Journal Articles

Qaiser, M, Woolley, E, Colwill, J, Hatton, F, Webb, P (2023) Intelligent assessment of reusable plastic food packaging for a circular supply chain [Abstract], Engineering Proceedings, 40(1), 12, DOI: 10.3390/engproc2023040012.

Cui, X, Webb, P, Rahimifard, S (2023) Capability evaluation of real-time inline COD detection technique for dynamic water footprint management in the beverage manufacturing industry, Water Resources and Industry, 30(2023), 100215, DOI: 10.1016/j.wri.2023.100215.

He, B, Webb, DP, Petzing, J (2021) Areal Surface Texture Parameters for Copper/Glass Plating Adhesion Characteristics, Measurement Science Review, 21(1), pp.11-18, DOI: 10.2478/msr-2021-0002.

Abhyankar, H, Webb, P, West, G, Hutt, D (2020) Characterization of metal-polymer interaction forces by AFM for insert molding applications, Polymer Engineering and Science, 60(12), pp.3036-3045, ISSN: 0032-3888. DOI: 10.1002/pen.25534.

Sachidananda, M, Rahimifard, S, Webb, P (2020) A decision tool for improving manufacturing water usage efficiency, International Journal of Computer Integrated Manufacturing, 33(9), pp.823-839, ISSN: 0951-192X. DOI: 10.1080/0951192X.2020.1815846.

Skouteris, G, Webb, P, Shin, KLF, Rahimifard, S (2018) Assessment of the capability of an optical sensor for in-line real-time wastewater quality analysis in food manufacturing, Water Resources and Industry, 20, pp.75-81, ISSN: 2212-3717. DOI: 10.1016/j.wri.2018.10.002.

Webb, P, Skouteris, G, Rahimifard, S (2018) In-plant real-time manufacturing water content characterisation, Water Resources and Industry, ISSN: 2212-3717. DOI: 10.1016/j.wri.2018.08.003.

Sachidananda, M, Webb, P, Rahimifard, S (2016) A concept of water usage efficiency to support water reduction in manufacturing industry, Sustainability, 8(12), 1222, ISSN: 2071-1050. DOI: 10.3390/su8121222.

He, B, Petzing, J, Webb, P, Leach, R (2015) Improving copper plating adhesion on glass using laser machining techniques and areal surface texture parameters, Optics and Lasers in Engineering, 75, pp.39-47, ISSN: 0143-8166. DOI: 10.1016/j.optlaseng.2015.06.004.

Santaniello, T, Yan, Y, Tocchio, A, Martello, F, Gassa, F, Webb, P, Zhao, W, Tamplenizza, M, Schulte, C, Liu, Y, Hutt, D, Milani, P, Conway, P, Lenardi, C (2015) On-chip single cell funneling operated by microfabricated thermo-responsive hydrogel layers, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 25(7), pp.1-12, ISSN: 0960-1317. DOI: 10.1088/0960-1317/25/7/075004.

Zhao, W, Lenardi, C, Webb, DP, Liu, C, Santaniello, T, Gassa, F (2013) A methodology to analyse and simulate mechanical characteristics of poly(2-hydroxyethyl methacrylate) hydrogel, Polymer International, 62, pp.1059-1067, DOI: 10.1002/pi.4392.

Santaniello, T, Martello, F, Tocchio, A, Gassa, F, Webb, P, Milani, P, Lenardi, C (2012) Excimer laser micropatterning of freestanding thermo-responsive hydrogel layers for cells-on-chip applications, Journal of Micromechanics and Microengineering, 22(10), pp.105033-105033, ISSN: 0960-1317. DOI: 10.1088/0960-1317/22/10/105033.

Zhao, W, Santaniello, T, Webb, P, Lenardi, C, Liu, C (2012) A new approach towards an optimum design and manufacture of microfluidic devices based on ex situ fabricated hydrogel based thin films' integration, 2012 IEEE 62nd Electronic Components and Technology Conference, DOI: 10.1109/ectc.2012.6249114.

Williams, O, Webb, DP, Liu, C, Firth, P (2012) Evaluation of contamination of ceramic surfaces and its effect on epoxy bleed, International Journal of Adhesion and Adhesives, 32, pp.61-69, ISSN: 0143-7496. DOI: 10.1016/j.ijadhadh.2011.10.001.

Williams, O, Liu, C, Webb, P, Firth, P (2010) Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies, ISSN: 0143-7496. DOI: 10.1016/j.ijadhadh.2010.02.001.

Knauf, BJ, Webb, P, Liu, C, Conway, P (2010) Low frequency induction heating for the sealing of plastic microfluidic systems, ISSN: 1613-4982. DOI: 10.1007/s10404-009-0539-x.

Webb, P, Jaggernauth, WA, Cottrill, MCW, Palmer, P, West, A, Conway, P (2010) Design and construction of large-area flexible printed-circuit automotive electrical interconnection harnesses, ISSN: 0954-4070. DOI: 10.1243/09544070JAUTO1175.

Webb, P, Hutt, D, Hopkinson, N, Conway, P, Palmer, P (2009) Packaging of microfluidic devices for fluid interconnection using thermoplastics, ISSN: 1057-7157. DOI: 10.1109/JMEMS.2009.2013404.

Webb, P, Knauf, BJ, Liu, C, Hutt, D, Conway, P (2009) Productionisation issues for commercialisation of microfluidic based devices, ISSN: 0260-2288. DOI: 10.1108/02602280910986601.

Webb, P, Liu, C, Sarvar, F, Conway, P, Williams, K (2007) Adhesion of precision welded lead-free electrical interconnects formed by molten droplet deposition, ISSN: 0954-4054. DOI: 10.1243/09544054JEM365.

Webb, P, Reed, FM, Carpineta, P, Walsh, K (2006) The UK electronics manufacturing industry 1997-2003: a case study of the effect of globalization, ISSN: 0954-4054. DOI: 10.1243/09544054B13704.

Reed, FM, Patrick Webb, D, Walsh, K, Carpineta, P (2004) UK PCB Industry 1997 to 2003, Circuit World, 30(3), pp.43-50, ISSN: 0305-6120. DOI: 10.1108/03056120410520614.

Webb, P, Jaggernauth, WA, Cottrill, MCW, West, A, Conway, P, Palmer, P (2004) Electromagnetic compatibility performance of large area flexible printed circuit automotive harness, ISSN: 0954-4070. DOI: 10.1243/0954407041580102.

Webb, DP, Cottrill, MCW, Jaggernauth, WA, West, AA, Palmer, PJ, Conway, PP (2003) Foresight Vehicle: Physical Media for Automotive Multiplex Networks Implemented on Large Area Flexible Printed Circuit Boards, SAE Transactions 2002: Journal of Passenger Cars - Electronic and Electrical Systems, Paper No 2002-01-1130, pp.638-642.

Tang, CW, Chan, YC, Hung, KC, Webb, DP (2001) Nondestructive methodology for standoff height measurement of flip chip on flex (FCOF) by SAM, IEEE Transactions on Advanced Packaging, 24(2), pp.163-168, ISSN: 1521-3323. DOI: 10.1109/6040.928750.

Lin, SH, Chan, YC, Webb, DP, Lam, YW (2000) Reliability in Modeling of Spectroscopic Ellipsometry, physica status solidi (a), 182(2), pp.R1-R2, ISSN: 0031-8965. DOI: 10.1002/1521-396x(200012)182:23.0.co;2-g.

Lin, SH, Chan, YC, Webb, DP, Lam, YW (2000) Investigation of mis-estimation of structure of amorphous silicon films in ellipsometric modeling, Journal of Non-Crystalline Solids, 276(1-3), pp.35-39, ISSN: 0022-3093. DOI: 10.1016/s0022-3093(00)00264-7.

Yu, ZQ, Chan, YC, Webb, DP, Li, GY (2000) Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM, Journal of Electronic Packaging, 122(2), pp.172-177, ISSN: 1043-7398. DOI: 10.1115/1.483151.

Lin, SH, Chan, YC, Webb, DP, Lam, YW (2000) Gap states and stability of rapidly deposited hydrogenated amorphous silicon films, Materials Science and Engineering: B, 72(2-3), pp.197-199, ISSN: 0921-5107. DOI: 10.1016/s0921-5107(99)00513-9.

Chen, B, Lee, C-S, Lee, S-T, Webb, P, Chan, Y-C, Gambling, W, Tian, H, Zhu, W (2000) Improved Time-of-Flight Technique for Measuring Carrier Mobility in Thin Films of Organic Electroluminescent Materials, Japanese Journal of Applied Physics, 39(3R), pp.1190-1190, ISSN: 0021-4922. DOI: 10.1143/jjap.39.1190.

Zou, X, Chan, YC, Webb, DP, Lam, YW, Hu, YF, Beling, CD, Fung, S, Weng, HM (2000) Photoinduced Dehydrogenation of Defects in Undopeda-Si:H Using Positron Annihilation Spectroscopy, Physical Review Letters, 84(4), pp.769-772, ISSN: 0031-9007. DOI: 10.1103/physrevlett.84.769.

Reynolds, S, Main, C, Webb, DP, Grabtchak, S (2000) Bandwidth considerations in modulated and transient photoconductivity measurements to determine localized state distributions, ISSN: 0021-8979. DOI: 10.1063/1.373653.

Hung, KC, Chan, YC, Tu, PL, Ong, HC, Webb, DP, Lai, JKL (2000) Study of self-alignment of μBGA packages, ISSN: 1521-3323. DOI: 10.1109/6040.883752.

Lin, SH, Chan, YC, Webb, DP, Lam, YW (1999) Optical characterization of hydrogenated amorphous silicon thin films deposited at high rate, Journal of Electronic Materials, 28(12), pp.1452-1456, ISSN: 0361-5235. DOI: 10.1007/s11664-999-0140-9.

Deng, Z, Lee, ST, Webb, DP, Chan, YC, Gambling, WA (1999) Carrier transport in thin films of organic electroluminescent materials, Synthetic Metals, 107(2), pp.107-109, ISSN: 0379-6779. DOI: 10.1016/s0379-6779(99)00149-6.

Zou, X, Webb, DP, Chan, YC, Lam, YW, Hu, YF, Fung, S, Beling, CD (1998) Probing of microvoids in high-rate deposited a-Si: H thin films by variable energy positron annihilation spectroscopy, Journal of Materials Research, 13(10), pp.2833-2840, ISSN: 0884-2914. DOI: 10.1557/jmr.1998.0387.

Zou, X, Webb, DP, Chan, YC, Lam, YW, Hu, YF, Gong, M, Beling, CD, Fung, S (1998) Depth profiling of vacancy-type defects in homogenous and multilayered a-Si films by positron beam Doppler broadening, Journal of Non-Crystalline Solids, 227-230, pp.105-110, ISSN: 0022-3093. DOI: 10.1016/s0022-3093(98)00165-3.

Webb, DP, Main, C, Reynolds, S, Brüggemann, R, Chan, YC, Lam, YW (1998) Sign reversal in transient photoconductivity in the presence of optical bias in undoped homogeneous a-Si:H, Journal of Non-Crystalline Solids, 227-230, pp.211-215, ISSN: 0022-3093. DOI: 10.1016/s0022-3093(98)00053-2.

Webb, DP, Main, C, Reynolds, S, Chan, YC, Lam, YW, O’Leary, SK (1998) Effects of bandwidth limitations on the localized state distribution calculated from transient photoconductivity data, ISSN: 0021-8979. DOI: 10.1063/1.367270.

Webb, DP, Zou, XC, Chan, YC, Lam, YW, Lin, SH, Lin, XY, Lin, KX, O'Leary, SK, Lim, PK (1998) Evidence for deviations from a single-exponential distribution of conduction band tail states in hydrogenated amorphous silicon: A transient photocurrent analysis, Solid State Communications, 105(4), pp.239-242, ISSN: 0038-1098. DOI: 10.1016/s0038-1098(97)10104-1.

Wang, Y, Chan, YC, Gui, ZL, Webb, DP, Li, LT (1997) Application of Weibull distribution analysis to the dielectric failure of multilayer ceramic capacitors, Materials Science and Engineering: B, 47(3), pp.197-203, ISSN: 0921-5107. DOI: 10.1016/s0921-5107(97)00041-x.

Webb, DP, Chan, YC, Wong, CKH, Lam, YW, Leung, KM, Chrp, DS (1997) Thermally stimulated current measurements on a UV irradiated organic photoreceptor layer, Journal of Electronic Materials, 26(5), pp.470-473, ISSN: 0361-5235. DOI: 10.1007/s11664-997-0121-9.

Miao, XS, Chan, YC, Wong, CKH, Webb, DP, Lam, YW, Leung, KM, Chiu, DS (1997) Influence of AIN protective film thickness on the hardness and electrophotographic properties of organic photoconductors, Journal of Electronic Materials, 26(4), pp.387-390, ISSN: 0361-5235. DOI: 10.1007/s11664-997-0107-7.

Hu, W, Chan, FYM, Webb, DP, Chan, YC, Lam, YW (1996) Analysis of the infrared transmission data of hydrogenated amorphous silicon film fabricated by high rate PECVD, Journal of Electronic Materials, 25(12), pp.1837-1840, ISSN: 0361-5235. DOI: 10.1007/bf02657162.

Wong, CKH, Chan, YC, Lam, YW, Webb, DP, Leung, KM, Chiu, DS (1996) The modification of electrophotographic and mechanical properties of organic photoconductors by ultra-violet irradiation, Journal of Electronic Materials, 25(9), pp.1451-1457, ISSN: 0361-5235. DOI: 10.1007/bf02655382.

Bayley, PA, Marshall, JM, Main, C, Webb, DP, Van Swaaij, RACMM, Bezemer, J (1996) Determination of the density of states in amorphous silicon-carbon alloys using a Fourier transformation of transient photocurrent data, Journal of Non-Crystalline Solids, 198-200, pp.161-164, ISSN: 0022-3093. DOI: 10.1016/0022-3093(96)80018-4.

Main, C, Brüggemann, R, Webb, DP, Reynolds, S (1993) Time and frequency domain studies of photoconductivity in amorphous semiconductors, Journal of Non-Crystalline Solids, 164-166, pp.481-484, ISSN: 0022-3093. DOI: 10.1016/0022-3093(93)90594-n.

Main, C, Brüggemann, R, Webb, DP, Reynolds, S (1992) Determination of gap-state distributions in amorphous semiconductors from transient photocurrents using a fourier transform technique, Solid State Communications, 83(6), pp.401-405, ISSN: 0038-1098. DOI: 10.1016/0038-1098(92)90076-l.

Main, C, Webb, DP, Brüggemann, R, Reynolds, S (1991) Modulated and transient photoconductivity in a-As2 Se3, Journal of Non-Crystalline Solids, 137-138, pp.951-954, ISSN: 0022-3093. DOI: 10.1016/s0022-3093(05)80278-9.

Conferences

Rahimifard, S, Woolley, E, Webb, P, Garcia-Garcia, G, Stone, J, Jellil, A, Gimenez-Escalante, P, Jagtap, S, Trollman, H (2017) Forging new frontiers in sustainable food manufacturing. In , Bologna, Italy, pp.13-24, ISBN: 9783319570778. DOI: 10.1007/978-3-319-57078-5_2.

Qi, S, Litchfield, R, Hutt, DA, Vaidhyanathan, B, Liu, C, Webb, P, Ebbens, S (2012) Copper conductive adhesives for printed circuit interconnects. In 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd Electronic Components and Technology Conference. DOI: 10.1109/ectc.2012.6249059.

He, B, Petzing, J, Webb, P, Leach, RK, Conway, P (2012) The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass. In ,ISBN: 9780956679000.

He, B, Webb, DP, Petzing, JN, Leach, R (2011) Improving plated copper adhesion for metallisation of glass PCBs. In 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP2011), Proceedings of the 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP2011), Shanghai, China, pp.284-288, ISBN: 978-1-4577-1768-0.

Abhyankar, H, Webb, DP, Hutt, DA (2010) Effect of Insert Temperature on Integrity of a Thermoplastic Circuit Board. In 12th Electronics Packaging Technology Conference, Singapore, pp.1-6.

Wassay, A, Liu, C, Williams, O, Webb, DP, Firth, P (2010) Accuracy and repeatability of laser micromachined passive alignment features on ceramic optoelectronic substrates. In 2010 12th Electronics Packaging Technology Conference - (EPTC 2010), 2010 12th Electronics Packaging Technology Conference. DOI: 10.1109/eptc.2010.5702693.

Knauf, BJ (2010) Polymer bonding by induction heating for microfluidic applications. In .

Williams, O, Liu, C, Webb, DP, Firth, P (2009) Adsorbed contamination of ceramic surfaces stored in industrial ambient conditions and its effect on epoxy bleed. In Proceedings of the 11th Electronics Packaging Technology Conference, EPTC '09, Singapore, pp.500-505, DOI: 10.1109/EPTC.2009.5416497.

Williams, O, Williams, M, Liu, C, Webb, DP, Firth, P (2009) Laser micromachining of polycrystalline alumina and aluminium nitride to enable compact optoelectronic interconnects. In Proceedings of the 11th Electronics Packaging Technology Conference, EPTC '09, Singapore, pp.920-925, DOI: 10.1109/EPTC.2009.5416413.

Webb, DP, Conway, PP, Hutt, DA, Knauf, BJ, Liu, CC (2009) Processes for Integration of Microfluidic Based Devices. In 17th European Microelectronics and Packaging Conference (EMPC), Rimini, Italy, pp.1-7.

Abhyankar, H, Webb, DP, Hutt, DA, West, G (2008) Adhesion of Thermoplastics to Materials used in Electronics (TIN). In 10th Electronics Packaging Technology Conference, Singapore, pp.296-303.

Knauf, JB, Webb, DP, Liu, CC, Conway, PP (2008) Packaging of polymer based microfluidic systems using low frequency induction heating (LFIH). In Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), Shanghai, PRC, pp.1-6.

Williams, O, Liu, CC, Webb, DP, Firth, P (2008) Epoxy adhesion strength to ceramic surfaces in commercial optoelectronic assemblies. In Proceedings of the 58th Electronics Components and Technology Conference, 2008, ECTC 2008, Lake Buena Vista, Florida, USA, pp.1673-1678.

Webb, P, Hutt, D, Whalley, D, Palmer, P (2008) A substrateless process for sustainable manufacture of electronic assemblies. In ,ISBN: 9781424428137. DOI: 10.1109/ESTC.2008.4684401.

Knauf, BJ, Webb, DP, Liu, CC, Conway, PP (2008) Plastic Packaging Using Low Frequency Induction Heating (LFIH) for Microsystems. In 10th International IEEE Electronics Packaging Technology Conference, Proceedings of the 10th International IEEE Electronics Packaging Technology Conference, Singapore, 9th - 12th December 2008, pp.172-180, ISBN: 9781424421183.

Dou, G, Webb, P, Whalley, D, Hutt, D, Wilson, AR (2008) Current leakage failure of conformally coated electronic assemblies. In ,ISBN: 9781424428137. DOI: 10.1109/ESTC.2008.4684526.

Knauf, BJ, Webb, DP, Liu, C, Conway, PP (2008) Packaging of Polymer Based Microfluidic Systems Using Low Frequency Induction Heating (LFIH). In , 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, pp.57-62, ISBN: 978-1-4244-2739-0.

Webb, DP, Hutt, DA, Hopkinson, N, Palmer, PJ, Conway, PP (2006) Integration and packaging of microsystems by polymer overmoulding. In Proceedings of the 1st Electronics Systemintegration Technology Conference, Dresden, Germany, pp.567-574.

Webb, DP, Hsu, CC, Hutt, DA, Hopkinson, N, Conway, PP, Palmer, PJ (2005) Polymer overmoulding for microfluidic device packaging and system integration. In Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, pp.134-139, ISBN: 0-7803-9553-0.

Cottrill, MC, Jaggernauth, WA, Webb, DP, Palmer, PJ, Conway, PP, West, AA (2002) Foresight Vehicle: Large Area Flexible Circuits for Automotive Applications Manufacturing Technology - A Review of Process Options. In Proceedings of the Society of Automotive Engineers World Congress and Exposition, SAE Paper No 2002-01-1127, Detroit, USA, pp.1-9.

Jaggernauth, WA, Webb, DP, Cottrill, MC, Palmer, PJ, Conway, PP, West, AA (2002) Foresight Vehicle: Specification and Acceptability Criteria for Copper-Clad Dielectric Materials Used in Large Automotive Flexible Printed Circuits. In Proceedings of the Society of Automotive Engineers World Congress and Exposition, SAE Paper No 2002-01-1129, Detroit, USA, pp.1-5.

Reynolds, C. Main, D. P. Webb, M. J, S (2000) An experimental evaluation of transient and modulated photocurrent density-of-states spectroscopies. In , Philosophical Magazine B, pp.547-559, DOI: 10.1080/014186300255203.

Reynolds, S, Main, C, Webb, DP, Rose, MJ (2000) An experimental evaluation of transient and modulated photocurrent density-of-states spectroscopies. In , Philosophical Magazine B, pp.547-559, DOI: 10.1080/13642810008209763.

Hutt, D, Whalley, D, Webb, P, Hung, KC, Tang, CW, Conway, P, Chan, UC (2000) Scanning acoustic microscopy investigation of engineered flip-chip delamination. In ,ISBN: 0780364821.

Tang, CW, Chan, YC, Hung, KC, Webb, DP (2000) Standoff height measurement of flip chip assemblies by Scanning Acoustic Microscopy. In , Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp.189-197.

Zou, X, Chan, YC, Webb, DP, Lam, YW, Lin, SH, Chan, FYM, Hu, YF, Weng, X, Beling, CD, Fung, S (1998) Identification of Vacancy-Like Defects in High-Rate Grown a-Si Before and After Light Soaking by Vepas. In , MRS Proceedings. DOI: 10.1557/proc-507-637.

Zou, X, Chan, YC, Webb, DP, Lam, YW, Chan, FYM, Lin, SH, Hu, YF, Beling, CD, Fung, S (1998) INTERFACE CHARACTERISATION AND INTERNAL ELECTRIC FIELD EVALUATION OF a-Si:H PIN SOLAR CELL BY VARIABLE ENERGY POSITRON ANNIHILATION SPECTROSCOPY. In , MRS Proceedings. DOI: 10.1557/proc-507-643.

Webb, DP, Chan, FYM, Zou, XC, Chan, YC, Lam, YW, Lin, SH, O'Leary, SK, Lim, PK (1997) Experimental Determination of the Distribution of Tail States of Hydrogenated Amorphous Silicon: A Transient Photocurrent Analysis. In , MRS Proceedings. DOI: 10.1557/proc-467-257.

Zou, X, Webb, DP, Chan, YC, Lam, YW, Xu, Z (1997) Interfacial effects on characteristics of a-Si TFT. In , Proceedings of the Asian Symposium on Information Display, pp.69-72, DOI: 10.1109/asid.1997.631401.

Zou, X, Webb, DP, Chan, YC, Lam, YW, Xu, Z (1997) Study of gate-to-source parasitic capacitance in a-Si TFT. In , Proceedings of the Asian Symposium on Information Display, pp.203-206, DOI: 10.1109/asid.1997.631437.

Zou, X, Webb, DP, Lin, SH, Lam, YW, Chan, YC, Hu, YF, Beling, CD, Fung, S (1997) Study of Microvoids in High-Rate a-Si:H Using Positron Annihilation. In , MRS Proceedings. DOI: 10.1557/proc-467-525.

Brueggemann, R, Main, C, Roesch, M, Webb, DP (1996) Determination of the density of states in a-SiC:H from transient photoconductivity. In , Materials Research Society Symposium - Proceedings, pp.697-702.

Chapters

He, B, Petzing, J, Webb, P, Conway, P, Leach, R (2013) Characterisation of the Mechanical Bond Strength for Copper on Glass Plating Applications. In Characterisation of Areal Surface Texture, Springer Berlin Heidelberg, pp.303-320, ISBN: 9783642364570. DOI: 10.1007/978-3-642-36458-7_12.

Datasets

Webb, P, Cui, X, Rahimifard, S (2023) Experimental data for paper "Capability evaluation of real-time inline COD detection technique for dynamic water footprint management in the beverage manufacturing industry", DOI: 10.17028/rd.lboro.23641647.

Skouteris, G, Webb, P, Shin, KLF, Rahimifard, S (2018) Data for "Assessment of the capability of an optical sensor for in-line real-time wastewater quality analysis in food manufacturing", DOI: 10.17028/rd.lboro.7270577.