reasoning, Journal of Remanufacturing, 5(1), 7, DOI: 10.1186/s13243-015-0013-8.

Liu, Y, Santaniello, T, yan, Y, Tocchio, A, Martello, F, Gassa, F, Webb, P, Zhao, W, Tamplenizza, M, Schulte, C, Hutt, D, Milani, P, Conway, P, Lenardi, C (2015) On-chip single cell funneling operated by microfabricated thermo-responsive hydrogel layers, Journal of Micromechanics and Microengineering, 25(7), ISSN: 1361-6439. DOI: 10.1088/0960-1317/25/7/075004.

Mirgkizoudi, M, Liu, C, Conway, P (2015) Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions, Microelectronics Reliability.

Xiong, H, Huang, Z, Conway, P (2014) Effects of Stress and Electromigration on Microstructural Evolution in Microbumps of Three-Dimensional Integrated Circuits, IEEE Transactions on Device and Materials Reliability, 14(4), pp.995-1004, ISSN: 1530-4388. DOI: 10.1109/tdmr.2014.2356714.

Huang, Z, Xiong, H, Wu, Z, Conway, P, Davies, H, Dinsdale, A, En, Y, Zeng, Q (2014) Microstructure-based multiphysics modeling for semiconductor integration and packaging, CHINESE SCIENCE BULLETIN, 59(15), pp.1696-1708, ISSN: 1001-6538. DOI: 10.1007/s11434-013-0103-7.

Xiong, H, Huang, Z, Conway, P (2014) A method for quantification of the effects of size and geometry on the microstructure of miniature interconnects, Journal of Electronic Materials, 43(2), pp.618-629, ISSN: 0361-5235. DOI: 10.1007/s11664-013-2907-2.

Wu, Z, Huang, Z, Ma, Y, Xiong, H, Conway, PP (2014) Effects of the Microstructure of Copper Through-Silicon Vias on their Thermally Induced Linear Elastic Mechanical Behavior, ELECTRONIC MATERIALS LETTERS, 10(1), pp.281-292, ISSN: 1738-8090. DOI: 10.1007/s13391-013-3053-y.

Xiong, H, Huang, Z, Conway, P (2013) Size and geometry effects on microstructural evolution in Sn microbumps during isothermal aging, Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, pp.466-471, DOI: 10.1109/EPTC.2013.6745764.

Chakravorti, N, Conway, PP, West, AA, Slawson, SE (2013) A novel instrumented cycle ergometer with automated in-situ capabilities, Proceedings - 2013 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2013, pp.1599-1604, DOI: 10.1109/SMC.2013.276.

Huang, Z, Xiong, H, Wu, Z, Conway, P, Altmann, F (2013) Multiscale microstructures and microstructural effects on the reliability of microbumps in three-dimensional integration, Materials, 6(10), pp.4707-4736, DOI: 10.3390/ma6104707.

Le Sage, T, Conway, P, Cossor, J, Slawson, S, West, A (2013) A wireless sensor system for monitoring the performance of a swimmer's tumble turn, PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART P-JOURNAL OF SPORTS ENGINEERING AND TECHNOLOGY, 227(3), pp.161-171, ISSN: 1754-3371. DOI: 10.1177/1754337112467881.

Le Sage, T, Conway, P, Slawson, S, West, A (2013) Development of a wireless sensor network for use as an automated system for monitoring swimming starts, PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART P-JOURNAL OF SPORTS ENGINEERING AND TECHNOLOGY, 227(3), pp.184-195, ISSN: 1754-3371. DOI: 10.1177/1754337112462945.

Mirgkizoudi, M, Liu, C, Conway, PP, Riches, S (2013) Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics, Journal of Microelectronics an Electronic Package, 10(2), pp.80-88, ISSN: 1551-4897.

Liu, J, Liu, C, Conway, PP (2013) Kinetic Monte Carlo simulation of the electrodeposition of polycrystalline copper: Effects of substrates and deposition parameters on the microstructure of deposits, Electrochimica Acta, 97, pp.132-142, ISSN: 0013-4686. DOI: 10.1016/j.electacta.2013.02.112.

Huertas, LA, Rosamond, EL, Conway, PP, West, AA (2013) Sustainable production in the UK: a tool to support printed circuit assembly (PCA) manufacturing, INTERNATIONAL JOURNAL OF COMPUTER INTEGRATED MANUFACTURING, 26(4), pp.346-364, ISSN: 0951-192X. DOI: 10.1080/0951192X.2012.717719.

Chakravorti, N, Le Sage, T, Slawson, SE, Conway, PP, West, AA (2013) Design and Implementation of an Integrated Performance Monitoring Tool for Swimming to Extract Stroke Information at Real Time, IEEE TRANSACTIONS ON HUMAN-MACHINE SYSTEMS, 43(2), pp.199-213, ISSN: 2168-2291. DOI: 10.1109/TSMC.2012.2235428.

Lugo, H, Segura, D, Michopoulos, V, Conway, P, West, A (2013) Secure document and asset tracking, Journal of Communications Software and Systems, 9(1), pp.24-34, ISSN: 1845-6421. DOI: 10.24138/jcomss.v9i1.155.

Slawson, SE, Conway, PP, Cossor, J, Chakravorti, N, West, AA (2013) The categorisation of swimming start performance with reference to force generation on the main block and footrest components of the Omega OSB11 start blocks, Journal of Sports Sciences, 31(5), pp.468-478, ISSN: 0264-0414. DOI: 10.1080/02640414.2012.736631.

Wu, Z, Huang, Z, Xiong, H, Conway, PP, Liu, C (2013) Linkages between microstructure and mechanical properties of ultrafine interconnects, Journal of Electronic Materials, 42(2), pp.263-271, ISSN: 0361-5235. DOI: 10.1007/s11664-012-2201-8.

Wu, Z, Huang, Z, Conway, P, Qingfeng Zeng, (2012) An atomistic scale study on solidification in ultrafine interconnects, 14th International Conference on Electronic Materials and Packaging, EMAP 2012, DOI: 10.1109/EMAP.2012.6507903.

Xiong, H, Huang, Z, Conway, P, Zeng, Q (2012) Effects of microstructure on vacancy and stress distributions in micro joints under current stressing, 14th International Conference on Electronic Materials and Packaging, EMAP 2012, DOI: 10.1109/EMAP.2012.6507913.

Mirgkizoudi, M, Liu, C, Conway, P, Riches, S (2012) Combined temperature and vibration testing for wire bond interconnections in harsh environment electronics, Proceedings - IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2012, pp.335-344.

Lugo, H, Velandia, DMS, Conway, PP, Bindel, A, West, AA (2012) Secure document and asset tracking, 2012 20th International Conference on Software, Telecommunications and Computer Networks, SoftCOM 2012.

Zakariyah, SS, Conway, PP, Hutt, DA, Wang, K, Selviah, DR (2012) CO2 laser micromachining of optical waveguides for interconnection on circuit boards, OPTICS AND LASERS IN ENGINEERING, 50(12), pp.1752-1756, ISSN: 0143-8166. DOI: 10.1016/j.optlaseng.2012.07.005.

Bindel, A, Conway, PP, West, AA (2012) Information structure required for life-cycle monitoring of electronic products, Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 226(10), pp.1612-1627, ISSN: 0954-4054. DOI: 10.1177/0954405412444195.

Slawson, SE, Chakravorti, N, Conway, PP, Cossor, J, West, AA (2012) The effect of knee angle on force production, in swimming starts, using the OSB11 Block, Procedia Engineering, 34, pp.801-806, DOI: 10.1016/j.proeng.2012.04.137.

Bindel, A, Rosamond, E, Conway, P, West, A (2012) Product life cycle information management in the electronics supply chain, PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE, 226(B8), pp.1388-1400, ISSN: 0954-4054. DOI: 10.1177/0954405412448780.

Conway, PP, Bhatt, D, Hutt, DA (2012) Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects, Applied Physics B: lasers and optics, 108(4), Full text: http://www.springerlink.com/. DOI: 10.1007/s00340-012-5106-6.

Conway, PP, Bhatt, D, Hutt, DA (2012) Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects, Applied Physics B: lasers and optics, 108(4), Full text: http://www.springerlink.com/. DOI: 10.1007/s00340-012-5106-6.

Cui, X, Hutt, DA, Conway, PP (2012) Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate, Thin Solid Films, 520(19), pp.6095-6099, ISSN: 0040-6090. DOI: 10.1016/j.tsf.2012.05.068.

Chakravorti, N, Slawson, SE, Cossor, J, Conway, PP, West, AA (2012) Image processing algorithms to extract swimming tumble turn signatures in real-time, Proceedings of the Mediterranean Electrotechnical Conference - MELECON, pp.352-355, DOI: 10.1109/MELCON.2012.6196447.

Zakariyah, S, Conway, PP, Hutt, DA, Suyal, N, Selviah, DR (2012) Integrated in-plane mirror and multimode waveguide fabrication using 248nm excimer laser ablation for optical interconnects on PCBs, Circuit World, 38(2), pp.59-63, ISSN: 0305-6120. DOI: 10.1108/03056121211222255.

Le Sage, T, Bindel, A, Conway, P, Justham, L, Slawson, S, Webster, J, West, A (2012) A multi-sensor system for monitoring the performance of elite swimmers, Communications in Computer and Information Science, 222 CCIS, pp.350-362, ISSN: 1865-0929. DOI: 10.1007/978-3-642-25206-8_23.

Slawson, SE, Justham, LM, Conway, PP, Le-Sage, T, West, AA (2012) Characterizing the swimming tumble turn using acceleration data, Proceedings of the Institution of Mechanical Engineers, Part P: Journal of Sports Engineering and Technology, 226(1), pp.3-15, ISSN: 1754-3371. DOI: 10.1177/1754337111428395.

Flaherty, OM, Cui, X, Rajamohan, D, Hutt, D, Denning, C, Conway, PP, West, AA (2012) A multi-electrode array (MEA) biochip with excimer laser-produced micro-well features, Circuit World, 38(1), pp.30-37, ISSN: 0305-6120. DOI: 10.1108/03056121211195030.

Flaherty, OM, Cui, X, Rajamohan, D, Anderson, D, Hutt, D, Denning, C, Conway, PP, West, AA (2011) Fabrication of a novel Multi-Electrode Array (MEA) biochip using polyester insulated electrodes with microwell features for cardiomyocyte analysis, EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings.

Zakariyah, SS, Conway, PP, Hutt, DA, Selviah, DR, Wang, K, Rygate, J, Calver, J, Kandulski, W (2011) Fabrication of polymer waveguides by laser ablation using a 355 nm wavelength Nd:YAG laser, Journal of Lightwave Technology, 29(23), pp.3566-3576, ISSN: 0733-8724. DOI: 10.1109/JLT.2011.2171318.

Lugo, H, Viret, J, Bindel, A, Conway, P, West, A (2011) Distributed monitoring system for material handling, 2011 International Conference on Software, Telecommunications and Computer Networks, SoftCOM 2011, pp.87-92.

mullane, S, chakravorti, N, Conway, PP, west, A (2011) Design and implementation of a user-centric swimming performance monitoring tool, Proc IMechE Part P: J Sports engineering and Technology, 225(4), pp.213-229, ISSN: 1754-3371. DOI: 10.1177/1754337111405271.

Le Sage, T, Bindel, A, Conway, P, Slawson, S, West, A (2011) Development of a wireless sensor network for embedded monitoring of human motion in a Harsh environment, 2011 IEEE 3rd International Conference on Communication Software and Networks, ICCSN 2011, pp.112-115, DOI: 10.1109/ICCSN.2011.6013555.

Le Sage, T, Bindel, A, Conway, PP, Justham, LM, Slawson, SE, West, AA (2011) Embedded programming and real-time signal processing of swimming strokes, Sports Engineering, 14(1), pp.1-14, ISSN: 1369-7072. DOI: 10.1007/s12283-011-0070-7.

Segura Velandia, DM, West, AA, Conway, PP (2011) A database system for decision support in low-volume electronics assembly, Proceedings of the Institution of Mechanical Engineers Part B: Journal of Engineering Manufacture, 225(8), pp.1411-1430, ISSN: 0954-4054. DOI: 10.1177/2041297510393566.

slawson, S, Cossor, J, Conway, PP, Chakravorti, N, LeSage, T, West, AA (2011) The effect of start block configuration and swimmer kinematics on starting performance in elite swimmers using the Omega OSB11 block, Procedia engineering, 13, pp.141-147, DOI: 10.1016/j.proeng.2011.05.064.

Huertas-Quintero, LAM, Conway, PP, Segura-Velandia, DM, West, AA (2011) Root cause analysis support for quality improvement in electronics manufacturing, ASSEMBLY AUTOMATION, 31(1), pp.38-46, ISSN: 0144-5154. DOI: 10.1108/01445151111104155.

Cui, X, Hutt, DA, Scurr, DJ, Conway, PP (2011) The Evolution of Pd/Sn Catalytic Surfaces in Electroless Copper Deposition, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 158(3), pp.D172-D177, ISSN: 0013-4651. DOI: 10.1149/1.3536543.

Xiong, H, Huang, Z, Wua, Z, Conway, PP (2011) A generalised computational interface for combined thermodynamic and kinetic modeling, CALPHAD: Computer Coupling of Phase Diagrams and Thermochemistry, 35, pp.391-395.

Segura Velandia, DM, Conway, PP, Pourtafreshi Monfared, R, West, AA (2011) Combining business process and failure modelling to increase yield in electronics manufacturing, Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, p.18, ISSN: 2041-2975. Full text: http://dx.doi.org/10.1243/09544054JEM1794. DOI: 10.1243/09544054JEM1794.

Le Sage, T, Conway, P, Justham, L, Slawson, S, Bindel, A, West, A (2010) A component based integrated system for signal processing of swimming performance, SIGMAP 2010 - Proceedings of the International Conference on Signal Processing and Multimedia Applications, pp.73-79.

Knauf, BJ, Webb, DP, Liu, CC, Conway, PP (2010) Low frequency induction heating for the sealing of plastic microfluidic systems, Microfluidics and Nanofluidics, 9(Issue 2-3), pp.243-252, ISSN: 1613-4990. DOI: 10.1007/s10404-009-0539-x.

Huertas-Quintero, LAM, Conway, PP, Segura-Velandia, DM, West, AA (2010) A systems integration perspective to manufacturing modelling and simulation: An application tool to support electronics manufacturing systems design, 2010 IEEE International Systems Conference Proceedings, SysCon 2010, pp.415-420, DOI: 10.1109/SYSTEMS.2010.5482347.

Gong, J, Liu, C, Conway, PP, Silberschmidt, VV (2010) Formation of Ag3Sn plates in SnAgCu solder bumps, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 527(10-11), pp.2588-2591, ISSN: 0921-5093. DOI: 10.1016/j.msea.2009.12.020.

Donaldson, DR and Conway, P (2010) Implementing PREMIS: a case study of the Florida Digital Archive, LIBRARY HI TECH, 28(2), pp.273-289, ISSN: 0737-8831. DOI: 10.1108/07378931011047677.

Bindel, A, Conway, PP, Justham, LM, West, AA (2010) New lifecycle monitoring system for electronic manufacturing with embedded wireless components, Circuit World, 36(2), pp.33-39, DOI: 10.1108/03056121011041681.

Webb, DP, Jaggernauth, WA, Cottrill, MCW, Palmer, PJ, West, AA, Conway, PP (2010) Design and construction of large-area flexible printed-circuit automotive electrical interconnection harnesses, Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering, 224(D6), pp.785-797, ISSN: 2041-2991. DOI: 10.1243/09544070JAUTO1175.

Selviah, DR, Walker, AC, Hutt, DA, Conway, PP, Chappell, J, Zakariyah, EASS (2010) Integrated Optical and Electrical Interconnect PCB Manufacturing Research, Circuit World, 36(2), pp.5-10, DOI: 10.1108/03056121011041654.

Hin, TY, Liu, C, Conway, PP, Yu, W, Cargill, S, Desmulliez, MPY (2010) Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithography, IEEE Photonics Technology Letters, 22(13), pp.957-959, ISSN: 1041-1135. DOI: 10.1109/LPT.2010.2048310.

Gong, J, Conway, PP, Liu, CC, Silberschmidt, V (2009) Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy, Journal of Electronic Materials, Vol 38(12), pp.2429-2435, ISSN: 0361-5235. DOI: 10.1007/s11664-009-0941-x.

Liu, J, Liu, C, Conway, PP, Zeng, J, Wang, C (2009) Growth and recrystallization of electroplated copper columns, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, pp.695-700, DOI: 10.1109/ICEPT.2009.5270660.

Webb, DP, Knauf, B, Liu, C, Hutt, D, Conway, P (2009) Productionisation issues for commercialisation of microfluidic based devices, Sensor Review, 29(4), pp.349-354, ISSN: 0260-2288. DOI: 10.1108/02602280910986601.

Huang, Z, Conway, PP, Qin, R (2009) Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections, Microsystem Technologies, 15(1 SPEC. ISS.), pp.101-107, ISSN: 0946-7076. DOI: 10.1007/s00542-008-0629-9.

Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2009) Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate, Scripta Materialia, 60, pp.333-335.

Liu, JJ, Liu, CC, Conway, PP (2009) Kinetic Monte Marlo Simulation of Electrodeposition of Polycrystalline Cu, Electrochemistry Communications, 11(11), pp.131-135, DOI: 10.1016/j.elecom.2009.09.032.

Webb, DP, Knauf, B, Liu, CC, Hutt, DA, Conway, PP (2009) Productionisation issues for commercialisation of microfluidic based devices, Sensor Review, 29(4), pp.349-354, ISSN: 0260-2288. Full text: http://dx.doi.org/10.1108/02602280910986601. DOI: 10.1108/02602280910986601.

Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2009) Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder, Scripta Materialia, 61(7), pp.682-685, DOI: 10.1016/J.scriptamat.2009.05.034.

Liu, J, Liu, CC, Conway, PP (2009) Kinetic Monte Carlo Simulation of Kinetically-limited Copper Electro-crystallisation on an Atomically Even Surface, Electrochimica Acta, 54(27), pp.6941-6948, DOI: 10.1016/j.electacta.2009.07.019.

Hin, TY, Liu, CC, Conway, PP (2009) Surface characterisation of plasma treated flexible substrates for waveguide-on-flex application, Surface and Coatings Technology, 203, pp.3741-3749, DOI: 10.1016/j.surfcoat.2009.06.015.

Webb, DP, Hutt, DA, Hopkinson, N, Conway, PP, Palmer, PJ (2009) Packaging of microfluidic devices for fluid interconnection using thermoplastics, Journal of Microelectromechanical Systems, 18(2), pp.354-362, ISSN: 1057-7157. Full text: http://dx.doi.org/10.1109/JMEMS.2009.2013404. DOI: 10.1109/JMEMS.2009.2013404.

Li, J, Mannan, SH, Clode, MP, Liu, C, Chen, K, Whalley, DC, Hutt, DA, Conway, PP (2008) Interfacial reaction between molten Sn-Bi based solders and electroless Ni-p coatings for liquid solder interconnects, IEEE Transactions on Components and Packaging Technologies, 31(3), pp.574-585, ISSN: 1521-3331. DOI: 10.1109/TCAPT.2008.2001160.

Li, JF, Mannan, SH, Clode, MP, Liu, CC, Chen, K, Whalley, DC, Hutt, DA, Conway, PP (2008) Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects, IEEE Transactions on Components and Packaging Technologies, 31(3), pp.574-585, DOI: 10.1109/TCAPT.2008.2001160.

Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP, Wilson, AR (2008) Integrated simulation tool for quality support in low-volume high-complexity electronics manufacturing domain, International Journal of Production Research, 48(1), pp.45-68, ISSN: 0020-7543. Full text: http://dx.doi.org/10.1080/00207540802427886. DOI: 10.1080/00207540802427886.

Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2008) Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate, Acta Materiala, p.7, ISSN: 1359-6454. Full text: http://dx.doi.org/10.1016/j.actamat.2008.04.063. DOI: 10.1016/j.actamat.2008.04.063.

Selviah, DR, Fernández, FA, Papakonstantinou, I, Wang, K, Bagshiahi, H, Walker, AC, McCarthy, A, Suyal, H, Hutt, DA, Conway, PP, Chappell, J, Zakariyah, SS, Milward, D (2008) Integrated optical and electronic interconnect printed circuit board manufacturing, Circuit World, 34(2), pp.21-26, ISSN: 0305-6120. Full text: http://dx.doi.org/10.1108/03056120810874546. DOI: 10.1108/03056120810874546.

Huang, Z, Conway, PP, Qin, R (2008) Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections, Microsystem Technologies, p.7, ISSN: 1432-1858. Full text: http://dx.doi.org/10.1007/s00542-008-0629-9. DOI: 10.1007/s00542-008-0629-9.

Li, D, Conway, PP, Liu, CC (2008) Corrosion characterization of tin-lead and lead free solders in 3.5 wt.% NaCl solution, Journal of Corrosion Science, 50(4), pp.995-1004, ISSN: 0010-938X. Full text: http://dx.doi.org/10.1016/j.corsci.2007.11.025. DOI: 10.1016/j.corsci.2007.11.025.

Pourtafreshi Monfared, R, West, AA, Vera, DA, Conway, PP (2008) Evaluating a new flexible soldering system for electronics small and medium enterprises, Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 222(2), pp.273-283, ISSN: 0954-4054. Full text: http://dx.doi.org/10.1243/09544054JEM792. DOI: 10.1243/09544054JEM792.

Li, D, Liu, CC, Conway, PP (2008) Reliability of Fine Pitch Sn-3.8AG-0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB, Transactions of the ASME: Journal of Electronic Packaging, Paper 011005, 130(1), p.7, Full text: http://dx.doi.org/10.1115/1.2837522. DOI: 10.1115/1.2837522.

Huang, Z, Conway, PP, Thomson, RC, Dinsdale, AT, Robinson, JAJ (2008) A computational interface for thermodynamic calculations software MTDATA, Journal of Computer Coupling of Phase Diagrams and Thermochemistry (Calphad), 32(1), pp.129-134, ISSN: 0364-5916. Full text: http://dx.doi.org/10.1016/j.calphad.2007.07.003. DOI: 10.1016/j.calphad.2007.07.003.

Vera, DA, Conway, PP, Pourtafreshi Monfared, R, West, AA (2008) Virtual prototyping of flexible soldering cells for electronics manufacture, Proceedings of the IMechE Part B Journal of Engineering Manufacture, 222(6), pp.711-722.

Pourtafreshi Monfared, R, West, AA, Vera, DA, Conway, PP (2008) Evaluating a new flexible soldering system for electronics small and medium enterprises, Proceedings of the IMechE Part B Journal of Engineering Manufacture, 222(2), pp.273-283.

Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2008) Mesomechanical modelling of SnAgCu solder joints in flip chip, Computational Materials Science, 43(1), pp.199-211, ISSN: 0927-0256. Full text: http://dx.doi.org/10.1016/j.commatsci.2007.07.039. DOI: 10.1016/j.commatsci.2007.07.039.

Huang, Z, Conway, PP, Thomson, RC (2007) Microstructural considerations for ultrafine lead free solder joints, Journal of Microelectronics Reliability, 47(12), pp.1997-2006, ISSN: 0026-2714. Full text: http://dx.doi.org/doi:10.1016/j.microrel.2007.04.013. DOI: 10.1016/j.microrel.2007.04.013.

Thomas, RJ, Chandra, A, Liu, Y, Hourd, P, Conway, PP, Williams, DJ (2007) Manufacture of a human mesenchymal stem cell population using an automated cell culture platform, Cytotechnology, 55(1), pp.31-39, ISSN: 0920-9069. Full text: http://dx.doi.org/10.1007/s10616-007-9091-2. DOI: 10.1007/s10616-007-9091-2.

Liu, CC, Huang, Z, Conway, PP, Thomson, RC (2007) Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn¿Pb solder alloys, Journal of Materials Science, 42(11), pp.4076-4086, ISSN: 0022-2461. Full text: http://dx.doi.org/10.1007/s10853-006-1335-6. DOI: 10.1007/s10853-006-1335-6.

Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2007) Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation, Computational Materials Science, 39(1), pp.187-197, Full text: http://dx.doi.org/doi:10.1016/j.commatsci.2006.02.020. DOI: 10.1016/j.commatsci.2006.02.020.

Webb, DP, Liu, CC, Sarvar, F, Conway, PP, Williams, K (2007) Adhesion of Precision Welded Lead-Free Electrical Interconnects Formed by Molten Droplet Deposition, Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 221(2), pp.303-315, ISSN: 0954-4054. Full text: http://dx.doi.org/10.1243/09544054JEM365. DOI: 10.1243/09544054JEM365.

Hutt, DA, Williams, K, Conway, PP, Khoshnaw, FM, Cui, X, Bhatt, D (2007) Challenges in the manufacture of glass substrates for electrical and optical interconnect, CIRCUIT WORLD, 33(1), pp.22-30, ISSN: 0305-6120. DOI: 10.1109/03056120710723689.

Hutt, DA, Williams, K, Conway, PP, Khoshnaw, FM, Cui, X, Bhatt, D (2007) Challenges in the manufacture of glass substrates for electrical and optical interconnect, Circuit World, 33(1), pp.22-30, ISSN: 0305-6120. Full text: http://dx.doi.org/10.1108/03056120710723689. DOI: 10.1108/03056120710723689.

Tan, X, Chen, X, Conway, PP, Yan, XT (2007) Effects of plies assembling textile composite cellular structures, Journal of Materials and Design, 28, pp.857-870, ISSN: 0261-3069. Full text: http://dx.doi.org/10.1016/j.matdes.2005.10.016. DOI: 10.1016/j.matdes.2005.10.016.

Li, D, Liu, C, Conway, PP (2006) Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads, 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06, pp.108-114.

Liu, C, Hendriksen, MW, Hutt, DA, Conway, PP, Whalley, DC (2006) Materials and Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection, IEEE Transactions on Components and Packaging Technologies, 29(4), pp.869-876, ISSN: 1521-3331. Full text: http://dx.doi.org/10.1109/TCAPT.2006.885973. DOI: 10.1109/TCAPT.2006.885973.

Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2006) Modelling of Ag3Sn coarsening and its effect on creep of Sn-Ag eutectics, Journal of Materials Science and Engineering A, 427(1-2), pp.60-68, ISSN: 0921-5093. Full text: http://www.sciencedirect.com/science/article/B6TXD-4K4PSRS-2/2/357080144405d4597e6746a3d2c8d612. DOI: 10.1016/j.msea.2006.04.034.

Li, DZ, Liu, CQ, Conway, PP (2006) Microstructure and shear strength evolution of Sn-Ag-Cu solder bumps during aging at different temperatures, JOURNAL OF ELECTRONIC MATERIALS, 35(3), pp.388-398, ISSN: 0361-5235. DOI: 10.1007/BF02690524.

Li, D, Liu, C, Conway, PP (2006) Microstructure and Shear Strength Evolution of Sn-Ag-Cur Solder Bumps during Aging at Different Temperatures, Journal of Electronic Materials, 35(3), pp.388-398.

Huang, Z, Conway, PP, Liu, C, Thomson, RC (2006) Modeling the interdependence of processing and alloy composition on the evolution of microstructure in Sn-based lead-free solders in fine pitch flip chip, IEEE Transactions on Components and Packaging Technologies, 29(1), pp.98-104, ISSN: 1521-3331. Full text: http://dx.doi.org/10.1109/TCAPT.2005.850538. DOI: 10.1109/TCAPT.2005.850538.

Huang, Z, Conway, PP, Jung, E, Thomson, RC, Liu, C, Loeher, T, Minkus, M (2006) Reliability Issues in Pb-Free Solder Joint Miniaturization, Journal of Electronic Materials, 35(9), pp.1761-1772, ISSN: 0361-5235.

Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2006) Analysis of Stress Distribution in SnAgCu Solder Joint, Applied Mechanics and Materials, 5-6, pp.359-366, ISSN: 1660-9336.

Li, D, Liu, C, Conway, PP (2005) Interfacial reactions between Pb-free solders and metallised substrate surfaces, 2005 6th International Conference on Electronics Packaging Technology, 2005, DOI: 10.1109/ICEPT.2005.1564636.

Tan, X, Conway, PP, Sarvar, F (2005) Thermo-mechanical properties and regression models of alloys: AISI 305, CK 60, CuBe2 and Laiton MS 63, Journal of Materials Processing Technology, 168(1), pp.152-163, ISSN: 0924-0136. Full text: http://dx.doi.org/10.1016/j.jmatprotec.2004.11.011. DOI: 10.1016/j.jmatprotec.2004.11.011.

Li, D, Liu, C, Conway, PP (2005) Solderability of electroless deposited Ni-P coatings with Sn-3.8Ag-0.7Cu and Sn-3.5Ag lead-free solder alloys, Circuit World, 31(3), pp.32-39, ISSN: 0305-6120. DOI: 10.1108/03056120510585054.

Huang, Z, Conway, PP, Liu, C, Thomson, RC (2005) Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping, Journal of Materials Research, 20(3), pp.649-658, ISSN: 0884-2914. Full text: http://dx.doi.org/10.1557/JMR.2005.0078. DOI: 10.1557/JMR.2005.0078.

Li, D, Liu, C, Conway, PP (2005) Solderability of electroless deposited Ni-P coatings with Sn-3.8Ag-0.7Cu and Sn-3.5Ag lead-free solder alloys, Circuit World, 13(3), pp.32-39, ISSN: 0305-6120.

Li, D, Liu, C, Conway, PP (2005) Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects, Materials Science & Engineering A, 391(1-2), pp.95-103, ISSN: 0921-5093. Full text: http://dx.doi.org/10.1016/j.msea.2004.10.007. DOI: 10.1016/j.msea.2004.10.007.

Huang, Z, Conway, PP, Liu, C, Thomson, RC (2004) The effect of microstructural and geometrical features on the reliability of ultrafine flip chip microsolder joints, Journal of Electronic Materials, 33(10), pp.1227-1235, ISSN: 1543-186X. Full text: http://dx.doi.org/10.1007/s11664-004-0126-6. DOI: 10.1007/s11664-004-0126-6.

Liu, C, Conway, PP, Li, D, Hendriksen, M (2004) Analysis of the micro-mechanical properties in aged lead-free, fine pitch flip chip joints, Journal of Electronic Packaging, 126(3), pp.359-366, ISSN: 1043-7398. Full text: http://dx.doi.org/10.1115/1.1773391. DOI: 10.1115/1.1773391.

Webb, DP, Jaggernauth, WA, Cottrill, MCW, West, AA, Conway, PP, Palmer, PJ (2004) Electromagnetic Compatibility Performance of Large Area Flexible Printed Circuit Automotive Harness, Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering, 218(7), pp.667-673, ISSN: 0954-4070. Full text: http://dx.doi.org/10.1243/0954407041580102. DOI: 10.1243/0954407041580102.

Webb, DP, Cottrill, MCW, Jaggernauth, WA, West, AA, Palmer, PJ, Conway, PP (2003) Foresight Vehicle: Physical Media for Automotive Multiplex Networks Implemented on Large Area Flexible Printed Circuit Boards, SAE Transactions 2002: Journal of Passenger Cars - Electronic and Electrical Systems, Paper No 2002-01-1130, pp.638-642, Full text: http://www.sae.org/technical/papers/2002-01-1130 .

Jaggernauth, WA, Webb, DP, Cottrill, MCW, Palmer, PJ, Conway, PP, West, AA (2003) Foresight Vehicle: Specification and Acceptability Criteria for Copper-Clad Dielectric Materials Used in Large Automotive Flexible Printed Circuits, SAE Transactions 2002: Journal of Passenger Cars - Electronic and Electrical Systems, Paper No 2002-01-1129, pp.633-637, Full text: http://www.sae.org/technical/papers/2002-01-1129 .

Carrott, AJ, West, AA, Conway, PP, Cottrill, MCW (2003) Business Case Modelling of Large Area Flexible Circuits in the Foresight Vehicle Program, SAE Transactions 2002: Journal of Passenger Cars - Electronic and Electrical Systems, Paper No 2002-01-1128, pp.627-632.

Cottrill, MCW, Jaggernauth, WA, Webb, DP, Palmer, PJ, Conway, PP, West, AA (2003) Foresight Vehicle: Large Area Flexible Circuits for Automotive Applications Manufacturing Technology, A Review of Process Options, SAE Transactions 2002: Journal of Passenger Cars - Electronic and Electrical Systems, Paper No 2002-01-1127, pp.618-626, Full text: http://www.sae.org/technical/papers/2002-01-1127 .

Yi, S, Whalley, DC, Conway, PP (2003) Foreword, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 26(3), pp.198-199, ISSN: 1521-334X. DOI: 10.1109/TEPM.2003.822298.

Conway, PP, Fu, EK, Williams, K (2002) Precision High Temperature Lead-Free Solder Interconnections by Means of High-Energy Droplet Deposition Techniques, Annals of the CIRP, 51(1), pp.177-180.

Hutt, DA, Liu, C, Conway, PP, Whalley, DC, Mannan, SH (2002) Electroless Nickel Bumping of Aluminium Bondpads. II. Electroless Nickel Plating, IEEE Transactions on Components and Packaging Technologies, 25(1), pp.98-105, ISSN: 1521-3331. Full text: http://dx.doi.org/10.1109/6144.991181. DOI: 10.1109/6144.991181.

Hutt, DA, Liu, C, Conway, PP, Whalley, DC, Mannan, SH (2002) Electroless Nickel Bumping of Aluminium Bondpads. I. Surface Pre-treatment and Activation, IEEE Transactions on Components and Packaging Technologies, 25(1), pp.87-97, ISSN: 1521-3331. Full text: http://dx.doi.org/10.1109/6144.991180. DOI: 10.1109/6144.991180.

Teh, NJ, Conway, PP, Palmer, PJ, Kioul, A, Prosser, S (2001) Statistical Optimisation of Thermoplastic Injection Moulding Process for the Encapsulation of Electronic Subassembly, Journal of Electronics Manufacturing, 10(3), pp.171-179, ISSN: 0960-3131. Full text: http://dx.doi.org/10.1142/S0960313100000150. DOI: 10.1142/S0960313100000150.

Mannan, SH, Hutt, DA, Whalley, DC, Conway, PP (2001) Solder Paste Reflow Modeling for Flip Chip Assembly, TAPtechnology, Third Edition, pp.107-113.

Teh, NJ, Conway, PP, Palmer, PJ, Prosser, S, Kioul, A (2000) Statistical optimisation of thermoplastic injection moulding process for the encapsulation of electronic subassembly, JOURNAL OF ELECTRONICS MANUFACTURING, 10(3), pp.171-179, ISSN: 0960-3131. DOI: 10.1142/S0960313100000150.

Liu, C, Hutt, DA, Whalley, DC, Conway, PP, Mannan, SH (2000) Under Bump Metallisation of Fine Pitch Flip-chip Using Electroless Nickel Deposition, Journal of Electronics Manufacturing, 10(No 3), pp.161-170.

Hutt, DA, Rhodes, DG, Conway, PP, Mannan, SH, Whalley, DC, Holmes, AS (2000) Investigation of a Solder Bumping Technique for Flip-Chip Interconnection, Soldering and Surface Mount Technology, 12(1), pp.7-14, ISSN: 0954-0911.

Conway, PP, Hyslop, SM, Williams, DJ (1999) Development of a Closed-Loop Controlled Reflow Soldering Process, Annals of the CIRP, 48(1), pp.4-8.

Sarvar, F and Conway, PP (1998) Effective modeling of the reflow soldering process: use of a modeling tool for product and process design, IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, 21(3), pp.165-171, ISSN: 1083-4400. DOI: 10.1109/3476.720413.

Sarvar, F and Conway, PP (1998) A Modelling Tool for the Thermal Optimisation of the Reflow Soldering of Printed Circuit Assemblies, Journal of Finite Elements in Analysis and Design, 30(1-2), pp.47-63, ISSN: 0168-874X.

Sarvar, F and Conway, PP (1998) Effective Modelling of the Reflow Soldering Process: Use of a Modelling Tool for Product and Process Design, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part C: Manufacturing, 21(3), pp.165-171, ISSN: 1083-4400.

Sarvar, F and Conway, PP (1998) Effective modeling of the reflow soldering process: Basis, construction, and operation of a process model, IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, 21(2), pp.126-133, ISSN: 1083-4400. DOI: 10.1109/3476.681389.

Sarvar, F and Conway, PP (1998) Effective Modelling of the Reflow Soldering Process: Basis, Construction and Operation of a Process Model, IEEE Transactions on Components, Packaging and Manufacturing Technology Part C: Manufacture, 21(2), pp.126-133, ISSN: 1083-4400.

Conway, P, Whalley, D, Wilkinson, M, Hyslop, SM (1998) The application of in thermography to process monitoring and control of reflow soldering, SOLDERING & SURFACE MOUNT TECHNOLOGY, 10(1), pp.13-+, ISSN: 0954-0911. DOI: 10.1108/09540919810203766.

Conway, PP, Whalley, DC, Wilkinson, M, Hyslop, SM (1998) The Application of IR Thermography to Process Monitoring and Control of Reflow Soldering, Soldering and Surface Mount Technology, 10(1), pp.13-18, ISSN: 0954-0911.

Tilley, KJ, Williams, DJ, Conway, PP (1997) Development and R&D capability at manufacturing sites: Electronics multi-nationals in Singapore and Taiwan, Production and Operations Management, 6(2), pp.131-149, ISSN: 1059-1478.

Conway, PP (1997) Adaptive Intelligent Reflow Closes the Production Control Loop, Electronics Manufacturing Products, p.18.

Conway, PP (1997) Simulation Improves Reflow Yield, Electronics Manufacturing Products, pp.10-11.

Tilley, KJ, Williams, DJ, Conway, PP (1997) Development and R&D Capability at Offshore Sites: Electronics Multi-Nationals in Singapore and Taiwan, International Journal of Production and Operations Management, 6(2), pp.131-149, ISSN: 1059-1478.

Whalley, DC and Conway, PP (1996) Simulation and interpretation of wetting balance tests using the surface evolver, JOURNAL OF ELECTRONIC PACKAGING, 118(3), pp.134-141, ISSN: 1043-7398. DOI: 10.1115/1.2792143.

Whalley, DC and Conway, PP (1996) Simulation and interpretation of wetting balance tests using The Surface Evolver, Transactions of the ASME: Journal of Electronic Packaging, 118(3), pp.134-141, ISSN: 1043-7398.

Conway, PP, Kalantary, MR, Williams, DJ (1996) Experimental Investigation of the Formation of Surface Mount Solder Joints, Transactions of the American Society of Mechanical Engineers (ASME), Journal of Electronic Packaging, 118(3), pp.223-228, ISSN: 1043-7398.

Williams, DJ, Conway, PP, Sarvar, F (1996) Using Process Simulation as a Product and Process Design Tool, American Society of Mechanical Engineering's (ASME) Singapore Chapter Yearbook, 3, pp.102-109.

Tilley, KJ, Williams, DJ, Conway, PP (1996) Design and Manufacture by Foreign Electronics Multi-nationals in Singapore and Taiwan: Product Responsibilities in a Global Environment, Proceedings of the IMechE, Part B Journal of Engineering Manufacture, 210, pp.221-231, ISSN: 0954-4054.

Whalley, DC, Conway, PP, Sarvar, F, Williams, DJ (1995) Modelling of Solder Joint Geometry for Quality and Reliability, Soldering and Surface Mount Technology, 21, pp.10-12, ISSN: 0954-0911.

Kalantary, MR, Sarvar, F, Conway, PP, Williams, DJ, Whalley, DC (1994) Observed Phenomenology of the Interaction Between Solder Paste and Soldering Processes, Soldering and Surface Mount Technology, 18, pp.8-11, ISSN: 0954-0911.

Tilley, KJ, Williams, DJ, Conway, PP (1994) Offshore Development of Electronics Products, Engineering Management Journal, 4(4), pp.185-192, ISSN: 0960-7919.

Tilley, KJ, Williams, DJ, Conway, PP (1994) Offshore development of electronic products, Engineering Management Journal, 4(4), pp.185-192, ISSN: 0960-7919. DOI: 10.1049/em:19940406.

Tilley, KJ, Conway, PP, Williams, DJ (1994) Hong Kong, Singapore and Taiwan - Electronics Industry Capabilities, A View from the United Kingdom, Journal of the Institute of Industrial Engineers (HK), pp.31-34.

Conway, PP (1993) Environmental comparison of solder and conductive adhesives for SMT interconnect, IEEE/CHMT European International Electronic Manufacturing Technology Symposium, pp.171-176.

JAHN, JR and CONWAY, PP (1993) Multichip modules (MCMs): a review of the status quo, Journal of Electronics Manufacturing, 03(01), pp.1-11, ISSN: 0960-3131. DOI: 10.1142/s0960313193000024.

Jahn, JR and Conway, PP (1993) Multichip Modules (MCMs): A Review of the Status Quo, Journal of Electronics Manufacturing, 3(1), pp.1-12, ISSN: 0960-3131.

Williams, DJ, Conway, PP, Whalley, DC (1993) Making Circuits More Than Once: The Manufacturing Challenges of Electronics Intensive Products, Proceedings of the Institution of Mechanical Engineers, 207, pp.83-90.

WILLIAMS, DJ and CONWAY, PP (1992) The value chain in multinational electronics manufacturing enterprises operating in newly industrialized countries, Journal of Electronics Manufacturing, 02(04), pp.161-167, ISSN: 0960-3131. DOI: 10.1142/s0960313192000194.

Whalley, DC, Ogunjimi, AO, Conway, PP, Williams, DJ (1992) The Process Modelling of the Infra-red Reflow Soldering of Printed Circuit Board Assemblies, Journal of Electronics Manufacturing, 2(1), pp.23-29, ISSN: 0960-3131.

Williams, DJ and Conway, PP (1992) The Value Chain in Multinational Electronics Manufacturing Enterprises Operating in Newly Industrialised Countries, Journal of Electronics Manufacture, 2(4), pp.161-168, ISSN: 0960-3131.

Conway, PP, Ogunjimi, AO, Sargent, PM, Tang, ACT, Whalley, DC, Williams, DJ (1991) SMD Reflow Soldering: A Thermal Process Model, Annals of the CIRP, 40/1/1991, pp.21-24.

Conway, PP, Williams, DJ, Whalley, DC (1991) Experiments to Allow the Interpretation of a Computer Based Model of the Solder Paste Reflow Process, Journal of Processing of Advanced Materials, 1(3), pp.175-180, ISSN: 0960-3158.



Conferences

Torres-Sanchez, C and Conway, P (Accepted for publication) Transition Zone: a training ethos designed to scaffold a PhD degree. In 2019 American Society for Engineering Education Annual Conference & Exposition, Tampa, Florida.

Cadman, DA, El-Faouri, S, Wang, D, Chi-Tangyie, G, Ghosh, A, Ketharam, A, Gheisari, R, Goulas, A, Lee, C, Whittaker, T, Zhang, S, Reaney, I, Vaidhyanathan, B, Conway, PP, Engstrom, D, Whittow, WG, Vardaxoglou, JC (Accepted for publication) 3D printing of high performance low temperature sintered ceramic substrates for microwave applications. In Loughborough Antennas & Propagation Conference 2018 (LAPC 2018), Loughborough, United Kingdom.

Engstrom, D, Goulas, A, Gheisari, R, Cadman, DA, Zhang, S, Wang, D, Reaney, I, Vaidhyanathan, B, Whittow, WG, Vardaxoglou, JC, Conway, PP (Accepted for publication) Additive Manufacturing of Metal-Ceramic Metamaterials for RF Communications. In 2nd International Conference on 3D Printing Technology and Innovations, London, United Kingdom.

Torres-Sanchez, C, Conway, PP, Holt, JA (Accepted for publication) 3D Acoustic-Structure Interaction of Ultrasound in Fluids for the Manufacture of Graded Materials. In COMSOL CONFERENCE 2017, ROTTERDAM, NL.

Liu, J, Huang, Z, Conway, PP (2019) Linkages between grain structure and protrusion of TSV in 3D packaging. In , 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019, pp.303-305, ISBN: 9781538665084. DOI: 10.1109/EDTM.2019.8731085.

Liu, J, Huang, Z, Conway, P, Liu, Y (2019) Protrusion of Cu-TSV under different strain states. In EMAP 2018, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, Singapore,ISBN: 9781538656426. DOI: 10.1109/EMAP.2018.8660786.

Torres-Sanchez, C and Conway, PP (2018) Magnetic-assisted Alignment of Reinforcing Functionalized-fibers in a Composite for Lightweight Structures. In Conference on Smart Materials, Adaptive Structures and Intelligent Systems (SMASIS 2018), San Antonio, Texas.

Liu, J, Huang, Z, Conway, PP, Altmann, F, Petzold, M, Naumann, F (2017) On reproducing the copper extrusion of through-silicon-vias from the atomic scale. In ICEPT: The 18th International Conference on Electronic Packaging Technology, 18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, pp.789-796, ISBN: 9781538629727. DOI: 10.1109/ICEPT.2017.8046565.

Conway, PP, Huang, Z, Liu, J, Liu, Y (Accepted for publication) A Materials Genome Approach for Heterogeneous Integration. In 15th International Symposium on Microelectronics and Packaging, Seoul, South Korea. Full text: http://kmeps.or.kr/ .

Huang, Z, Liu, J, Conway, PP, Hu, Z, Liu, Y (2016) An atomistic study of copper extrusion in through-silicon-via using phase field crystal models. In Electronic System-Integration Technology Conference (ESTC), 2016 6th, 2016 6th Electronic System-Integration Technology Conference, ESTC 2016, Grenoble,ISBN: 9781509014026. Full text: http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7751138. DOI: 10.1109/ESTC.2016.7764700.

Segura Velandia, DM, Neal, A, Goodall, P, Conway, P, West, A (2016) Industrie 4.0 implementations in the Automotive Industry. In Goh, Y and Case, K (ed) 14th International Conference on Manufacturing Research, Advances in Manufacturing Technology, Loughborough University, pp.319-324, DOI: 10.3233/978-1-61499-668-2-319.

Neal, A, Segura Velandia, DM, Conway, P, West, A (2016) Component detection with on-board UHF RFID reader for Industrie 4.0 capable Returnable Transit Items. In Goh, Y and Case, K (ed) 14th International Conference on Manufacturing Research, Advances in Manufacturing Technology, Loughborough University, pp.325-330, DOI: 10.3233/978-1-61499-668-2-325.

Neal, A, Segura-Velandia, D, Conway, P, West, A (2016) Component detection with an on-board UHF RFID reader for industrie 4.0 capable returnable transit items. In , Advances in Transdisciplinary Engineering, pp.325-330, ISBN: 9781614996675. DOI: 10.3233/978-1-61499-668-2-325.

Segura-Velandia, D, Neal, A, Goodall, P, Conway, P, West, A (2016) Industrie 4.0 implementations in the automotive industry. In , Advances in Transdisciplinary Engineering, pp.319-324, ISBN: 9781614996675. DOI: 10.3233/978-1-61499-668-2-319.

Goodall, P, Neal, A, Segura-Velandia, D, Conway, P, West, A (2016) A data management system for identifying the traceability of returnable transit items using radio frequency identification portals. In , Advances in Transdisciplinary Engineering, pp.343-348, ISBN: 9781614996675. DOI: 10.3233/978-1-61499-668-2-343.

Pantazis, D, Rodriguez, AA, Conway, PP, West, AA (2016) An application of autoregressive hidden Markov models for identifying machine operations. In , Advances in Transdisciplinary Engineering, pp.193-198, ISBN: 9781614996675. DOI: 10.3233/978-1-61499-668-2-193.

Huang, Z, Lv, H, Conway, P (2015) A wavelet analysis on digital microstructure in microbumps. In 2015 16th International Conference on Electronic Packaging Technology (ICEPT). DOI: 10.1109/icept.2015.7236608.

Lugo Sanudo, H, Grieve, C, Chakravorti, N, Conway, P, West, A (2015) The effect of varied terrain and bicycle fitting on aerobic power production test methodology. In Science and Cycling 2015, Utrecht.

Lugo Sanudo, H, Chakravorti, N, Philpott, L, Crewther, B, Conway, P, West, A (2015) Effect of feedback on cycling performance in a 4 kilometre laboratory time trial. In Science and Cycling 2015, Utrecht.

Kaur, N, Velandia, DS, Whittow, W, Barwick, D, Iredia, E, Parker, N, Porter, N, Conway, PP, West, AA (2015) Design and performance of a flexible metal mountable UHF RFID tag. In 2015 IEEE 65th Electronic Components and Technology Conference (ECTC). DOI: 10.1109/ectc.2015.7159895.

Conway, PP (2015) Embedded Intelligence. In 8th National Electrical and Computer Engineering Conference (SFHMMY 8), University of Patras, Patras, Greece.

Banwell, G, Sharpe, R, Conway, P, West, A (2014) Evaluating the optimal location for embedded accelerometers using experimentally validated computer algorithms. In 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). DOI: 10.1109/eptc.2014.7028395.

Chakravorti, N, Lugo, H, Philpott, LK, Conway, PP, West, AA (2014) Automated cycling ergometer with built-in ability to produce resistance profiles. In 2014 IEEE International Conference on Systems, Man and Cybernetics - SMC, 2014 IEEE International Conference on Systems, Man, and Cybernetics (SMC). DOI: 10.1109/smc.2014.6974383.

Conway, PP and Huang, Z (2014) Quantitative characterisation of multi scale microstructures in interconnects for multi-chip stacking. In International Stress Workshop, Austin. Tx, USA.

Conway, PP (2014) Multidisciplinary network-based research supporting the UK’s micro-machines sector. In 20th World MicroMachine Summit, Sao Paulo.

Philpott, LK, Weaver, S, Gordon, D, Conway, PP, West, AA (2014) Assessing wireless inertia measurement units for monitoring athletics sprint performance. In , Proceedings of IEEE Sensors, pp.2199-2202, DOI: 10.1109/ICSENS.2014.6985476.

Sharpe, R, Banwell, G, Conway, PP, West, AA (2014) Sensor-enabled PCBs to aid right first time manufacture through defect prediction. In , Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, pp.366-371, ISBN: 9781479969944. DOI: 10.1109/EPTC.2014.7028396.

Chakravorti, N, Lugo, HL, Philpott, LK, Conway, PP, West, AA (2014) Model based Automated Cycling Ergometer. In , Procedia Engineering, pp.180-185, DOI: 10.1016/j.proeng.2014.06.030.

Rathnayake Arachchige, D, Hutt, DA, Conway, PP, D'Auria, M, Lucyszyn, S, Lee, RM, Robertson, ID (2013) Patterning of Electroless Copper Deposition on Low Temperature Co-fired Ceramic. In IEEE 15th Electronics Packaging Technology Conference (EPTC), Singapore, pp.635-639, ISBN: 978-1-4799-2834-7.

Conway, PP, Rathnayake-Arachchige, D, Hutt, DA, Conway, PP, D'Auria, M, Lucyszyn, S, Lee, R, Robertson, ID (2013) Patterning of Electroless Copper Deposition on Low Temperature Co-fired Ceramic. In Anand, A and Yeo, A (ed) 15th IEEE Electronics Packaging Technology Conference, Proc 15th IEEE Electronics Packaging Technology Conference, Singapore, p.208.

Rathnayake-Arachchige, D, Hutt, DA, Conway, PP (2013) Excimer Laser Machining of Fired LTCC for Selectively Metallized Open Channel Structures. In Schieman, B (ed) 46th International Symposium on Microelectronics, Proc 46th International Symposium on Microelectronics, Orlando, Florida.

Lugo Sanudo, H, Segura Velandia, D, Conway, P, West, A, Bindel, A (2012) Secure document and Asset tracking. In SoftCOM 2012, 20th International Conference on Software, Telecommunications and Computer Networks, Split.

Rosamond, EL, Justham, L, Conway, P, West, A, Goodall, P (2012) A Proposed Novel Knowledge Framework for Remanufacturing Viability in a Modern Supply Chain. In Stjepandic, J, Rock, G, Bil, C (ed) 19th ISPE International Conference on Concurrent Engineering, Concurrent Engineering Approaches for Sustainable Product Development in a Multi-Disciplinary Environment, Trier, pp.861-870, ISBN: 978-1-4471-4426-7.

LeSage, T, Bindel, A, Conway, PP, Slawson, SE, West, AA (2012) Development of a wireless sensor network for embedded monitoring of human motion in a Harsh environment. In IEEE 3rd International Conference on Communication Software and Networks, 8 Sep 2012t, Xi'an, China, pp.112-115, ISBN: 978-1-61284-485-5. Full text: http://ieeexplore.ieee.org/. DOI: 10.1109/ICCSN.2011.6013555.

Petzing, JN, He, B, Webb, DP, Leach, RK, Conway, PP (2012) The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass.. In 12th International Conference of the European Society for Precision Engineering & Nanotechnology, Stockholm, Sweden, pp.92-95, ISBN: 978-0-9566790-0-0. Full text: http://www.euspen.eu/ .

Rathnayake-Arachchige, D, Hutt, DA, Conway, PP, IEEE, (2012) Adhesion Improvement of Electroless Copper (Cu) Thin Films Deposited on Low Temperature Co-fired Ceramics (LTCC). In , 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC).

Gordon, D, Mullane, SL, Conway, PP, West, AA (2012) Development of a Novel System for Monitoring Strength and Conditioning in Elite Athletes. In Drane, P and Sherwood, J (ed) 9th Conference of the International-Sports-Engineering-Association (ISEA), ENGINEERING OF SPORT CONFERENCE 2012, Univ Massachusetts Lowell, Lowell, MA, pp.496-501, DOI: 10.1016/j.proeng.2012.04.085.

Slawson, SE, Chakravorti, N, Conway, PP, Cossor, J, West, AA (2012) The Effect of Knee Angle on Force Production, in Swimming Starts, using the OSB11 Block. In Drane, P and Sherwood, J (ed) 9th Conference of the International-Sports-Engineering-Association (ISEA), ENGINEERING OF SPORT CONFERENCE 2012, Univ Massachusetts Lowell, Lowell, MA, pp.801-806, DOI: 10.1016/j.proeng.2012.04.137.

Chakravorti, N, Slawson, SE, Cossor, J, Conway, PP, West, AA (2012) Swimming Turn Technique Optimisation by Real-Time Measurement of Foot Pressure and Position. In Drane, P and Sherwood, J (ed) 9th Conference of the International-Sports-Engineering-Association (ISEA), ENGINEERING OF SPORT CONFERENCE 2012, Univ Massachusetts Lowell, Lowell, MA, pp.586-591, DOI: 10.1016/j.proeng.2012.04.100.

Conway, P and Williams, D (2011) Enhanced education for better imaging practices: A case study at the University of Michigan. In , Archiving 2011 - Preservation Strategies and Imaging Technologies for Cultural Heritage Institutions and Memory Organizations - Final Program and Proceedings, pp.65-70, ISBN: 9780892082940.

Wu, Z, Huang, Z, Conway, PP, MA, Y (2011) Effect of Microstructure on Thermal-Mechanical Stress in 3D Copper TSV Structures. In Khan, N and Lu, A (ed) 13th IEEE Electronics Packaging Technology Conference, Singapore, pp.450-454, ISBN: 978-1-4577-1981-3. Full text: http://ieeexplore.ieee.org/ .

Lugo, H, viret, J, Bindel, A, Conway, PP, West, A (2011) Distributed monitoring system for material handling. In 19th International Conference on Software, Telecommunications and Computer Networks, Split, Croatia, pp.1-6, ISBN: 978-1-4577-1439-9. Full text: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6064374&isnumber=6064354 .

viret, J, Bindel, A, Conway, PP, Justham, L, Lugo, H, West, AA (2011) Embedded RFID TAG inside PCB board to improve supply chain management. In Holland, A and Sinnadurai, N (ed) 18th European Microelectronics Packaging Conference, Brighton UK, pp.1-5, ISBN: 978-0-9568086-0-8. Full text: http://www.imapseurope.org/ .

Flaherty, OM, Cui, X, Rajamohan, D, Anderson, D, Hutt, DA, Denning, C, Conway, PP, West, AA (2011) Fabrication of a Novel Multi-Electrode Array (MEA) Biochip Using Polyester Insulated Electrodes with Microwell Features for Cardiomyocyte Analysis. In Holland, A and Sinnadurai, N (ed) 18th European Microelectronics Packaging Conference, Brighton UK, pp.1-6, ISBN: 978-0-9568086-0-8. Full text: http://www.imapseurope.org/ .

Webster, JM, West, AA, Conway, PP, Caine, MP (2011) Development of a pressure sensor for swimming turns. In 5th Asia-Pacific Congress on Sports Technology (APCST), Melbourne, Australia, pp.126-132, DOI: 10.1016/j.proeng.2011.05.062.

Webster, J, West, AA, Conway, PP, Caine, MP (2011) Development of an automated cycle ergometer. In 5th Asia-Pacific Congress on Sports Technology (APCST), Melbourne, Australia, pp.69-74, DOI: 10.1016/j.proeng.2011.05.053.

Slawson, SE, Conway, PP, Cosser, J, Chakravorti, N, Le Sage, T, West, AA (2011) The effect of start block configuration and swimmer kinematics on starting performance in elite swimmers using the Omega OSB11 block. In 5th Asia-Pacific Congress on Sports Technology(APCST), Melbourne, Australia, pp.141-147, DOI: 10.1016/j.proeng.2011.05.064.

Cossor, J, Slawson, SE, Shillabeer, B, Conway, PP, West, AA (2011) ARE LAND TESTS A GOOD PREDICTOR OF SWIM START PERFORMANCE?. In Vilas-Boas, M, KIm, L, Veloso, P (ed) 29th Biomechanics in Sport, Porto, Portugal, pp.183-186, Full text: http://w4.ub.uni-konstanz.de/cpa/index .

Huertas Quintero, LAM, Conway, PP, Whalley, DC, West, AA (2010) Deployment of a Reflow Process Model to Support Quality and Reliability in PCA Manufacturing. In Proceedings of the 12th IEEE Electronics Packaging Technology Conference (EPTC 2010), IEEE catalog No CFP10453-USB, Singapore, p.6, ISBN: 978-1-4244-8561-1.

Huang, Z, Conway, PP, Davies, H, Dinsdale, A, Wu, Z, Wang, B (2010) An Integrated Materials Modelling Platform for Electronic Packaging. In Proceedings of the 12th International Conference on Electronics Materials and Packaging (EMAP), Singapore, p.7.

Huertas Quintero, LAM, Segura Velandia, DM, Conway, PP, Pourtafreshi Monfared, R, West, AA (2010) A Framework for Quality Data Capitalisation for UK Electronics Manufacturing. In Proceedings of the 12th International Conference on Electronics Materials and Packaging (EMAP), Singapore, p.6.

Huertas Quintero, LAM, Conway, PP, Segura Velandia, DM, West, AA (2010) An Integrated Approach to Design for Quality (DfQ) in the High Value Added Printed Circuit Assembly (PCA) Manufacturing: A Pilot Tool. In Proceedings of the 3rd IEEE International Conference on Electronics Systems and Integration Technologies (ESTC 2010), Berlin, p.6.

Knauf, BJ, Liu, C, Webb, DP, Conway, PP (2010) Polymer Bonding by Induction Heating for Microfluidic Applications. In Proceedings of the 3rd IEEE International Conference on Electronics Systems and Integration Technologies (ESTC 2010), Berlin, p.8.

Le Sage, T, Bindel, A, Conway, PP, Justham, LM, Slawson, SE, West, AA (2010) Kalman Filter Design for Application to an INS Analysing Swimmer Performance. In Proceedings of the 18th European Signal Processing Conference (EURASIP), Aalborg, Denmark, pp.1723-1727.

Mullane, SL, Justham, LM, West, AA, Conway, PP (2010) Design of an end-user centric information interface from data-rich performance analysis tools in elite swimming. In , Procedia Engineering : The Engineering of Sport 8 - Engineering Emotion, pp.2713-2719, Full text: http://www.sciencedirect.com/science/article/B9869-508WXJK-20/2/7b9a0aa7e05fb5f75dc552b562b24e67. DOI: 10.1016/j.proeng.2010.04.056.

Slawson, SE, Conway, PP, Justham, LM, Le Sage, T, West, AA (2010) Dynamic signature for tumble turn performance in swimming. In , Procedia Engineering : The Engineering of Sport 8 - Engineering Emotion, pp.3391-3396, DOI: 10.1016/j.proeng.2010.04.163.

Slawson, SE, Conway, PP, Justham, LM, West, AA (2010) The development of an inexpensive passive marker system for the analysis of starts and turns in swimming. In , Procedia Engineering: The Engineering of Sport 8 - Engineering Emotion, pp.PP 1877-7058, DOI: 10.1016/j.proeng.2010.04.058.

Le Sage, T, Bindel, A, Conway, PP, Justham, LM, Slawson, SE, West, AA (2010) Development of a real time system for monitoring of swimming performance. In , Procedia Engineering: The Engineering of Sport 8 - Engineering Emotion, pp.2707-2712, Full text: http://www.sciencedirect.com/science/article/B9869-508WXJK-1Y/2/0f8ad6445efd5f699c459c5d98bdc867. DOI: 10.1016/j.proeng.2010.04.055.

Cosser, J, Slawson, SE, Justham, LM, Conway, PP, West, AA (2010) The Development of a Component Based Approach for Swim Start Analysis. In Proceedings of the 11th International Symposium for Biomechanics and Medicine in Swimming, Oslo, Norway, pp.59-61, ISBN: 978 82 502 0439 3.

Huertas Quintero, LAM, Conway, PP, Segura Velandia, DM, West, AA (2010) A systems integration perspective to manufacturing modelling and simulation. In 4th Annual IEEE International Systems Conference, San Diego, pp.415-420, ISBN: 978-1-4244-5884-4. Full text: http://dx.doi.org/10.1109/SYSTEMS.2010.5482347. DOI: 10.1109/SYSTEMS.2010.5482347.

Bindel, A, Justham, LM, Conway, PP, Lugo, H, Viret, JGE, West, AA (2010) Development of an Embedded RFID Tag for End-of-Life Management within an Electronics Manufacturing Supply Train. In Proceedings of the 5th International Conference on Advances in Production Management Systems (APMS), Como, Italy, p.6.

Huertas Quintero, LAM, Rosamond, EL, Conway, PP, West, AA (2010) A Novel Tool to Support Manufacturing Sustainability in UK Electronics Manufacturing from a Quality Perspective. In Proceedings of the 5th International Conference on Advances in Production Management Systems (APMS), Como, Italy, p.6.

Le Sage, T, Conway, PP, Justham, LM, Slawson, SE, Bindel, A, West, AA (2010) A Component Based Integrated System for Signal Processing of Swimming Performance. In SIGMAP 2010, International Conference on Signal Processing and Multimedia Applications [Best student paper award], Athens, Greece.

Conway, P (2009) The image and the expert user: A qualitative investigation of decision-making. In , Archiving 2009 - Preservation Strategies and Imaging Technologies for Cultural Heritage Institutions and Memory Organizations - Final Program and Proceedings, pp.142-150, ISBN: 9780892082841.

Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP, Pourtafreshi Monfared, R (2009) Integrated Modelling for Simulation in the Electronics Manufacturing Domain. In (ISC 2009), Proceedings of the 7th International Industrial Simulation Conference, Loughborough, UK.

Webb, DP, Conway, PP, Hutt, DA, Knauf, BJ, Liu, CC (2009) Processes for Integration of Microfluidic Based Devices. In 17th European Microelectronics and Packaging Conference (EMPC), Rimini, Italy, pp.1-7.

Knauf, BJ, Webb, DP, Liu, CC, Conway, PP (2009) Packaging for Polymer Microfluidic Systems Using Low Frequency Induction Heating (LFIH). In Proceedings of the 3rd Annual Lab-on-a-Chip European Congress (LOACEC2009), Stockholm, Sweden, p.27.

Webb, DP, Knauf, BJ, Liu, CC, Hutt, DA, Conway, PP (2009) Productionisation issues for commercialisation of microfluidic based devices. In Proceedings of Microtech 2009, Edinburgh, UK, pp.1-10.

Liu, J, Liu, C, Conway, PP, Zeng, J, Wang, C (2009) Growth and Recrystallization of Electroplated Copper Columns. In Bi, K and Cai, J (ed) International Conference on Electronic Packaging Technology & High Density Packaging, 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), Beijing, PEOPLES R CHINA, pp.619-+, ISBN: 978-1-4244-4658-2.

Zakariyah, SS, Conway, PP, Hutt, DA, Selviah, DR, Wang, K, Baghsiahi, H, Rygate, J, Calver, J, Kandulski, W (2009) Polymer Optical Waveguide Fabrication Using Laser Ablation. In 11th Electronics Packaging Technology Conference, 2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), Shangri La, SINGAPORE, pp.936-+, ISBN: 978-1-4244-5099-2. DOI: 10.1109/EPTC.2009.5416408.

Quintero, LAMH, West, AA, Velandia, DMS, Conway, PP, Monfared, R (2009) A HIERARCHICAL OBJECT-ORIENTED SOFTWARE STRUCTURE FOR MANUFACTURING SIMULATION. In Das, DB, Nassehi, V, Deka, L (ed) 7th International Industrial Simulation Conference, 7TH INDUSTRIAL SIMULATION CONFERENCE 2009, Loughborough, ENGLAND, pp.79-85, ISBN: 978-9-07738-148-9.

Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP, Whalley, DC (2009) Integrated modelling for simulation in the electronics manufacturing domain. In Proceedings of the 11th Electronics Packaging Technology Conference, Singapore, pp.260-266, ISBN: 978 1 4244 5099 2. Full text: http://dx.doi.org/10.1109/EPTC.2009.5416541. DOI: 10.1109/EPTC.2009.5416541.

Cui, X, Bhatt, D, Khoshnaw, FM, Hutt, DA, Conway, PP (2009) Glass as a Substrate for High Density Electrical Interconnect. In 10th International IEEE Electronics Packaging Technology Conference, Proceedings of the 10th International IEEE Electronics Packaging Technology Conference, Singapore, December 2008, pp.12-17, ISBN: 9781424421183.

Cui, X, Hutt, DA, Conway, PP (2008) Investigation of the adhesion of electroless copper to glass substrates. In , Materials Research Society Symposium Proceedings, pp.19-24, ISBN: 9781615677597.

Segura Velandia, DM, Pourtafreshi Monfared, R, West, AA, Conway, PP, Whalley, DC, Huertas Quintero, LAM (2008) Role of CAD Post-Processing in a Quality Tool for Low Volume High-Complexity Electronics Manufacture. In Proceedings of the 10th International IEEE Electronics Packaging Technology Conference, Singapore, pp.1436-1441, ISBN: 978-1-4244-2118-3.

Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP, Whalley, DC, Wilson, C, Pourtafreshi Monfared, R (2008) Component Based Simulation as a Predictive Tool for High Value Added Electronics. In Proceedings of the 2008 European Electronis Assembly Reliability, Tallin.

Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP, Whalley, DC, Wilson, AR, Pourtafreshi Monfared, R (2008) A simulation module for supporting the manufacture of high value added electronics manufacturing. In Proceedings of the 2nd IEEE CPMT Electronic System integration Technology Conference, Greenwich, UK, pp.365-370, ISBN: 978-1-4244-2813-7.

Segura Velandia, DM, West, AA, Conway, PP, Wilson, AR, Whalley, DC, Pourtafreshi Monfared, R, Huertas Quintero, LAM (2008) Integration Issues in the Development of a Modelling and Simulation Tool for Low Volume High-Complexity Electronics Manufacture. In Proceedings of the 2nd IEEE CPMT Electronic Systemintegration Technology Conference, Greenwich, UK, pp.1097-1102, ISBN: 978-1-4244-2813-7.

Huertas Quintero, LAM, West, AA, Segura Velandia, DM, Conway, PP, Whalley, DC, Wilson, AR, Pourtafreshi Monfared, R (2008) A simulation module for supporting the manufacture of high value added electronics manufacturing. In Proceedings of the 2nd IEEE CPMT Electronic System integration Technology Conference, Greenwich, pp.365-370, ISBN: 978-1-4244-2813-7.

Cui, X, Hutt, DA, Conway, PP (2008) An Investigation of Electroless Copper Films Deposited on Glass. In IEEE Electronics System-Integration Technology Conference, Proceedings of 2nd IEEE Electronics System-Integration Technology Conference, London, 1st - 4th September 2008, pp.105-110, ISBN: 978-1-4244-2814-4.

Wilson, AR, West, AA, Segura Velandia, DM, Conway, PP, Whalley, DC, Huertas Quintero, LAM, Pourtafreshi Monfared, R (2008) Characterization of Printed Solder Paste Excess and Bridge Related Defects. In Proceedings of the 2nd IEEE CPMT Electronic Systemintegration Technology Conference, Greenwich, pp.1305-1310, ISBN: 978-1-4244-2813-7.

Wilson, AR, West, AA, Segura Velandia, DM, Conway, PP, Whalley, DC, Huertas Quintero, LAM, Pourtafreshi Monfared, R (2008) Characterization of Printed Solder Paste Excess and Bridge Related Defects. In Proceedings of the 2nd IEEE CPMT Electronic Systemintegration Technology Conference, Greenwich, UK, pp.1305-1310, ISBN: 978-1-4244-2813-7.

Knauf, JB, Webb, DP, Liu, CC, Conway, PP (2008) Packaging of polymer based microfluidic systems using low frequency induction heating (LFIH). In Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), Shanghai, PRC, pp.1-6.

Justham, L, Slawson, S, West, A, Conway, P, Caine, M, Harrison, R (2008) Business process modelling and its use within an elite training environment. In Estivalet, M and Brisson, P (ed) ISEA 2008 Conference on Engineering of Sport 7, ENGINEERING OF SPORT 7, VOL 1, Biarritz, FRANCE, pp.73-+, ISBN: 978-2-287-09410-1. DOI: 10.1007/978-2-287-09411-8_9.

Justham, L, Slawson, S, West, A, Conway, P, Caine, M, Harrison, R (2008) Enabling technologies for robust performance monitoring. In Estivalet, M and Brisson, P (ed) ISEA 2008 Conference on Engineering of Sport 7, ENGINEERING OF SPORT 7, VOL 1, Biarritz, FRANCE, pp.45-+, ISBN: 978-2-287-09410-1. DOI: 10.1007/978-2-287-09411-8_6.

Knauf, BJ, Webb, DP, Liu, C, Conway, PP (2008) Packaging of Polymer Based Microfluidic Systems Using Low Frequency Induction Heating (LFIH). In Bi, KY and Xiao, F (ed) International Conference on Electronic Packaging Technology and High Density Packaging, 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, Shanghai, PEOPLES R CHINA, pp.57-62, ISBN: 978-1-4244-2739-0.

Bhatt, D, Williams, K, Hutt, DA, Conway, PP (2008) Excimer Laser Micromachining of Glass Substrates. In Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference (CLEO/QELS 2008), 2008 CONFERENCE ON LASERS AND ELECTRO-OPTICS & QUANTUM ELECTRONICS AND LASER SCIENCE CONFERENCE, VOLS 1-9, San Jose, CA, pp.2623-2624, ISBN: 978-1-55752-859-9.

Slawson, SE, Justham, LM, West, AA, Conway, PP, Caine, MP, Harrison, R (2008) Accelerometer profile recognition of swimming strokes. In Estivalet, M and Brisson, P (ed) ISEA 2008 Conference on Engineering of Sport 7, ENGINEERING OF SPORT 7, VOL 1, Biarritz, FRANCE, pp.81-+, ISBN: 978-2-287-09410-1. DOI: 10.1007/978-2-287-09411-8_10.

Segura Velandia, DM, Pourtafreshi Monfared, R, West, AA, Conway, PP, Whalley, DC, Huertas Quintero, LAM (2008) Role of CAD Post-Processing in a Quality Tool for Low Volume High-Complexity Electronics Manufacture. In 10th International IEEE Electronics Packaging Technology Conference, Proceedings of the 10th International IEEE Electronics Packaging Technology Conference, Singapore, 9th - 12th December 2008, pp.1436-1441, ISBN: 9781424421183.

Hin, TY, Liu, CC, Conway, PP (2008) Controlling Interfacial Interpenetration of Polymer Waveguide Deposited on Plasma Treated Flexible Substrate. In 10th International IEEE Electronics Packaging Technology Conference, Proceedings of the 10th International IEEE Electronics Packaging Technology Conference, Singapore, 9th - 12th December 2008, pp.828-833, ISBN: 9781424421183.

Knauf, BJ, Webb, DP, Liu, CC, Conway, PP (2008) Plastic Packaging Using Low Frequency Induction Heating (LFIH) for Microsystems. In 10th International IEEE Electronics Packaging Technology Conference, Proceedings of the 10th International IEEE Electronics Packaging Technology Conference, Singapore, 9th - 12th December 2008, pp.172-180, ISBN: 9781424421183.

Chappell, J, Hutt, DA, Conway, PP (2008) Variation in the Line Stability of an Inkjet Printed Optical Waveguide-Applicable Material. In 2nd International IEEE Electronics System-Integration Technology Conference, Proceedings of the 2nd International IEEE Electronics System-Integration Technology Conference, London, 1st - 4th September 2008, pp.1267-1272, ISBN: 9781424428144.

Hin, TY, Liu, CC, Conway, PP (2008) The Effect of Surface Modification on Adhesion of Polymer Waveguide on Flexible Substrate. In 2nd International IEEE Electronics System-Integration Technology Conference, Proceedings of the 2nd International IEEE Electronics System-Integration Technology Conference, London, 1st - 4th September 2008, pp.969-976, ISBN: 9781424428144.

Selviah, DR, Hutt, DA, Walker, AC, Wang, K, Fernandez, FA, Conway, PP, Milward, D, Papakonstantinou, I, Baghsiahi, H, Chappell, J, Zakariyah, SS, McCarthy, A, Suyal, H (2008) Innovative optical and Electronic Interconnect Printed Circuit Board Manufacturing Research. In 2nd International IEEE Electronics System-Integration Technology Conference, Proceedings of the 2nd International IEEE Electronics System-Integration Technology Conference, London, 1st - 4th September 2008, pp.867-872, ISBN: 9781424428144.

Liu, J, Liu, CC, Conway, PP (2008) Growth Mechanism of Copper Column by Electrodesposition for Electronic Interconnections. In 2nd International IEEE Electronics System-Integration Technology Conference, Proceedings of 2nd International IEEE Electronics System-Integration Technology Conference, London, 1st - 4th September 2008, pp.679-684, ISBN: 9781424428144.

Hin, TY, Liu, C, Conway, PP (2007) 3D approaches of optical waveguide fabrication on flexible substrate and its application. In , 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007, pp.50-55, ISBN: 9781622764662.

Khoshnaw, F, Conway, PP, Hutt, DA, Williams, K (2007) Glass multilayer lamination for PCB manufacture using pressure assisted low temperature bonding. In Proceedings of the 9th Electronics Packaging Technology Conference, EPTC, Singapore, pp.504-509, ISBN: 1-4244-1323-0.

Cui, X, Bhatt, D, Hutt, DA, Williams, K, Conway, PP (2007) Copper deposition and patterning for glass substrate manufacture. In Proceedings of the 9th Electronics Packaging Technology Conference, EPTC, Singapore, pp.37-42, ISBN: 1-4244-1323-0.

Bhatt, D, Williams, K, Hutt, DA, Conway, PP (2007) Process optimisation and characterisation of excimer laser drilling of microvias in glass. In Proceedings of the 9th Electronics Packaging Technology Conference, EPTC, Singapore, pp.196-201, ISBN: 1-4244-1323-0.

Huang, Z, Conway, PP, Taplin, L (2007) Intermetallic Compounds and Void Formation in Pb-free Solders on Different Metallizations, Pb-Free and RoHS-Compliant Materials and Processes for Microelectronics. In ed, EC (ed) Proceedings of the Materials Research Society Symposium, Warrendale, Philadelphia, USA. Full text: http://www.mrs.org/s_mrs/sec_subscribe.asp?CID=8782&DID=194316 .

Segura Velandia, DM, West, AA, Conway, PP, Wilson, AR, Whalley, DC (2007) Complex Low Volume Electronics Simulation Tool to Improve Yield and Reliability. In Proceedings of the 32nd International Electronics Manufacturing Technology (IEMT), Session 1: Manufacturing and Test Technology, San Jose, California, USA, pp.1-7.

Huang, Z and Conway, PP (2007) Modelling of interfacial intermetallic compounds in the applications (Keynote Paper). In Proceedings of the 6th Micro Nano Reliability Conference 2007, Berlin, Germany, pp.105-106.

Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2007) Modeling of thermal stress in Sn-Ag-Cu solder joint in flip chip. In Chao, CK and eds, CYL (ed) Proceedings of the Seventh International Congress on Thermal Stresses, TS2007, Taipei, Taiwan, pp.433-436, ISBN: 978-986-00-9556-2.

Him, TY, Liu, CC, Conway, PP (2007) A Review on 3D Integrated Approaches in Multimode Optical Polymeric Waveguide Fabrication. In Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, USA, pp.1737-1741, ISBN: 1-4244-0985-3.

Liu, J, Liu, CC, Conway, PP (2007) Crystallographic Features of Copper Column Growth by Reversible Pulse Current Electrodeposition. In Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, USA, pp.892-897, ISBN: 1-4244-0985-3.

Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2007) Crystallographic Structure and Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate. In Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, USA, pp.677-683, ISBN: 1-4244-0985-3.

Segura Velandia, DM, West, AA, Conway, PP, Whalley, DC (2007) A Modelling Framework for the Reliability of Safety Critical Electronics, Keynote Paper. In Proceedings of the 8th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE, London, UK, pp.2-6, ISBN: 1-4244-1106-8.

Huang, Z and Conway, PP (2007) A Comparative Study of numerical Methods and Computational Tools for Phase Field Equations of Solidification. In Proceedings of the 136th TMS Annual Meeting, Advances in Computational Materials Science and Engineering Methods, Orlando, Florida, USA, pp.1-9, ISBN: 978-0-873396677. Full text: http://doc.tms.org/servlet/ProductCatalog?category=07-6677 .

Segura Velandia, DM, West, AA, Conway, PP, Whalley, DC (2006) A Case-Based Reasoning Approach for Low Volume, High Added Value Electronics. In Proceedings of the 8th IEEE Electronics Packaging Technology Conference, Singapore, pp.843-848, ISBN: 1-4244-0665-X.

Vera, DA, Pourtafreshi Monfared, R, West, AA, Conway, PP (2006) Novel Approach to Reflow Oven Design to Control and Optimise Lead Free Soldering Process. In Proceedings of the 8th IEEE Electronics Packaging Technology Conference, Singapore, pp.512-517, ISBN: 1-4244-0665-X.

Pourtafreshi Monfared, R, West, AA, Vera, DA, Conway, PP (2006) Flexible Soldering Cells for Small Batch Productions. In Proceedings of the 8th IEEE Electronics Packaging Technology Conference, Singapore, pp.249-254, ISBN: 1-4244-0665-X.

Hutt, DA, Williams, K, Conway, PP, Khoshnaw, FM, Cui, X, Bhatt, D (2006) Challenges in the Manufacture of Glass Substrates for Electrical and Optical Interconnect. In Proceedings of the 1st IEEE Electronics Systemintegration Technology Conference, Dresden, Germany, pp.1279-1285, ISBN: 1-4244-0552-1.

Sarvar, F, Whalley, DC, Conway, PP (2006) Thermal Interface Materials - A Review of the State of the Art. In Proceedings of the 1st IEEE Electronic Systemintegration Technology Conference, Dresden, Sept 5 - 7, 2006, Dresden, pp..p. 1292-1302, ISBN: 1-4244-0553-X.

Li, D, Liu, C, Conway, PP (2006) Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads. In Proceedings of the 2006 IEEE High Density Microsystem Design and Packaging and Component Failure Analysis (HDP, 2006), Shanghai, China, pp.159-165, ISBN: 1-4244-0488-6.

Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2006) Grain features of SnAgCu solder and their effect on mechanical behaviour of microjoints. In Proceedings of the IEEE Electronics Components and Technology Conference (ECTC'56), San Diego, CA, USA, pp.250-257.

Huang, Z, Conway, PP, Thomson, RC (2006) Microstructural considerations for ultrafine lead free solder joints. In Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2006), Como (Milan), Italy, pp.740-747, ISBN: 1-4244-0275-1.

Gong, J, Liu, C, Conway, PP, Silberschmidt, VV (2006) Mechanical behaviour of grains in SnAgCu solder joints. In International Conference on Electronic Materials and Packaging, 2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, Kowloon, PEOPLES R CHINA, pp.230-250, ISBN: 978-1-4244-0833-7.

Gong, J, Liu, C, Conway, PP, Silberschmidt, VV (2006) Anaiysis of stress distribution in SnAgCu solder joint. In Keogh, PS (ed) 6th International Conference on Modern Practice in Stress and Vibration Analysis, MODERN PRACTICE IN STRESS AND VIBRATION ANALYSIS VI, PROCEEDINGS, Univ Bath, Bath, ENGLAND, pp.359-+, ISBN: 0-87849-418-9. DOI: 10.4028/www.scientific.net/AMM.5-6.359.

Webb, DP, Hutt, DA, Hopkinson, N, Palmer, PJ, Conway, PP (2006) Integration and packaging of microsystems by polymer overmoulding. In Proceedings of the 1st Electronics Systemintegration Technology Conference, Dresden, Germany, pp.567-574.

Webb, DP, Hsu, CC, Hutt, DA, Hopkinson, N, Conway, PP, Palmer, PJ (2005) Polymer overmoulding for microfluidic device packaging and system integration. In Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, pp.134-139, ISBN: 0-7803-9553-0.

Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2005) Micromechanical modelling of Sn-Ag-Cu solder joint under cycling loading. In Proceedings of the 15th International Workshop on Computational Mechanics of Materials (IWCMM15), Dussledorf, Germany.

Chen, K, Li, J, Liu, C, Whalley, DC, Hutt, DA, Conway, PP, Mannan, SH, Clode, MP, Lobato, HM (2005) Molten Solder Interconnects II: Reactions between Ni-P substrates and Sn-Bi based solders. In Proceedings of The International Conference on High Temperature Electronics, Paris, France.

Li, J, Mannan, SH, Clode, MP, Liu, C, Chen, K, Whalley, DC, Hutt, DA, Conway, PP (2005) Molten Solder Interconnects I: Evaluation of Sn-Bi-X/Cu systems and failure mechanisms of LGA assemblies. In Proceedings of The International Conference on High Temperature Electronics, Paris, France.

Li, D, Liu, C, Conway, PP (2005) Interfacial reactions between Pb-free solders and metallised substrate surfaces, IEEE Catalog No 05EX1194. In Proceedings of International Conference on Electronics Packaging Technology (ICEPT'05), Shenzhen, China, pp.360-365, ISBN: 0-7803-9449-6.

Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2005) Modelling of Ag3Sn coarsening and its effect on creep of Sn-Ag eutectics. In Proceedings of EUROMECH 466 Computational and Experimental Mechanics of Advanced Materials, Loughborough, UK.

Liu, C, Hutt, DA, Li, D, Conway, PP (2005) Effect of microstructural characteristics of electroless nickel metallization on solderability to Pb-free solder alloys. In ASME InterPACK2005, Proceedings of the Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS adn Electronic Systems, San Francisco, USA, pp.-, ISBN: 0-7918-3762-9.

Conway, PP and Huang, Z (2005) Impacts of Pb-free legislation on European HDP. In Proceedings of the 7th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis, Keynote Lecture, Shanghai, P.R. China, pp.18-24, ISBN: 0-7803-9292-2.

Palmer, PJ, Sarvar, F, Conway, PP, Jaggernauth, WA, Olseger, M (2005) A Roadmap for an Efficient Urban Delivery System - A case study of a technical project in a rapidly developing market. In Proceedings of the Japanese Society of Automotive Engineers Conference, JSAE 2005, Tokyo, Japan, pp.25-27.

Kay, RW, de Gouruff, E, Desmulliez, MPY, Jackson, GJ, Steen, HAH, Liu, C, Conway, PP (2005) Stencil printing technology for wafer level bumping at sub-100 micron pitch using Pb-free alloys. In ECTC, Proceedings of the 55th Electronics Components and Technology Conference (ECTC'55), Lake Buena Vista, FL, USA, pp.848-854.

Kay, RW, de Gourff, E, Abraham, E, Desmulliez, MPY, Jackson, GJ, Steen, HAH, Liu, C, Conway, PP (2005) Stencil printing for fine pitch wafer level bumping. In Proceedings of the SEMICON Europa 2005 : Advanced Packaging Conference, Munich, Germany.

Desmulliez, MPY, Kay, RW, Abraham, E, de Gourcuff, E, Jackson, GJ, Steen, HAH, Liu, C, Conway, PP, IEEE, (2005) Sub-100 micron pitch stencil printing for wafer scale bumping. In , Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05), pp.74-80, ISBN: 0-7803-9292-2.

Desmulliez, MPY, Kay, RW, Abraham, E, de Gourcuff, E, Jackson, GJ, Steen, HAH, Liu, C, Conway, PP (2005) Sub-100 micron pitch stencil printing for wafer scale bumping. In , High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on, pp.1-7, ISBN: 0780392922.

Webb, DP, Hutt, DA, Hopkinson, N, Palmer, PJ, Conway, PP (2005) Robust, mass-manufacture friendly fluidic interconnects for microfluidic packaging and system integration. In Reichl, HE (ed) Proceedings of Micro System Technologies 2005, Munich, Germany, pp.260-267, ISBN: 3-7723-7040-3.

Gwyer, D, Misselbrook, P, Philpott, D, Bailey, C, Conway, PP, Williams, K (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In Ramakrishna, K and Sammakia, BGEAV (ed) 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM 2004), Las Vegas, NV, pp.405-410, ISBN: 0-7803-8357-5.

Huang, Z, Liu, C, Conway, PP, Thomson, RC (2004) Characterisation of Intermetallics and Mechanical Behaviour in the Reaction between SnAgCu and Sn-Pb Solder Alloys. In IEE Catalog No. 04EX905C, Proceedings of 6th Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04), Shanghai, China,ISBN: 0-7803-8621-3.

Liu, C, Huang, Z, Conway, PP, Thomson, RC (2004) Materials Behaviour and Intermetallics Characteristics in the Reaction Between SnAgCu and Sn-Ph Solder Alloys. In Proceedings of the 54th Electronics Components and Technology Conference (ECTC'54), Las Vegas, Nevada, USA, pp.1347-1353.

Li, D, Liu, C, Conway, PP (2004) Micromechanical Characterisation of Sn-Ag-Cu Solder FCOB Interconnects at Ambient and Elevated Temperatures. In Proceedings of the 54th Electronics Components and Technology Conference (ECTC'54), Las Vegas, Nevada, USA, pp.128-133.

Price, S, Summers, R, Conway, PP, Palmer, PJ (2004) Technology Roadmapping: A New Perspective. In Scapolo, F and Cahill, EE (ed) EU-US Scientific Seminar on New Technology Foresight, Forecasting and Assessment Methods, Seville, Spain, pp.67-76.

Gwyer, D, Misslebrook, P, Bailey, P, Conway, PP, Williams, K (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes. In Ernst, LJ and Zhang, GQEA (ed) 5th International Conference on Thermal and Mechanical Simulation and Experiemtns in Microelectronics and Microsystems, Brussels, Belguim, pp.399-406, ISBN: 0-7803-8420-2.

Misselbrook, P, Gwyer, D, Philpott, D, Bailey, C, Conway, PP, Williams, K (2004) Interconnection Technology for Opto-electrical Circuit Board Applications. In Proceedings of I-MAPS MicroTech 2004, Interconnection and Packaging, Cambridge, UK, p.9.

Liu, C, Hendriksen, MW, Hutt, DA, Conway, PP, Whalley, DC (2004) Materials and processes issues in fine pitch eutectic solder flip chip interconnection. In 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP 04), PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), Shanghai, PEOPLES R CHINA, pp.213-220, ISBN: 0-7803-8620-5. DOI: 10.1109/HPD.2004.1346700.

Gwyer, D, Misselbrook, P, Philpott, D, Bailey, C, Conway, PP, Williams, K (2003) VCSEL to waveguide coupling for optical backpanes. In Iyer, MK, Chaun, TK, Cheong, MY (ed) Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003), Singapore, pp.641-646, ISBN: 0-7803-8205-6.

Smith, PR, Kusmartseva, OE, Conway, J, Price, R, Morton David, AV, Conway, PP, Summers, R (2003) E-Medic: Linking Informatics to a Dry Powder Inhalation System. In DDL14, Drug Delivery to the Lungs XIV, London, pp.4-7.

Teh, NJ, Jones, MD, Bevan, D, Cleathero, IC, Kioul, A, Schmidt, O, Conway, PP, Prosser, S, Palmer, PJ (2003) Re-engineering of Thermoplastic Injection Moulding Process for Electronics Encapsulation in Automotive Applications. In Proceedings of the 5th International Conference on Electronics Materials and Packaging (EMAP 2003), Singapore, pp.46-53, ISBN: 981-05-0078-5.

Huang, Z, Conway, PP, Liu, C, Thomson, RC (2003) Thermodynamic and Kinetic Behaviour of Materials in Micro Joints Formed with Sn-Pb and Pb free Solders. In Proceedings of EMAP 2003 (International Symposium on Electronic Materials and Packaging), Winner of Cookson Electronics Paper Award, Singapore, pp.33-40, ISBN: 981-05-0078-5.

Li, D, Liu, C, Conway, PP (2003) Direct Soldering onto the UBM of Electroless Deposited Ni-Pb-free Alloys. In Proceedings of EMAP 2003 (International Symposium on Electronic Materials and Packaging), Singapore, pp.269-276, ISBN: 981-05-0078-5.

Teh, NJ, Sarvar, F, Conway, PP (2003) Design of a Turbulence-enhanced Deaggregation System for Dry Powder Formulations. In Proceedings of the 25th IEEE Engineering in Medical and Biological Sciences Annual International Conference, Cancun, Mexico, pp.3866-3869, ISBN: 0-7803-7790-7.

Huang, Z, Conway, PP, Liu, C, Thomson, RC (2003) Inter-dependence of Processing and Alloy Composition on the Reliability of Sn-based Lead Free Solders in Fine Pitch FCOB Interconnection. In Proceedings of the IEEE 28th International Electronics Manufacturing Technology Symposium, Winner of an IEEE/CPMT/SEMI Best Paper Award, San Jose, California, USA, p.7, ISBN: 0-7803-7933-0.

Liu, C, Conway, PP, Li, D, Hendriksen, M (2003) Analysis of the Micro-Mechanical Properties in Aged Lead-Free Fine Pitch Flip Chip Joints. In Proceedings of the ASME/JSME IPACK03 International Electronic Packaging Technical Conference, ASME Catalogue No I644CD, Maui, Hawaii, USA, p.7, ISBN: 0-7918-3674-6.

Liu, C, Li, D, Conway, PP (2003) Characterisation of Intermetallic Ageing in Flip Chip Solder Bumps. In Proceedings of the IEEE 53rd Electronic Components and Technology Conference, IEEE Catalog No 03CH37438, New Orleans, Louisiana, USA, pp.1767-1771, ISBN: 0-7803-7430-4.

Gwyer, D, Misselbrook, P, Philpott, D, Bailey, C, Conway, PP, Williams, K (2003) An investigation into the coupling between a VCSEL and a polymer waveguide that will enable future OECB based optical backplanes. In Proceedings of I-MAPS MicroTech 2003, Interconnection and Packaging, Stratford-upon-Avon, UK, p.9.

Liu, C, Geggel, M, Conway, PP, Hendriksen, M (2002) Micro-scale Mechanical Properties of Fine Feature Flip Chip with Lead Free Solders. In Proceedings of the 4th International IEEE Symposium on Electronics Materials and Packaging (EMAP2002), IEEE Catalogue 02EX634, Kaohsiung, Taiwan, pp.259-266, ISBN: 0-7803-7682-X.

Conway, PP and Williams, K (2002) Precision high tempreature lead-free solder interconnections by means of high-energy droplet deposition techniques. In 52nd General Assembly of CIRP, CIRP Annals-Manufacturing Technology - IDSN 570QM, San Sebastian, Spain, pp.177-180.

Carrott, AJ, West, AA, Conway, PP, Cottrill, MCW (2002) Business Case Modelling of Large Area Flexible Circuits in the Foresight Vehicle Programme. In Proceedings of the Society of Automotive Engineers World Congress and Exposition, SAE Paper No 2002-01-1128, Detroit, USA, pp.1-9.

Webb, DP, Cottrill, MC, Jaggernauth, WA, West, AA, Palmer, PJ, Conway, PP (2002) Foresight Vehicle: Multiplex Networks Implemented on Large Area Flexible Printed Circuit Boards. In Proceedings of the Society of Automotive Engineers World Congress and Exposition, SAE Paper No 2002-01-1130, Detroit, USA, p.5.

Cottrill, MC, Jaggernauth, WA, Webb, DP, Palmer, PJ, Conway, PP, West, AA (2002) Foresight Vehicle: Large Area Flexible Circuits for Automotive Applications Manufacturing Technology - A Review of Process Options. In Proceedings of the Society of Automotive Engineers World Congress and Exposition, SAE Paper No 2002-01-1127, Detroit, USA, pp.1-9.

Jaggernauth, WA, Webb, DP, Cottrill, MC, Palmer, PJ, Conway, PP, West, AA (2002) Foresight Vehicle: Specification and Acceptability Criteria for Copper-Clad Dielectric Materials Used in Large Automotive Flexible Printed Circuits. In Proceedings of the Society of Automotive Engineers World Congress and Exposition, SAE Paper No 2002-01-1129, Detroit, USA, pp.1-5.

Mannan, SH, Wheeler, E, Hutt, DA, Whalley, DC, Conway, PP, Bailey, C (2000) Solder Paste Reflow Modeling for Flip Chip Assembly. In Proceedings of the 3rd Electronics Packaging and Technology Conference (EPTC 2000), IEEE Catalog No. 00EX456, Singapore, pp.103-109, ISBN: 0-7803-6644-1.

Mannan, SH, Hutt, DA, Whalley, DC, Conway, PP (2000) Observations of Solder Paste Reflow by Means of Electrical Measurements. In Proceedings of the International Symposium on Electronic Materials and Packaging 2000 (EMAP2000), IEEE Catalog No 00EX458, Hong Kong, pp.175-180, ISBN: 0-7803-6654-9.

Liu, C, Hutt, DA, Whalley, DC, Conway, PP, Mannan, SH (2000) Under Bump Metallisation of Fine Pitch Flip-chip Using Electroless Nickel Deposition. In Proceedings of the International Symposium on Electronic Materials and Packaging 2000 (EMAP2000), IEEE Catalog No 00EX458, Hong Kong, pp.64-71, ISBN: 0-7803-6654-9.

Teh, NJ, Conway, PP, Palmer, PJ, Kioul, A, Prosser, S (2000) Embedding of Electronics within Thermoplastic Polymers using Injection Moulding Technique. In Proceedings from the 26th IEMT Symposium, Santa Clara, CA, USA, pp.10-18, ISBN: 0-7803-6482-1.

Hutt, DA, Webb, DP, Hung, KC, Tang, CW, Conway, PP, Whalley, DC, Chan, YC (2000) Scanning Acoustic Microscopy Investigation of Engineered Flip-chip Delamination. In Proceedings of the Twenty-Sixth IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, IEEE Catalog No 00CH37146, Santa Clara, California, USA, pp.191-199.

Teh, NJ, Palmer, PJ, Conway, PP (2000) Low-cost Embedding of Electronics within Injection Moulded Polymers, Advances in Manufacturing Technology XIV. In Proceedings of the 16th National Conference on Manufacturing Research, University of the East London, pp.375-379, ISBN: 1-86058-267-2.

Tan, X, Conway, PP, Sarvar, F (2000) Effects of Clamping and Beam Position in Laser Micro-Welding of Sensor, Advances in Manufacturing Technology XIV. In Perryman, R and Ellis, CD (ed) Proceedings of the 16th National Conference on Manufacturing Research, University of the East London, UK, pp.369-373, ISBN: 1-86058-267-2.

Teh, NJ, Palmer, PJ, Conway, PP (2000) Low-cost automatic embedding of electronics within injection moulded polymers. In Perryman, R and Ellis, CD (ed) 16th National Conference on Manufacturing Research, ADVANCES IN MANUFACTURING TECHNOLOGY - XIV, UNIV E LONDON, LONDON, ENGLAND, pp.375-379, ISBN: 1-86058-267-2.

Tan, X, Conway, PP, Sarvar, F (2000) Effects of clamping and beam position in laser micro-welding of sensor. In Perryman, R and Ellis, CD (ed) 16th National Conference on Manufacturing Research, ADVANCES IN MANUFACTURING TECHNOLOGY - XIV, UNIV E LONDON, LONDON, ENGLAND, pp.369-373, ISBN: 1-86058-267-2.

Hutt, DA, Rhodes, DG, Conway, PP, Mannan, SH, Whalley, DC, Holmes, AS (1999) Investigation of a Low-Cost Solder Bumping Technique for Flip-Chip Interconnection. In Proceedings of the Twenty-Fourth IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, Austin, Texas, pp.334-342.

Hutt, DA, Mannan, SH, Whalley, DC, Conway, PP (1999) A Maskless, Low-Cost, Multi-Chip-Module Assembly Process. In Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, InterPACK '99, Advances in Electronic Packaging 1999, Maui, Hawaii, USA, pp.1705-1711, ISBN: 0-7918-1612-5.

Conway, PP, Hyslop, SM, Williams, DJ (1999) Development of a closed-loop controlled reflow soldering process. In 49th General Assembly of CIRP, CIRP ANNALS 1999 - MANUFACTURING TECHNOLOGY, MONTREUX, SWITZERLAND, pp.5-8, ISBN: 3-905277-31-X.

Conway, PP (1998) Recent Work in the Interconnection Group, Loughborough University. In Invited paper, 1st International Academic Conference on Electronics Packaging Research and Education for the 21st Century, Georgia Institute of Technology, USA, p.6.

Conway, PP, Whalley, DC, Wilkinson, M, Williams, DJ (1997) Automated Adaptive Control of the Reflow Soldering of Electronic Assemblies. In Proceedings of the 21st IEEE International Electronic Manufacturing Technology Symposium, Austin, Texas, pp.229-236, ISBN: 0-7803-3929-0.

Conway, PP (1996) Solderability and Process Characterisation of Some Lead-free Solders. In Invited paper, International IEEE/IVF Seminar on Lead Free Solders in Electronics Manufacturing, Gothenburg, Sweden, pp.61-66.

Sarvar, F and Conway, PP (1996) Effective Transient Process Modelling of the Reflow Soldering of Printed Circuit Assemblies. In Proceedings of the InterSociety IEEE/ASME Conference on Thermal Phenomena in Electronic Systems, ITHER V, Orlando, Florida, USA, pp.195-202, ISBN: 0 7803 3325 X.

Whalley, DC, Conway, PP, Sarvar, F, Kalantary, MR (1995) The Globule Block Wetting Balance Test. In INTERpack '95, Proceedings of the International Intersociety Electronic Packaging Conference, Hawaii, pp.89-94.

Kalantary, MR, Sarvar, F, Conway, PP, Williams, DJ (1995) Solder Paste as an Interconnection Medium. In Proceedings of the Inst. Metal Finishing, Connectors 1995 Conference, Coventry, pp.63-74.

Kalantary, MR, Conway, PP, Williams, DJ (1995) Towards a Standard for Differential Scanning Calorimetry Measurement of Solder Paste Products. In Proceedings of the 17th IEEE/IEMTS Conference, Austin, Texas, USA, pp.337-343.

Conway, PP (1995) Solderability Testing of Alternate Component Termination Materials with Lead Free Solder Alloys. In Proceedings of the 17th IEEE/IEMTS Conference, Austin, Texas, USA, pp.245-251.

Conway, PP, Kalantary, MR, Williams, DJ (1995) Experimental Investigation of the Formation of Surface Mount Solder Joints. In Proceedings of the International Intersociety ASME/JSME/IEEE Electronic Packaging Conference, Westin Mauii, Hawaii, USA, pp.95-102, ISBN: 0-7918-1303-7.

Conway, PP and Williams, DJ (1995) Experiments to Improve the Understanding of Process Defects Such as Partial Reflow and Solder Balling as Occurring in the Soldering of Solder Paste Materials. In Proceedings of Productronica '95, Munich, pp.53-60.

Whalley, DC, Conway, PP, Sarvar, F, Williams, DJ (1994) Modelling of Solder Joint Geometry for Quality and Reliability. In Proceedings of the European Surface Mount Conference, Brighton, pp.C5.1-8.

Sarvar, F, Kalantary, MR, Conway, PP, Williams, DJ, Whalley, DC (1994) Effects of Ground Planes and Tracks on the Simulation of the Reflow Process for Surface Mount Technology. In Proceedings of the First International Symposium on Microelectronic Package and PCB Technology, Beijing, pp.35-40.

Kalantary, MR, Sarvar, F, Conway, PP, Williams, DJ, Whalley, DC (1994) Understanding the Interaction Between Solder Pastes and the Soldering Process. In Proceedings of the ISHM International Conference on Electronics Technologies, Windsor, pp.123-130.

Tilley, KJ, Williams, DJ, Conway, PP (1994) Manufacturing to Design Transitions for High Value Electronics Products in Multinational Companies in the Newly Industrialised Countries of the Far East. In Goldring International Seminar on Emerging Paradigms in Globalising Technology, Manufacturing and Service Organisations, New Orleans, USA, p.16.

Tilley, KJ, Conway, PP, Williams, DJ, DeSouza, R (1994) Far East Manufacturing Cost Reduction by Adjacent Country Production. In Proceedings of the 16th IEEE/CPMT International Electronics Manufacturing Technology Symposium, La Jolla, CA, USA, pp.325-332, ISBN: 0 7803 2037 9.

Conway, PP (1993) An Environmental Comparison of Solder and Conductive Adhesives for SMT Interconnect. In Proceedings of 15th IEEE/CHMT EMTS Conference, Santa Cruz, California, USA, pp.198-202.

Williams, DJ and Conway, PP (1993) Technology Development and Evolution: Electronic Interconnection. In Proceedings of the ACME Research Conference, Sheffield, pp.74-79.

Whalley, DC, Conway, PP, Williams, DJ (1993) A Process Model of the Infra-red Reflow Soldering of Printed Circuit Assemblies. In IEE Colloquium on CAD Tools for Thermal Management, CAD Tools for Thermal Management, London, pp.3/1-3/3.

CONWAY, PP (1993) AN ENVIRONMENTAL COMPARISON OF SOLDER AND CONDUCTIVE ADHESIVES FOR SMT INTERCONNECT. In 15th IEEE/CHMT International Electronics Manufacturing Technology (IEMT) Symposium: Electronics Manufacturing for the year 2000, FIFTEENTH IEEE/CHMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, SANTA CLARA, CA, pp.171-176, ISBN: 0-7803-1424-7.

WILLIAMS, DJ, CONWAY, PC, WHALLEY, DC (1992) CHALLENGES IN THE MANUFACTURE OF ELECTRONIC PRODUCTS. In Eyada, OK and Ahmad, MM (ed) 2ND INTERNATIONAL CONF ON FLEXIBLE AUTOMATION AND INFORMATION MANAGEMENT ( FAIM 92 ), FLEXIBLE AUTOMATION AND INFORMATION MANAGEMENT 1992, FALLS CHURCH, VA, pp.47-58, ISBN: 0-8493-0138-6.

Williams, DJ, Conway, PP, Whalley, DC (1992) Invited Keynote - Challenges in the Manufacture of Electronic Products. In Eyada, K, O, Ahmad, eds, MM (ed) 2nd FAIM Conference, Virginia, pp.47-58.

Whalley, DC, Conway, PP, Ogunjimi, AO, Williams, DJ (1991) A Process Model of the Infra-red Reflow Soldering of Printed Circuit Board Assemblies. In 11th International IEEE CHMT International Electronic Manufacturing Technology Symposium Conference, Proceedings of the 11th International IEEE IEMTS Conference, San Francisco, USA, pp.122-125.

Conway, PP, Williams, DJ, Whalley, DC (1991) Joint-Level Thermal Modelling of Infra Red Reflow for Different Termination Geometries. In Proceedings of the 1st Joint International Conference on Factory Automation and Information Management, Limerick, Ireland, pp.219-228.

Conway, PP, Williams, DJ, Whalley, DC (1990) Experiments to Allow the Interpretation of a Computer Based Model of the Solder Paste Reflow Process. In Proceedings of the 6th International Conference on Computer Aided Production Engineering, London, pp.481-489.

Whalley, DC, Williams, DJ, Conway, PP (1990) The Development of a Thermal Model of the Infra Red Reflow Soldering of Electronic Assemblies. In IDEAS-CAEDS Users Conference, Proceedings of the IDEAS-CAEDS Users Conference, London, pp.9-19.

Conway, PP and Williams, DJ (1990) The Reduction of Image Ambiguity for Process Control Using Product Knowledge". In Proceedings of Factory 2001, Cambridge, UK, pp.139-143, ISBN: 0 86341704 3.

Whalley, DC, Conway, PP, Williams, DJ (1990) Thermal Modelling of Temperature Development During the Reflow Soldering of SMD Assemblies. In Proceedings of the 6th International Microelectronics Conference, Tokyo, Japan, pp.120-124.

Conway, PP, Williams, DJ, Tang, ACT, Sargent, PM, Whalley, DC (1990) Process Variables in the Reflow Soldering of Surface Mount. In 8th IEEE CHMT International Electronic Manufacturing Technology Symposium, Proceedings of the 8th IEEE CHMT Symposium, IEEE Cat.No. 90CH2833-2, Library of Congress No. 89-82530, Stresa, Italy, pp.385-394.



CD Objects

Huertas Quintero, LAM, Conway, PP, Whalley, DC, West, AA (2010) Deployment of a Reflow Process Model to Support Quality and Reliability in PCA Manufacturing,, ISBN: 978-1-4244-8561-1.

Li, D, Liu, C, Conway, PP (2006) Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads,, ISBN: 1-4244-0488-6.

Huang, Z, Conway, PP, Thomson, RC (2006) Microstructural considerations for ultrafine lead free solder joints,, ISBN: 1-4244-0276-x.

Conway, PP and Huang, Z (2005) Impacts of Pb-free legislation on European HDP,, ISBN: 0-7803-9293-0.

Kay, RW, de Gouruff, E, Desmulliez, MPY, Jackson, GJ, Steen, HAH, Liu, C, Conway, PP (2005) Stencil printing technology for wafer level bumping at sub-100 micron pitch using Pb-free alloys,.

Kay, RW, de Gourff, E, Abraham, E, Desmulliez, MPY, Jackson, GJ, Steen, HAH, Liu, C, Conway, PP (2005) Stencil printing for fine pitch wafer level bumping,.

Teh, NJ, Sarvar, F, Conway, PP (2003) Design of a Turbulence-enhanced Deaggregation System for Dry Powder Formulations,, ISBN: 0-7803-7790-7.

Huang, Z, Conway, PP, Liu, C, Thomson, RC (2003) Inter-dependence of Processing and Alloy Composition on the Reliability of Sn-based Lead Free Solders in Fine Pitch FCOB Interconnection,, ISBN: 0-7803-7933-0.

Liu, C, Conway, PP, Li, D, Hendriksen, M (2003) Analysis of the Micro-Mechanical Properties in Aged Lead-Free Fine Pitch Flip Chip Joints,, ISBN: 0-7918-3674-6.

Liu, C, Li, D, Conway, PP (2003) Characterisation of Intermetallic Ageing in Flip Chip Solder Bumps,.



Chapters

Conway, PP, Kumar, P, Dutta, I, Huang, Z (2017) Materials and Processing of TSV. In Li, Y and Goyal, D (ed) 3D Microelectronic Packaging From Fundamentals to Applications, Springer, pp.47-70, ISBN: 9783319445861. DOI: 10.1007/978-3-319-44586-1_3.

Conway, PP, Kumar, P, Dutta, I, Huang, Z (2017) Microstructural and reliability issues of TSV. In Li, Y and Goyal, D (ed) 3D Microelectronic Packaging From Fundamentals to Applications, Springer, pp.71-100, ISBN: 9783319445861. DOI: 10.1007/978-3-319-44586-1_4.

He, B, Petzing, J, Webb, P, Conway, P, Leach, R (2013) Characterisation of the Mechanical Bond Strength for Copper on Glass Plating Applications. In Characterisation of Areal Surface Texture, Springer Berlin Heidelberg, pp.303-320, ISBN: 9783642364570. DOI: 10.1007/978-3-642-36458-7_12.

Conway, PP and Williams, DJ (1998) Challenges in Solder Assembly Technologies. In Lee, YC and eds, WTC (ed) Manufacturing Challenges in Electronic packaging, Chapman and Hall, pp.82-113, ISBN: 0-412-62030-8.



School/Dept Working Papers

Conway, PP, West, AA, Palmer, PJ, Webb, DP, Jaggernauth, WA, Cottrill, MCW (2003) Challenges in Adopting Flexible Circuits for Wiring Harness Applications.

Cottrill, MCW, Conway, PP, Palmer, PJ, Astill, JT (2003) Large Area Flexible Circuits and Through Hole Interconnection.

Webb, DP, Jaggernauth, WA, Cottrill, MCW, West, AA, Conway, PP, Palmer, PJ (2003) EMC Performance of Large Area Flexible Printed Circuit Automotive Harnesses. Full text: http://dx.doi.org/10.1243/0954407041580102 .

Fu, EK, Williams, K, Conway, PP (2001) Welding Physics Deliverable 6.4. Model: Droplet Formation and Impact, Part 2: Impact.

Fu, EK, Williams, K, Conway, PP (2001) Welding Physics Deliverable 6.2. Model: Arc Droplet Welding.

Fu, EK, Williams, K, Conway, PP (2001) Welding Physics Deliverable 6.3. Model: Laser Droplet Welding.

Fu, E, Williams, K, Conway, PP (2001) Welding Physics Deliverable 6.2. Model: Arc Droplet Welding.

Fu, EK, Conway, PP, Williams, K (2001) Short Report on Droplet Welding Trials - Addendum.

Fu, EK, Conway, PP, Williams, K (2001) Short Report on Droplet Welding Trials, Part 3.

Fu, EK, Conway, PP, Williams, K (2000) Short Report on Laser Welding Trials at Bayerische Laserzentrum (BLZ) - Materials Analysis.

Fu, EK, Conway, PP, Williams, K (2000) Short Report on Droplet Welding Trials, Part 2.

Fu, EK, Conway, PP, Williams, K (2000) Short Report on Droplet Welding Trials, Part 1.

Fu, EK, Conway, PP, Williams, K (2000) Welding Physics, Deliverable 6.1.

Tan, X, Sarvar, F, Conway, PP (1999) Characterisation of Materials Properties for Laser Welding Simulation.

Sarvar, F and Conway, PP (1999) Qualitative Model of the Hybrid Laser Arc Welding Process.

Sarvar, F, Conway, PP, Whalley, DC (1996) A Process Modelling System for Reflow Soldering of Surface Mount Assemblies.

Coleman, P, Conway, PP, Sarvar, F (1996) Investigation of Reflow Oven Characteristics.

Kalantary, MR, Conway, PP, Williams, DJ (1995) Differential Scanning Calorimetry Measurements of Solder Materials.

Kalantary, MR and Conway, PP (1995) High Speed Video Observation of Convection Reflow Soldering.

Tilley, KJ, Williams, DJ, Conway, PP (1994) R & D in the Off-Shore Sites of Electronics Multi Nationals: Evidence from Singapore and Taiwan on Development and Capabilities.

Conway, PP (1994) Characterisation of the Formation of Surface Mount Solder Joints.

Gibbons, R, Williams, DJ, Conway, PP, West, AA, Pinpin, K (1994) Inspection Project Feasibility Study for ICL Kidsgrove.

Conway, PP (1993) Electronics Manufacturing in the Far East.

Conway, PP (1992) Single Surface Mount Termination Modelling, Part 1: Model Construction and Evolution.

Conway, PP (1992) Transcripts: Singaporean Based Electronics Manufacturing Enterprises.

Williams, DJ and Conway, PP (1992) Technology Migration in Multinational Enterprises.

Conway, PP (1990) Solder Displacement and Wicking.

Conway, PP, Williams, DJ, Tang, ACT, Sargent, PM, Whalley, DC (1990) Process Variables in the Reflow Soldering of Surface Mount.



Other

Conway, PP (2006) Associate Editor, IEEE Transactions on Electronic Packaging Manufacturing. Full text: http://www.cpmt.org/trans/tans-epm.html .

Conway, PP (2005) Associate Editor, IEEE Transactions on Electronics Packaging Manufacturing. Full text: http://www.cpmt.org/trans/trans-epm.html .

Conway, PP (2004) Associate Editor, IEEE Transactions on Electronics Packaging Manufacturing. Full text: http://www.cpmt.org/trans/trans-epm.html .

Conway, PP (2003) Associate Editor, IEEE Transactions on Electronics Packaging Manufacturing. Full text: http://www.cpmt.org/trans/trans-epm.html .

Conway, PP (2002) Editor-in-Chief, Journal of Electronics Manufacturing. Full text: http://www.worldscinet.com/jem/jem.shtml .

Conway, PP (2001) Editor-in-Chief, Journal of Electronics Manufacturing. Full text: http://www.worldscinet.com/jem/jem.shtml .

Conway, PP (2000) Editor-in-Chief, Journal of Electronics Manufacturing. Full text: http://www.worldscinet.com/jem/jem.shtml .

Conway, PP (1999) Editor-in-Chief, Journal of Electronics Manufacturing. Full text: http://www.worldscinet.com/jem/jem.shtml .

Conway, PP (1997) Flip Chip Bumping Processes.

Conway, PP and Sarvar, F (1996) Process Modelling of Surface Mount Assemblies, Video of Research Results.

Conway, PP (1996) Modelling the Process to Improve the Product, Seminar Presentation.

Charles, GP, Murgatroyd, IS, Conway, PP (1995) Report on Demonstrator System for Automated Testing of Fibre Optic Components, Consultancy Contract Report.

Conway, PP (1994) The Use of Integrating Spheres in Fibre Optic Component Test Operations, Consultancy Report.

Conway, PP, Kalantary, MR, Sarvar, F (1994) High Speed Video of Solder Paste Reflow Processes, Video Recording of Soldering Processes.

Williams, DJ, Conway, PP, Kalantary, MR (1993) The Effect of Particle Size on Surface Energy, Working Note.

Whalley, DC, Conway, PP, Ogunjimi, AO, Williams, DJ (1991) The Process Modelling of Infra-red Reflow Soldering of Surface Mount Components.

Williams, DJ, Whalley, DC, Conway, PP, Sargent, PM, Tang, ACT, Ogunjimi, AO (1991) Modelling the Reflow Soldering Process, Poster Paper.



Reports

Petzing, JN, He, B, Conway, P, Leach, R, Webb, P (2012) The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications, pp.1-25, National Physical Laboratory, Full text: http://www.npl.co.uk/ .

Petzing, JN, He, B, Conway, P, Webb, P, Leach, R (2012) The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications, pp.1-25, National Physical Laboratory.

Conway, PP, Smith, PR, Summers, R, Conway, J, Price, R (2005) e-Medic: Integrated Drug Delivery, p.21, ERSRC.

Webb, DP and Conway, PP (2004) FFD Copper Plating Process Phase 2, Part 2.2: Completion of Alternating Polarities and Plate-etch Processing, p.8, Consultancy Report, TDAO Ltd, Project No: WS/TDA/528.

Webb, DP, Conway, PP, Carpenter, ND, Hutt, DA, Palmer, PJ, Sandaver, AP (2003) FFD Copper Plating Phase 2: Derivation of Process Understanding for Optimisation Strategies, p.19, Consultancy Report, TDAO Ltd, Project No: WS/TDO/513.

Conway, PP, Fu, EKY, Liu, C, Sarvar, F, Webb, DP, Williams, K (2002) Droplet Weld: Low Cost Lead Free Joining with Droplet Technology, Final Report, Contract G1RD-CT-2000-00209.

Webb, DP, Conway, PP, Palmer, PJ, Hutt, DA, Carpenter, ND (2002) FFD Copper Plating - Proof of Principle and Proof of Concept, p.14, Consultancy Report, TDAO Ltd, Project No: WS/TDA/501.

Conway, PP (2001) Clean and Low Distortion Accurate Welding of Microparts, p.207, Final Report, Contract BRPR-CT98-0643.

Conway, PP, Whalley, DC, Williams, DJ (1996) Modelling and Experimental Investigation of Reflow Soldering, EPSRC/CDP/EPDM.

Williams, DJ and Conway, PP (1994) Globalisation of Electronics Manufacture, The Growth of an Electronics Industry, 6 plus aendices, SERC Final Report.

Conway, PP, Williams, DJ, Sarvar, F, Kalantary, MR (1993) Modelling and Experimental Investigation of Reflow Soldering, p.87, SERC/ACME.

Tilley, KJ, Williams, DJ, Conway, PP (1993) The Globalisation of Electronics Manufacture - The Growth of an Electronics Manufacturing Industry, p.32, SERC/ACME.

Williams, DJ and Conway, PP (1993) Technology Development and Evolution: Electronics Packaging and Interconnection, p.6, SERC.



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