Journal Articles
Qaiser, M, Woolley, E, Colwill, J, Hatton, F, Webb, P (2023)
Intelligent assessment of reusable plastic food packaging for a circular supply chain [Abstract],
Engineering Proceedings, 40(1), 12, DOI:
10.3390/engproc2023040012.
Cui, X, Webb, P, Rahimifard, S (2023)
Capability evaluation of real-time inline COD detection technique for dynamic water footprint management in the beverage manufacturing industry,
Water Resources and Industry, 30(2023), 100215, DOI:
10.1016/j.wri.2023.100215.
He, B,
Webb, DP, Petzing, J (2021)
Areal Surface Texture Parameters for Copper/Glass Plating Adhesion Characteristics,
Measurement Science Review, 21(1), pp.11-18, DOI:
10.2478/msr-2021-0002.
Abhyankar, H, Webb, P, West, G, Hutt, D (2020)
Characterization of metal-polymer interaction forces by AFM for insert molding applications,
Polymer Engineering and Science, 60(12), pp.3036-3045, ISSN: 0032-3888. DOI:
10.1002/pen.25534.
Sachidananda, M, Rahimifard, S, Webb, P (2020)
A decision tool for improving manufacturing water usage efficiency,
International Journal of Computer Integrated Manufacturing, 33(9), pp.823-839, ISSN: 0951-192X. DOI:
10.1080/0951192X.2020.1815846.
Skouteris, G, Webb, P, Shin, KLF, Rahimifard, S (2018)
Assessment of the capability of an optical sensor for in-line real-time wastewater quality analysis in food manufacturing,
Water Resources and Industry, 20, pp.75-81, ISSN: 2212-3717. DOI:
10.1016/j.wri.2018.10.002.
Webb, P, Skouteris, G, Rahimifard, S (2018)
In-plant real-time manufacturing water content characterisation,
Water Resources and Industry, ISSN: 2212-3717. DOI:
10.1016/j.wri.2018.08.003.
Sachidananda, M, Webb, P, Rahimifard, S (2016)
A concept of water usage efficiency to support water reduction in manufacturing industry,
Sustainability, 8(12), 1222, ISSN: 2071-1050. DOI:
10.3390/su8121222.
He, B, Petzing, J, Webb, P, Leach, R (2015)
Improving copper plating adhesion on glass using laser machining techniques and areal surface texture parameters,
Optics and Lasers in Engineering, 75, pp.39-47, ISSN: 0143-8166. DOI:
10.1016/j.optlaseng.2015.06.004.
Santaniello, T, Yan, Y, Tocchio, A, Martello, F, Gassa, F, Webb, P, Zhao, W, Tamplenizza, M, Schulte, C, Liu, Y, Hutt, D, Milani, P, Conway, P, Lenardi, C (2015)
On-chip single cell funneling operated by microfabricated thermo-responsive hydrogel layers,
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 25(7), pp.1-12, ISSN: 0960-1317. DOI:
10.1088/0960-1317/25/7/075004.
Zhao, W, Lenardi, C,
Webb, DP, Liu, C, Santaniello, T, Gassa, F (2013)
A methodology to analyse and simulate mechanical characteristics of poly(2-hydroxyethyl methacrylate) hydrogel,
Polymer International, 62, pp.1059-1067, DOI:
10.1002/pi.4392.
Santaniello, T, Martello, F, Tocchio, A, Gassa, F, Webb, P, Milani, P, Lenardi, C (2012)
Excimer laser micropatterning of freestanding thermo-responsive hydrogel layers for cells-on-chip applications,
Journal of Micromechanics and Microengineering, 22(10), pp.105033-105033, ISSN: 0960-1317. DOI:
10.1088/0960-1317/22/10/105033.
Zhao, W, Santaniello, T, Webb, P, Lenardi, C, Liu, C (2012)
A new approach towards an optimum design and manufacture of microfluidic devices based on ex situ fabricated hydrogel based thin films' integration,
2012 IEEE 62nd Electronic Components and Technology Conference, pp.1997-2004, DOI:
10.1109/ectc.2012.6249114.
Williams, O,
Webb, DP, Liu, C, Firth, P (2012)
Evaluation of contamination of ceramic surfaces and its effect on epoxy bleed,
International Journal of Adhesion and Adhesives, 32, pp.61-69, ISSN: 0143-7496. DOI:
10.1016/j.ijadhadh.2011.10.001.
Williams, O, Liu, C, Webb, P, Firth, P (2010)
Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies, ISSN: 0143-7496. DOI:
10.1016/j.ijadhadh.2010.02.001.
Knauf, BJ, Webb, P, Liu, C, Conway, P (2010)
Low frequency induction heating for the sealing of plastic microfluidic systems, ISSN: 1613-4982. DOI:
10.1007/s10404-009-0539-x.
Webb, P, Jaggernauth, WA, Cottrill, MCW, Palmer, P, West, A, Conway, P (2010)
Design and construction of large-area flexible printed-circuit automotive electrical interconnection harnesses, ISSN: 0954-4070. DOI:
10.1243/09544070JAUTO1175.
Webb, P, Hutt, D, Hopkinson, N, Conway, P, Palmer, P (2009)
Packaging of microfluidic devices for fluid interconnection using thermoplastics, ISSN: 1057-7157. DOI:
10.1109/JMEMS.2009.2013404.
Webb, P, Knauf, BJ, Liu, C, Hutt, D, Conway, P (2009)
Productionisation issues for commercialisation of microfluidic based devices, ISSN: 0260-2288. DOI:
10.1108/02602280910986601.
Webb, P, Liu, C, Sarvar, F, Conway, P, Williams, K (2007)
Adhesion of precision welded lead-free electrical interconnects formed by molten droplet deposition, ISSN: 0954-4054. DOI:
10.1243/09544054JEM365.
Webb, P, Reed, FM, Carpineta, P, Walsh, K (2006)
The UK electronics manufacturing industry 1997-2003: a case study of the effect of globalization, ISSN: 0954-4054. DOI:
10.1243/09544054B13704.
Reed, FM, Patrick Webb, D, Walsh, K, Carpineta, P (2004)
UK PCB Industry 1997 to 2003,
Circuit World, 30(3), pp.43-50, ISSN: 0305-6120. DOI:
10.1108/03056120410520614.
Webb, P, Jaggernauth, WA, Cottrill, MCW, West, A, Conway, P, Palmer, P (2004)
Electromagnetic compatibility performance of large area flexible printed circuit automotive harness, ISSN: 0954-4070. DOI:
10.1243/0954407041580102.
Webb, DP, Cottrill, MCW, Jaggernauth, WA, West, AA, Palmer, PJ, Conway, PP (2003)
Foresight Vehicle: Physical Media for Automotive Multiplex Networks Implemented on Large Area Flexible Printed Circuit Boards,
SAE Transactions 2002: Journal of Passenger Cars - Electronic and Electrical Systems, Paper No 2002-01-1130, pp.638-642.
Tang, CW, Chan, YC, Hung, KC,
Webb, DP (2001)
Nondestructive methodology for standoff height measurement of flip chip on flex (FCOF) by SAM,
IEEE Transactions on Advanced Packaging, 24(2), pp.163-168, ISSN: 1521-3323. DOI:
10.1109/6040.928750.
Lin, SH, Chan, YC,
Webb, DP, Lam, YW (2000)
Reliability in Modeling of Spectroscopic Ellipsometry,
physica status solidi (a), 182(2), pp.R1-R2, ISSN: 0031-8965. DOI:
10.1002/1521-396x(200012)182:23.0.co;2-g.
Lin, SH, Chan, YC,
Webb, DP, Lam, YW (2000)
Investigation of mis-estimation of structure of amorphous silicon films in ellipsometric modeling,
Journal of Non-Crystalline Solids, 276(1-3), pp.35-39, ISSN: 0022-3093. DOI:
10.1016/s0022-3093(00)00264-7.
Yu, ZQ, Chan, YC,
Webb, DP, Li, GY (2000)
Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM,
Journal of Electronic Packaging, 122(2), pp.172-177, ISSN: 1043-7398. DOI:
10.1115/1.483151.
Lin, SH, Chan, YC,
Webb, DP, Lam, YW (2000)
Gap states and stability of rapidly deposited hydrogenated amorphous silicon films,
Materials Science and Engineering: B, 72(2-3), pp.197-199, ISSN: 0921-5107. DOI:
10.1016/s0921-5107(99)00513-9.
Chen, B, Lee, C-S, Lee, S-T, Webb, P, Chan, Y-C, Gambling, W, Tian, H, Zhu, W (2000)
Improved Time-of-Flight Technique for Measuring Carrier Mobility in Thin Films of Organic Electroluminescent Materials,
Japanese Journal of Applied Physics, 39(3R), pp.1190-1190, ISSN: 0021-4922. DOI:
10.1143/jjap.39.1190.
Zou, X, Chan, YC,
Webb, DP, Lam, YW, Hu, YF, Beling, CD, Fung, S, Weng, HM (2000)
Photoinduced Dehydrogenation of Defects in Undopeda-Si:H Using Positron Annihilation Spectroscopy,
Physical Review Letters, 84(4), pp.769-772, ISSN: 0031-9007. DOI:
10.1103/physrevlett.84.769.
Reynolds, S, Main, C,
Webb, DP, Grabtchak, S (2000)
Bandwidth considerations in modulated and transient photoconductivity measurements to determine localized state distributions, ISSN: 0021-8979. DOI:
10.1063/1.373653.
Hung, KC, Chan, YC, Tu, PL, Ong, HC,
Webb, DP, Lai, JKL (2000)
Study of self-alignment of μBGA packages, ISSN: 1521-3323. DOI:
10.1109/6040.883752.
Lin, SH, Chan, YC,
Webb, DP, Lam, YW (1999)
Optical characterization of hydrogenated amorphous silicon thin films deposited at high rate,
Journal of Electronic Materials, 28(12), pp.1452-1456, ISSN: 0361-5235. DOI:
10.1007/s11664-999-0140-9.
Deng, Z, Lee, ST,
Webb, DP, Chan, YC, Gambling, WA (1999)
Carrier transport in thin films of organic electroluminescent materials,
Synthetic Metals, 107(2), pp.107-109, ISSN: 0379-6779. DOI:
10.1016/s0379-6779(99)00149-6.
Zou, X,
Webb, DP, Chan, YC, Lam, YW, Hu, YF, Fung, S, Beling, CD (1998)
Probing of microvoids in high-rate deposited a-Si: H thin films by variable energy positron annihilation spectroscopy,
Journal of Materials Research, 13(10), pp.2833-2840, ISSN: 0884-2914. DOI:
10.1557/jmr.1998.0387.
Zou, X,
Webb, DP, Chan, YC, Lam, YW, Hu, YF, Gong, M, Beling, CD, Fung, S (1998)
Depth profiling of vacancy-type defects in homogenous and multilayered a-Si films by positron beam Doppler broadening,
Journal of Non-Crystalline Solids, 227-230, pp.105-110, ISSN: 0022-3093. DOI:
10.1016/s0022-3093(98)00165-3.
Webb, DP, Main, C, Reynolds, S, Brüggemann, R, Chan, YC, Lam, YW (1998)
Sign reversal in transient photoconductivity in the presence of optical bias in undoped homogeneous a-Si:H,
Journal of Non-Crystalline Solids, 227-230, pp.211-215, ISSN: 0022-3093. DOI:
10.1016/s0022-3093(98)00053-2.
Webb, DP, Main, C, Reynolds, S, Chan, YC, Lam, YW, O’Leary, SK (1998)
Effects of bandwidth limitations on the localized state distribution calculated from transient photoconductivity data, ISSN: 0021-8979. DOI:
10.1063/1.367270.
Webb, DP, Zou, XC, Chan, YC, Lam, YW, Lin, SH, Lin, XY, Lin, KX, O'Leary, SK, Lim, PK (1998)
Evidence for deviations from a single-exponential distribution of conduction band tail states in hydrogenated amorphous silicon: A transient photocurrent analysis,
Solid State Communications, 105(4), pp.239-242, ISSN: 0038-1098. DOI:
10.1016/s0038-1098(97)10104-1.
Wang, Y, Chan, YC, Gui, ZL,
Webb, DP, Li, LT (1997)
Application of Weibull distribution analysis to the dielectric failure of multilayer ceramic capacitors,
Materials Science and Engineering: B, 47(3), pp.197-203, ISSN: 0921-5107. DOI:
10.1016/s0921-5107(97)00041-x.
Webb, DP, Chan, YC, Wong, CKH, Lam, YW, Leung, KM, Chrp, DS (1997)
Thermally stimulated current measurements on a UV irradiated organic photoreceptor layer,
Journal of Electronic Materials, 26(5), pp.470-473, ISSN: 0361-5235. DOI:
10.1007/s11664-997-0121-9.
Miao, XS, Chan, YC, Wong, CKH,
Webb, DP, Lam, YW, Leung, KM, Chiu, DS (1997)
Influence of AIN protective film thickness on the hardness and electrophotographic properties of organic photoconductors,
Journal of Electronic Materials, 26(4), pp.387-390, ISSN: 0361-5235. DOI:
10.1007/s11664-997-0107-7.
Hu, W, Chan, FYM,
Webb, DP, Chan, YC, Lam, YW (1996)
Analysis of the infrared transmission data of hydrogenated amorphous silicon film fabricated by high rate PECVD,
Journal of Electronic Materials, 25(12), pp.1837-1840, ISSN: 0361-5235. DOI:
10.1007/bf02657162.
Wong, CKH, Chan, YC, Lam, YW,
Webb, DP, Leung, KM, Chiu, DS (1996)
The modification of electrophotographic and mechanical properties of organic photoconductors by ultra-violet irradiation,
Journal of Electronic Materials, 25(9), pp.1451-1457, ISSN: 0361-5235. DOI:
10.1007/bf02655382.
Bayley, PA, Marshall, JM, Main, C,
Webb, DP, Van Swaaij, RACMM, Bezemer, J (1996)
Determination of the density of states in amorphous silicon-carbon alloys using a Fourier transformation of transient photocurrent data,
Journal of Non-Crystalline Solids, 198-200, pp.161-164, ISSN: 0022-3093. DOI:
10.1016/0022-3093(96)80018-4.
Main, C, Brüggemann, R,
Webb, DP, Reynolds, S (1993)
Time and frequency domain studies of photoconductivity in amorphous semiconductors,
Journal of Non-Crystalline Solids, 164-166, pp.481-484, ISSN: 0022-3093. DOI:
10.1016/0022-3093(93)90594-n.
Main, C, Brüggemann, R,
Webb, DP, Reynolds, S (1992)
Determination of gap-state distributions in amorphous semiconductors from transient photocurrents using a fourier transform technique,
Solid State Communications, 83(6), pp.401-405, ISSN: 0038-1098. DOI:
10.1016/0038-1098(92)90076-l.
Main, C,
Webb, DP, Brüggemann, R, Reynolds, S (1991)
Modulated and transient photoconductivity in a-As2 Se3,
Journal of Non-Crystalline Solids, 137-138, pp.951-954, ISSN: 0022-3093. DOI:
10.1016/s0022-3093(05)80278-9.
Conferences
Rahimifard, S, Woolley, E, Webb, P, Garcia-Garcia, G, Stone, J, Jellil, A, Gimenez-Escalante, P, Jagtap, S, Trollman, H (2017)
Forging new frontiers in sustainable food manufacturing. In
, Bologna, Italy, pp.13-24, ISBN: 9783319570778. DOI:
10.1007/978-3-319-57078-5_2.
Qi, S, Litchfield, R, Hutt, DA, Vaidhyanathan, B, Liu, C, Webb, P, Ebbens, S (2012)
Copper conductive adhesives for printed circuit interconnects. In
2012 IEEE 62nd Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd Electronic Components and Technology Conference, pp.1651-1655, DOI:
10.1109/ectc.2012.6249059.
He, B, Petzing, J, Webb, P, Leach, RK, Conway, P (2012)
The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass. In
,ISBN: 9780956679000.
He, B,
Webb, DP, Petzing, JN, Leach, R (2011) Improving plated copper adhesion for metallisation of glass PCBs. In
12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP2011), Proceedings of the 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP2011), Shanghai, China, pp.284-288, ISBN: 978-1-4577-1768-0.
Abhyankar, H,
Webb, DP, Hutt, DA (2010) Effect of Insert Temperature on Integrity of a Thermoplastic Circuit Board. In
12th Electronics Packaging Technology Conference, Singapore, pp.1-6.
Wassay, A, Liu, C, Williams, O,
Webb, DP, Firth, P (2010)
Accuracy and repeatability of laser micromachined passive alignment features on ceramic optoelectronic substrates. In
2010 12th Electronics Packaging Technology Conference - (EPTC 2010), 2010 12th Electronics Packaging Technology Conference, pp.511-516, DOI:
10.1109/eptc.2010.5702693.
Knauf, BJ (2010)
Polymer bonding by induction heating for microfluidic applications. In
.
Williams, O, Liu, C,
Webb, DP, Firth, P (2009)
Adsorbed contamination of ceramic surfaces stored in industrial ambient conditions and its effect on epoxy bleed. In
Proceedings of the 11th Electronics Packaging Technology Conference, EPTC '09, Singapore, pp.500-505, DOI:
10.1109/EPTC.2009.5416497.
Williams, O, Williams, M, Liu, C,
Webb, DP, Firth, P (2009)
Laser micromachining of polycrystalline alumina and aluminium nitride to enable compact optoelectronic interconnects. In
Proceedings of the 11th Electronics Packaging Technology Conference, EPTC '09, Singapore, pp.920-925, DOI:
10.1109/EPTC.2009.5416413.
Webb, DP, Conway, PP, Hutt, DA, Knauf, BJ, Liu, CC (2009) Processes for Integration of Microfluidic Based Devices. In
17th European Microelectronics and Packaging Conference (EMPC), Rimini, Italy, pp.1-7.
Abhyankar, H,
Webb, DP, Hutt, DA, West, G (2008) Adhesion of Thermoplastics to Materials used in Electronics (TIN). In
10th Electronics Packaging Technology Conference, Singapore, pp.296-303.
Knauf, JB,
Webb, DP, Liu, CC, Conway, PP (2008) Packaging of polymer based microfluidic systems using low frequency induction heating (LFIH). In
Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), Shanghai, PRC, pp.1-6.
Williams, O, Liu, CC,
Webb, DP, Firth, P (2008) Epoxy adhesion strength to ceramic surfaces in commercial optoelectronic assemblies. In
Proceedings of the 58th Electronics Components and Technology Conference, 2008, ECTC 2008, Lake Buena Vista, Florida, USA, pp.1673-1678.
Webb, P, Hutt, D, Whalley, D, Palmer, P (2008)
A substrateless process for sustainable manufacture of electronic assemblies. In
,ISBN: 9781424428137. DOI:
10.1109/ESTC.2008.4684401.
Knauf, BJ,
Webb, DP, Liu, CC, Conway, PP (2008) Plastic Packaging Using Low Frequency Induction Heating (LFIH) for Microsystems. In
10th International IEEE Electronics Packaging Technology Conference, Proceedings of the 10th International IEEE Electronics Packaging Technology Conference, Singapore, 9th - 12th December 2008, pp.172-180, ISBN: 9781424421183.
Dou, G, Webb, P, Whalley, D, Hutt, D, Wilson, AR (2008)
Current leakage failure of conformally coated electronic assemblies. In
,ISBN: 9781424428137. DOI:
10.1109/ESTC.2008.4684526.
Knauf, BJ,
Webb, DP, Liu, C, Conway, PP (2008)
Packaging of Polymer Based Microfluidic Systems Using Low Frequency Induction Heating (LFIH). In
, 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, pp.57-62, ISBN: 978-1-4244-2739-0.
Webb, DP, Hutt, DA, Hopkinson, N, Palmer, PJ, Conway, PP (2006) Integration and packaging of microsystems by polymer overmoulding. In
Proceedings of the 1st Electronics Systemintegration Technology Conference, Dresden, Germany, pp.567-574.
Webb, DP, Hsu, CC, Hutt, DA, Hopkinson, N, Conway, PP, Palmer, PJ (2005) Polymer overmoulding for microfluidic device packaging and system integration. In
Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, pp.134-139, ISBN: 0-7803-9553-0.
Cottrill, MC, Jaggernauth, WA,
Webb, DP, Palmer, PJ, Conway, PP, West, AA (2002) Foresight Vehicle: Large Area Flexible Circuits for Automotive Applications Manufacturing Technology - A Review of Process Options. In
Proceedings of the Society of Automotive Engineers World Congress and Exposition, SAE Paper No 2002-01-1127, Detroit, USA, pp.1-9.
Jaggernauth, WA,
Webb, DP, Cottrill, MC, Palmer, PJ, Conway, PP, West, AA (2002) Foresight Vehicle: Specification and Acceptability Criteria for Copper-Clad Dielectric Materials Used in Large Automotive Flexible Printed Circuits. In
Proceedings of the Society of Automotive Engineers World Congress and Exposition, SAE Paper No 2002-01-1129, Detroit, USA, pp.1-5.
Reynolds, C. Main, D. P. Webb, M. J, S (2000)
An experimental evaluation of transient and modulated photocurrent density-of-states spectroscopies. In
, Philosophical Magazine B, pp.547-559, DOI:
10.1080/014186300255203.
Reynolds, S, Main, C,
Webb, DP, Rose, MJ (2000)
An experimental evaluation of transient and modulated photocurrent density-of-states spectroscopies. In
, Philosophical Magazine B, pp.547-559, DOI:
10.1080/13642810008209763.
Hutt, D, Whalley, D, Webb, P, Hung, KC, Tang, CW, Conway, P, Chan, UC (2000)
Scanning acoustic microscopy investigation of engineered flip-chip delamination. In
,ISBN: 0780364821.
Tang, CW, Chan, YC, Hung, KC,
Webb, DP (2000) Standoff height measurement of flip chip assemblies by Scanning Acoustic Microscopy. In
, Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp.189-197.
Zou, X, Chan, YC,
Webb, DP, Lam, YW, Lin, SH, Chan, FYM, Hu, YF, Weng, X, Beling, CD, Fung, S (1998)
Identification of Vacancy-Like Defects in High-Rate Grown a-Si Before and After Light Soaking by Vepas. In
, MRS Proceedings. DOI:
10.1557/proc-507-637.
Zou, X, Chan, YC,
Webb, DP, Lam, YW, Chan, FYM, Lin, SH, Hu, YF, Beling, CD, Fung, S (1998)
INTERFACE CHARACTERISATION AND INTERNAL ELECTRIC FIELD EVALUATION OF a-Si:H PIN SOLAR CELL BY VARIABLE ENERGY POSITRON ANNIHILATION SPECTROSCOPY. In
, MRS Proceedings. DOI:
10.1557/proc-507-643.
Webb, DP, Chan, FYM, Zou, XC, Chan, YC, Lam, YW, Lin, SH, O'Leary, SK, Lim, PK (1997)
Experimental Determination of the Distribution of Tail States of Hydrogenated Amorphous Silicon: A Transient Photocurrent Analysis. In
, MRS Proceedings. DOI:
10.1557/proc-467-257.
Zou, X,
Webb, DP, Chan, YC, Lam, YW, Xu, Z (1997)
Interfacial effects on characteristics of a-Si TFT. In
, Proceedings of the Asian Symposium on Information Display, pp.69-72, DOI:
10.1109/asid.1997.631401.
Zou, X,
Webb, DP, Chan, YC, Lam, YW, Xu, Z (1997)
Study of gate-to-source parasitic capacitance in a-Si TFT. In
, Proceedings of the Asian Symposium on Information Display, pp.203-206, DOI:
10.1109/asid.1997.631437.
Zou, X,
Webb, DP, Lin, SH, Lam, YW, Chan, YC, Hu, YF, Beling, CD, Fung, S (1997)
Study of Microvoids in High-Rate a-Si:H Using Positron Annihilation. In
, MRS Proceedings. DOI:
10.1557/proc-467-525.
Brueggemann, R, Main, C, Roesch, M,
Webb, DP (1996) Determination of the density of states in a-SiC:H from transient photoconductivity. In
, Materials Research Society Symposium - Proceedings, pp.697-702.
