Journal Articles
Wang, S, Zhou, Z, Goulas, A, Critchlow, G, Whalley, D,
Hutt, D (2023)
The role of self-assembled monolayers in the surface modification and interfacial contact of copper fillers in electrically conductive adhesives,
ACS Applied Materials & Interfaces, 16(1), pp.1846-1860, ISSN: 1944-8244. DOI:
10.1021/acsami.3c14900.
Kyranaki, N, Smith, A, Yendall, K,
Hutt, DA, Whalley, DC, Gottschalg, R, Betts, TR (2022)
Damp‐heat induced degradation in photovoltaic modules manufactured with passivated emitter and rear contact solar cells,
Progress in Photovoltaics: Research and Applications, ISSN: 1062-7995. DOI:
10.1002/pip.3556.
Abhyankar, H, Webb, P, West, G,
Hutt, D (2020)
Characterization of metal-polymer interaction forces by AFM for insert molding applications,
Polymer Engineering and Science, 60(12), pp.3036-3045, ISSN: 0032-3888. DOI:
10.1002/pen.25534.
McGhee, J, Goulas, A, Southee, D, Sagu, J, Engstrom, D, Wang, J,
Hutt, D, Evans, P, Zhou, Z, Wijayantha-Kahagala-Gamage, U, Conway, P, Carmalt, C (2020)
Indium tin oxide nanowires manufactured via printing and laser irradiation,
Applied Materials Today, 21, 100835, ISSN: 2352-9407. DOI:
10.1016/j.apmt.2020.100835.
Wang, J, Lisco, F,
Hutt, D, Jones, LCR, Bowers, JW, Isherwood, PJM, Zhou, Z, Conway, PP (2020)
Laser sintering and patterning of gallium-doped zinc oxide/indium-tin oxide nanoparticle films with tailorable electrical and optical properties,
Materials & Design, 194, pp.108865-108865, ISSN: 0264-1275. DOI:
10.1016/j.matdes.2020.108865.
Hamid, Y,
Hutt, D, Whalley, D, Craddock, R (2020)
Relative contributions of packaging elements to the thermal hysteresis of a MEMS pressure sensor,
Sensors, 20(6), 1727, DOI:
10.3390/s20061727.
Bournias-Varotsis, A, Wang, S,
Hutt, D, Engstrom, D (2018)
The effect of ultrasonic additive manufacturing on integrated printed electronic conductors,
Electronic Materials Letters, ISSN: 1738-8090. DOI:
10.1007/s13391-018-0053-y.
Hou, S, Qi, S,
Hutt, DA, Tyrer, JR, Mu, M, Zhou, Z (2017)
Three dimensional printed electronic devices realised by selective laser melting of copper/high-density-polyethylene powder mixtures,
Journal of Materials Processing Technology, 254, pp.310-324, ISSN: 0924-0136. DOI:
10.1016/j.jmatprotec.2017.11.020.
Ghanizadeh, S, Peiris, N, Jayathilake, DSYS,
Hutt, D, Wijayantha-Kahagala-Gamage, U, Southee, D, Conway, P, Marchand, P, Darr, JA, Parkin, IP, Carmalt, CJ (2016)
Dispersion and microwave processing of nano-sized ITO powder for the fabrication of transparent conductive oxides,
Ceramics International, 42(16), pp.18296-18302, ISSN: 0272-8842. DOI:
10.1016/j.ceramint.2016.08.157.
Peiris, N, Ghanizadeh, S, Jayathilake, S,
Hutt, D, Wijayantha-Kahagala-Gamage, U, Conway, P, Southee, D, Parkin, IP, Marchand, P, Darr, JA, Carmalt, CJ (2016)
Aerosol-assisted fabrication of tin-doped indium oxide ceramic thin films from nanoparticle suspensions,
Journal of Materials Chemistry C, pp.1-8, ISSN: 2050-7534. DOI:
10.1039/c6tc00812g.
Graves, JE, Sugden, M, Litchfield, RE,
Hutt, D, Mason, TJ, Cobley, AJ (2015)
Ultrasound assisted dispersal of a copper nanopowder for electroless copper activation,
ULTRASONICS SONOCHEMISTRY, 29, pp.428-438, ISSN: 1350-4177. DOI:
10.1016/j.ultsonch.2015.10.016.
Santaniello, T, Yan, Y, Tocchio, A, Martello, F, Gassa, F, Webb, P, Zhao, W, Tamplenizza, M, Schulte, C, Liu, Y,
Hutt, D, Milani, P, Conway, P, Lenardi, C (2015)
On-chip single cell funneling operated by microfabricated thermo-responsive hydrogel layers,
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 25(7), pp.1-12, ISSN: 0960-1317. DOI:
10.1088/0960-1317/25/7/075004.
Lim, Y, Goh, Y, Liu, C,
Hutt, D (2015)
Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces,
Surface and Coatings Technology, ISSN: 0257-8972. DOI:
10.1016/j.surfcoat.2015.02.021.
Tian, Y, Liu, C,
Hutt, DA, Stevens, B (2014)
Electrodeposition of Indium Bumps for Ultrafine Pitch Interconnection,
Journal of Electronic Materials, 43(2), pp.594-603, DOI:
10.1007/s11664-013-2891-6.
Qi, S, Vaidhyanathan, B,
Hutt, DA (2013)
Conventional and microwave-assisted processing of Cu-loaded ICAs for electronic interconnect applications,
Journal of Materials Science, 48(20), pp.7204-7214, DOI:
10.1007/s10853-013-7537-9.
Sugden, MW,
Hutt, DA, Whalley, DC, Liu, C (2012)
A novel flip-chip interconnection process for integrated circuits,
Circuit World, 38(4), pp.214-218, ISSN: 0305-6120. DOI:
10.1108/03056121211280422.
Zakariyah, Conway, Hutt, Wang, K, Selviah, DR (2012)
CO 2 laser micromachining of optical waveguides for interconnection on circuit boards,
Optics and Lasers in Engineering, 50(12), pp.1752-1756, ISSN: 0143-8166. DOI:
10.1016/j.optlaseng.2012.07.005.
Cui, X, Hutt, Conway, (2012)
Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate,
Thin Solid Films, 520(19), pp.6095-6099, ISSN: 0040-6090. DOI:
10.1016/j.tsf.2012.05.068.
Bhatt, D,
Hutt, DA, Conway, PP (2012)
Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects,
Applied Physics B: lasers and optics, 108(4), DOI:
10.1007/s00340-012-5106-6.
Zakariyah, S, Conway, PP,
Hutt, DA, Suyal, N, Selviah, DR (2012)
Integrated in-plane mirror and multimode waveguide
fabrication using 248nm excimer laser ablation for optical interconnects
on PCBs,
Circuit World, 38(2), pp.59-63, ISSN: 0305-6120. DOI:
10.1108/03056121211222255.
Flaherty, OM, Cui, X, Rajamohan, D,
Hutt, D, Denning, C, Conway, PP, West, AA (2012)
A multi‐electrode array (MEA) biochip with excimer laser‐produced micro‐well features,
Circuit World, 38(1), pp.30-37, ISSN: 0305-6120. DOI:
10.1108/03056121211195030.
Zakariyah, Conway, Hutt, Selviah, DR, Wang, K, Rygate, J, Calver, J, Kandulski, W (2011)
Fabrication of polymer waveguides by laser ablation using a 355 nm wavelength Nd:YAG laser,
Journal of Lightwave Technology, 29(23), pp.3566-3576, ISSN: 0733-8724. DOI:
10.1109/JLT.2011.2171318.
Cui, X,
Hutt, DA, Scurr, DJ, Conway, PP (2011)
The Evolution of Pd/Sn Catalytic Surfaces in Electroless Copper Deposition,
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 158(3), pp.D172-D177, ISSN: 0013-4651. DOI:
10.1149/1.3536543.
Ebbens, SJ,
Hutt, DA, Liu, C (2010)
The Thermal Stability of Alkanethiol Self-assembled Monolayers on Copper for fluxless Soldering Applications,
IEEE Transactions on Components and Packaging Techologies, 33(2), pp.251-259, ISSN: 1521-3331. DOI:
10.1109/TCAPT.2010.2052381.
Selviah, DR, Walker, AC,
Hutt, DA, Conway, PP, Chappell, J, Zakariyah, EASS (2010)
Integrated Optical and Electrical Interconnect PCB Manufacturing Research,
Circuit World, 36(2), pp.5-10, DOI:
10.1108/03056121011041654.
Moll, VH, Bocos Bintintan, V, Chappell, J,
Hutt, D, Ratiu, IA, Thomas, CLP (2010) Optimisation of piezoelectric injection of dopants and drift gas modifiers in transverse ion mobility spectrometry,
Int. J. Ion mobility Spectrometry, 13, p.149.
Webb, DP,
Hutt, DA, Hopkinson, N, Conway, PP, Palmer, PJ (2009)
Packaging of microfluidic devices for fluid interconnection using thermoplastics,
Journal of Microelectromechanical Systems, 18(2), pp.354-362, ISSN: 1057-7157. DOI:
10.1109/JMEMS.2009.2013404.
Kaufmann, G, Desmulliez, J, Marc, PY, Tian, Y, Price, D, Hughes, M, Strusevich, N, Bailey, C, Liu, C,
Hutt, DA (2009) Megasonic agitation for enhanced electrodeposition of copper,
Microsystem Technologies, 15, pp.1245-1254.
Webb, DP, Knauf, B, Liu, CC,
Hutt, DA, Conway, PP (2009)
Productionisation issues for commercialisation of microfluidic based devices,
Sensor Review, 29(4), pp.349-354, ISSN: 0260-2288. DOI:
10.1108/02602280910986601.
Li, JF, Mannan, SH, Clode, MP, Liu, CC, Chen, K, Whalley, DC,
Hutt, DA, Conway, PP (2008)
Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects,
IEEE Transactions on Components and Packaging Technologies, 31(3), pp.574-585, DOI:
10.1109/TCAPT.2008.2001160.
Selviah, DR, Fernández, FA, Papakonstantinou, I, Wang, K, Bagshiahi, H, Walker, AC, McCarthy, A, Suyal, H,
Hutt, DA, Conway, PP, Chappell, J, Zakariyah, SS, Milward, D (2008)
Integrated optical and electronic interconnect printed circuit board manufacturing,
Circuit World, 34(2), pp.21-26, ISSN: 0305-6120. DOI:
10.1108/03056120810874546.
Chen, K, Liu, C, Whalley, DC,
Hutt, DA, Li, JF, Mannan, SH (2008)
A comparative study of the interfacial reaction between Electroless Ni-P coatings and molten tin,
Acta Materialia, 56(), pp.5668-5676.
Li, JF, Mannan, SH, Clode, MP, Chen, K, Whalley, DC, Liu, CC,
Hutt, DA (2007)
Comparison of interfacial reactions of Ni and Ni-P in extended contact with liquid Sn-Bi-based solders,
Acta Materialia, 55(2), pp.737-752, ISSN: 1359-6454. DOI:
10.1016/j.actamat.2006.09.003.
Sarvar, F, Whalley, DC,
Hutt, DA, Palmer, PJ, Teh, NJ (2007)
Thermal and Thermo-Mechanical Modelling of Polymer Overmoulded Electronics,
Microelectronics International, 24(3), pp.66-75, ISSN: 1356-5362. DOI:
10.1108/13565360710818439.
Hutt, DA, Williams, K, Conway, PP, Khoshnaw, FM, Cui, X, Bhatt, D (2007)
Challenges in the manufacture of glass substrates for electrical and optical interconnect,
Circuit World, 33(1), pp.22-30, ISSN: 0305-6120. DOI:
10.1108/03056120710723689.
Liu, C, Hendriksen, MW,
Hutt, DA, Conway, PP, Whalley, DC (2006)
Materials and Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection,
IEEE Transactions on Components and Packaging Technologies, 29(4), pp.869-876, ISSN: 1521-3331. DOI:
10.1109/TCAPT.2006.885973.
Liu, C and
Hutt, DA (2006)
Fluxless Soldering of Copper Substrates Using Self-assembled Monolayers for Preservation,
IEEE Transactions on Components and Packaging Technologies, 29(3), pp.512-521, ISSN: 1521-3331. DOI:
10.1109/TCAPT.2005.853177.
Li, JF, Mannan, SH, Clode, MP, Whalley, DC,
Hutt, DA (2006)
Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects,
Acta Materialia, 54(11), pp.2907-2922, ISSN: 1359-6454. DOI:
10.1016/j.actamat.2006.02.030.
Hutt, DA and Liu, C (2005)
Oxidation Protection of Copper Surfaces using Self-assembled Monolayers of Octadecanethiol,
Applied Surface Science, 252(2), pp.400-411, ISSN: 0169-4332. DOI:
10.1016/j.apsusc.2005.01.019.
Hutt, DA, Liu, C, Conway, PP, Whalley, DC, Mannan, SH (2002)
Electroless Nickel Bumping of Aluminium Bondpads. I. Surface Pre-treatment and Activation,
IEEE Transactions on Components and Packaging Technologies, 25(1), pp.87-97, ISSN: 1521-3331. DOI:
10.1109/6144.991180.
Hutt, DA, Liu, C, Conway, PP, Whalley, DC, Mannan, SH (2002)
Electroless Nickel Bumping of Aluminium Bondpads. II. Electroless Nickel Plating,
IEEE Transactions on Components and Packaging Technologies, 25(1), pp.98-105, ISSN: 1521-3331. DOI:
10.1109/6144.991181.
Liu, C and
Hutt, DA (2002) Surface Coatings for Fluxless Soldering of Copper,
Circuit World, 29(1), pp.19-23, ISSN: 0305-6120.
Mannan, SH,
Hutt, DA, Whalley, DC, Conway, PP (2001) Solder Paste Reflow Modeling for Flip Chip Assembly,
TAPtechnology, Third Edition, pp.107-113.
Liu, C,
Hutt, DA, Whalley, DC, Conway, PP, Mannan, SH (2000) Under Bump Metallisation of Fine Pitch Flip-chip Using Electroless Nickel Deposition,
Journal of Electronics Manufacturing, 10(No 3), pp.161-170.
Hutt, DA, Rhodes, DG, Conway, PP, Mannan, SH, Whalley, DC, Holmes, AS (2000) Investigation of a Solder Bumping Technique for Flip-Chip Interconnection,
Soldering and Surface Mount Technology, 12(1), pp.7-14, ISSN: 0954-0911.
Mannan, SH,
Hutt, DA, Whalley, DC (1999)
Electrical Method of Monitoring Percolation and Abrasion of Conducting Spheres Due to Shear Flow of a Dense Suspension in a Narrow Gap,
Applied Physics Letters, 75(6), pp.871-872, ISSN: 0003-6951.
Hutt, DA and Leggett, GJ (1999) Static Secondary Ion Mass Spectrometry Studies of Self-Assembled Monolayers: Electron Beam Degradation of Alkanethiols on Gold,
Journal of Materials Chemistry, 9(4), pp.923-928, ISSN: 0959-9428.
Firmstone, MG, Bartholomew, PM, Lowrie, DJJ, Mannan, SH,
Hutt, DA (1999) Evaluation of Pre-deposited (No-flow) Underfill for Flip-Chip and CSP Assembly,
Soldering and Surface Mount Technology, 11(1), pp.8-12, ISSN: 0954-0911.
Hutt, DA, Cooper, E, Leggett, GJ (1998) Structure and Mechanism of Photooxidation of Self-Assembled Monolayers of Alkylthiols on Silver Studied by XPS and Static SIMS,
Journal of Physical Chemistry B, 102(1), pp.174-184, ISSN: 1089-5647.
Hutt, DA, Cooper, E, Leggett, GJ (1998) A SEXAFS Investigation of Self-Assembled Monolayers on Silver,
Surface Science, 397(1-3), pp.154-163, ISSN: 0039-6028.
Noakes, TCQ,
Hutt, DA, McConville, CF, Woodruff, DP (1997) Structural Investigation of Ordered Sb Adsorption Phases on Ag(111) Using Coaxial Impact Collision Ion Scattering Spectroscopy,
Surface Science, 372(1-3), pp.117-131, ISSN: 0039-6028.
Cooper, E, Parker, L,
Hutt, DA, Wiggs, R, Leggett, GJ, Parker, RL (1997) Rates of Attachment of Fibroblasts to Self-Assembled Monolayers Formed by the Adsorption of Alkylthiols onto Gold Surfaces,
Journal of Materials Chemistry, 7(3), pp.435-441, ISSN: 0959-9428.
Hutt, DA and Leggett, GJ (1997) Desorption of Butanethiol from Au(111) During Storage in Ultrahigh Vacuum: Effects on Surface Coverage and Stability Towards Displacement by Solution-Phase Thiols,
Langmuir, 13(11), pp.3055-3058, ISSN: 0743-7463.
Hutt, DA and Leggett, GJ (1997) Functionalisation of Hydroxyl and Carboxylic Acid Terminated Self-Assembled Monolayers,
Langmuir, 13(10), pp.2740-2748, ISSN: 0743-7463.
Hutt, DA and Leggett, GJ (1996) Influence of Adsorbate Ordering on Rates of UV Photooxidation of Self-Assembled Monolayers,
Journal of Physical Chemistry, 100(16), pp.6657-6662, ISSN: 0022-3654.
Hutt, DA, Cooper, E, Parker, L, Leggett, GJ, Parker, TL (1996) Fabrication of Cellular "Wires" on Micropatterned Monolayers of Short-Chain Alkylthiols on Gold,
Langmuir, 12(22), pp.5494-5497.
Bayliss, SC,
Hutt, DA, Zhang, Q, Harris, P, Phillips, NJ, Smith, A (1995) Structural Study of Porous Silicon,
Thin Solid Films, 255(1-2), pp.128-131, ISSN: 0040-6090.
Zhang, Q, Bayliss, SC,
Hutt, DA (1995) Blue Photoluminescence and Local Structure of Si Nanostructures Embedded in SiO2 Matrices,
Applied Physics Letters, 66(15), pp.1977-1979, ISSN: 0003-6951.
Zhang, Q, Bayliss, SC, Al Ajili, A,
Hutt, DA, Harris, P (1995) The Blue Photoluminescence and Nanostructure of Si and C Clusters Embedded in SiO2 Matrices,
Nuclear Instruments and Methods in Physics Research: Section B - Beam Interactions with Materials and Atoms, 97(1-4), pp.329-332.
Zhang, Q, Bayliss, SC, Al Ajili, A,
Hutt, DA (1995) The Optical Response of Porous Silicon Under Different Excitation Energies,
Nuclear Instruments and Methods in Physics Research: Section B - Beam Interactions with Materials and Atoms, 97(1-4), pp.326-328.
Bayliss, SC, Zhang, Q,
Hutt, DA (1995) From Porous Silicon to Clustered Matrices: A Comparison of Local Structures,
Physica Status Solidi B - Basic Research, 190(1), pp.85-89, ISSN: 0370-1972.
Noakes, TCQ,
Hutt, DA, McConville, CF (1994) Adsorption of Sb on Ag(111) Studied Using LEED, AES and XPS,
Surface Science, 309(A), pp.101-106, ISSN: 0039-6028.
Bayliss, SC,
Hutt, DA, Zhang, Q, Danson, N, Smith, A (1994) Local Structure of Porous Silicon,
Solid State Communications, 91(5), pp.371-375, ISSN: 0038-1098.
Bayliss, SC, Anstee, P,
Hutt, DA, Zhang, Q, Danson, N, Bates, J, Waddilove, A (1994) Local Structure of Porous Silicon,
Journal of Applied Physics, 76(9), pp.5171-5178, ISSN: 0021-8979.
Hutt, DA and Bassett, DW (1993) Growth of Ir Overlayers on a Mo(110) Surface,
Surface Science, 287(B), pp.1000-1003, ISSN: 0039-6028.
Conferences
Hamid, Y,
Hutt, D, Whalley, D, Craddock, R (2019)
Packaging effects on MEMS pressure sensor hysteresis. In
2019 21st Electronics Packaging Technology Conference; 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), Singapore, pp.111-115, ISBN: 9781728138350. DOI:
10.1109/EPTC47984.2019.9026707.
Hamid, Y,
Hutt, D, Whalley, D, Craddock, R (2019)
Effect of thin film interconnect inelasticity on MEMS pressure sensor hysteresis. In
Fifth International Conference on Sensors and Electronic Instrumentation Advances (SEIA' 2019), Canary Islands (Tenerife), Spain, pp.174-176.
Kyranaki, N, Whalley, D, Hutt, D, Gottschalg, R, Betts, T (Accepted for publication) Direct measurement of moisture ingress in PV laminates. In 36th European Photovoltaic Solar Energy Conference and Exhibition, Marseille, pp.1049-1053, ISBN: 3936338604. DOI: 10.4229/EUPVSEC20192019-4AV.1.24.
Hutt, D, Coggrave, C, Whalley, D, Riches, S, Cannon, K, Wu, K, Wang, S, Jones, L, Tyrer, J, Wise, R (2019)
Additive Manufacture of Interconnects with Copper Filled Adhesives and Pastes. In
IMAPS MicroTech 2019 Annual Conference ”Power in Packaging”, Cambridge.
Wang, S,
Hutt, D, Whalley, D, Critchlow, G (2018) An Evaluation of the Electrical Stability of Copper Filled Isotropic Conductive Adhesives in High Moisture Environments. In
Electronics Packaging Technology Conference, Singapore.
Wu, K, Hou, S, Qi, S,
Hutt, D, Tyrer, J, Whalley, D (2017)
Laser processing of printed copper interconnects on polymer substrates. In
Electronics Packaging Technology Conference (EPTC), Singapore, pp.834-839, ISBN: 9781509043699. DOI:
10.1109/EPTC.2016.7861597.
Sugden, MW, Tao, J, Liu, C,
Hutt, DA, Whalley, DC, Lietaer, N (2016)
Characterisation of thermocompression bonds formed using metal coated polymer core particles for fine pitch interconnections. In
2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble. DOI:
10.1109/estc.2016.7764690.
Liu, J, Redei, R, Qi, S,
Hutt, DA, Whalley, D (2014)
Electrical performance of isotropic conductive adhesives with copper and copper coated iron fillers. In
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), pp.531-535, DOI:
10.1109/eptc.2014.7028407.
Litchfield, RE, Graves, J, Sugden, M,
Hutt, DA, Cobley, A (2014)
Functionalised copper nanoparticles as catalysts for electroless plating. In
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), pp.235-240, DOI:
10.1109/eptc.2014.7028381.
Nobeen, N, Ahmad, K, Whalley, DC,
Hutt, D, Haworth, B (2013) Polymeric Packaging of High Power Semiconductor Devices: Material Selection & Reliability Assessment. In
EPTC, Singapore, pp.123-128.
Rathnayake Arachchige, D,
Hutt, DA, Conway, PP, D'Auria, M, Lucyszyn, S, Lee, RM, Robertson, ID (2013) Patterning of Electroless Copper Deposition on Low Temperature Co-fired Ceramic. In
IEEE 15th Electronics Packaging Technology Conference (EPTC), Singapore, pp.635-639, ISBN: 978-1-4799-2834-7.
Rathnayake-Arachchige, D,
Hutt, DA, Conway, PP (2013) Excimer Laser Machining of Fired LTCC for Selectively Metallized Open Channel Structures. In Schieman, B (ed)
46th International Symposium on Microelectronics, Proc 46th International Symposium on Microelectronics, Orlando, Florida.
Nobeenr, NS, Ahmad, K, Whalley, DC,
Hutt, DA, Haworth, B, IEEE, (2013)
Polymeric Packaging of High Power Semiconductor Devices: Material Selection & Reliability Assessment. In
, PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), pp.118-123, ISBN: 978-1-4799-2832-3.
Qi, S, Litchfield, R,
Hutt, DA, Vaidhyanathan, B, Liu, C, Webb, P, Ebbens, S (2012)
Copper conductive adhesives for printed circuit interconnects. In
, Proceedings - Electronic Components and Technology Conference, pp.1651-1655, DOI:
10.1109/ECTC.2012.6249059.
Sugden, MW, Liu, C,
Hutt, D, Whalley, D, Kristiansen, H (2012)
Metal-coated mono-sized polymer core particles for fine pitch flip-chip interconnects. In
2012 IEEE 62nd Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd Electronic Components and Technology Conference, pp.218-224, DOI:
10.1109/ectc.2012.6248831.
Nobeen, NS, Whalley, DC,
Hutt, DA, Haworth, B (2012)
Finite Element Analysis of a High Voltage Semiconductor Polymeric Package Design using a Taguchi Based Experimental Design. In
4th Electronic System-Integration Technology Conference (ESTC), 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), Amsterdam, NETHERLANDS,ISBN: 978-1-4673-4645-0.
Rathnayake-Arachchige, D,
Hutt, DA, Conway, PP, IEEE, (2012)
Adhesion Improvement of Electroless Copper (Cu) Thin Films Deposited on Low Temperature Co-fired Ceramics (LTCC). In
, 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC).
Flaherty, OM, Cui, X, Rajamohan, D, Anderson, D,
Hutt, DA, Denning, C, Conway, PP, West, AA (2011)
Fabrication of a Novel Multi-Electrode Array (MEA) Biochip Using Polyester Insulated Electrodes with Microwell Features for Cardiomyocyte Analysis. In Holland, A and Sinnadurai, N (ed)
18th European Microelectronics Packaging Conference, Brighton UK, pp.1-6, ISBN: 978-0-9568086-0-8.
Tian, Y, Liu, C,
Hutt, D, Stevens, B, Flynn, D, Desmulliez, MPY (2011)
Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation. In
High Density Packaging (ICEPT-HDP), 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, pp.1-6, DOI:
10.1109/icept.2011.6066937.
Abhyankar, H, Webb, DP,
Hutt, DA (2010) Effect of Insert Temperature on Integrity of a Thermoplastic Circuit Board. In
12th Electronics Packaging Technology Conference, Singapore, pp.1-6.
Nobeen, NS, Whalley, DC,
Hutt, DA, Haworth, B (2010)
Computational modelling of electrical field intensity for high voltage semiconductor package design. In
APM '10, International Symposium on Advanced Packaging: Microtech 2010, Cambridge, UK, pp.54-59, ISBN: 978-1-4244-6756-3. DOI:
10.1109/ISAPM.2010.5441380.
Tian, Y, Liu, C,
Hutt, DA, Steven, B, Flynn, D, Desmulliez, MPY (2009)
High density indium bumping using electrodeposition enhanced by megasonic agitation. In
(EPTC '09), Proceedings of the 11th Electronics Packaging Technology Conference, Singapore, pp.31-35, DOI:
10.1109/EPTC.2009.5416576.
Tian, Y,
Hutt, DA, Liu, C, Stevens, B (2009)
High density indium bumping through pulse plating used for pixel X-ray detectors. In
(ICEPT-HDP) '09, Proceedings of the International Conference on Electronic Packaging Technology and High Density Packaging, Beijing, China, pp.456-460, DOI:
10.1109/ICEPT.2009.5270712.
Webb, DP, Conway, PP,
Hutt, DA, Knauf, BJ, Liu, CC (2009) Processes for Integration of Microfluidic Based Devices. In
17th European Microelectronics and Packaging Conference (EMPC), Rimini, Italy, pp.1-7.
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Polymer Optical Waveguide Fabrication Using Laser Ablation. In
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Current Leakage Failure of Conformally Coated Electronic Assemblies. In
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A Substrateless Process for Sustainable Manufacture of Electronic Assemblies. In
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Tian, Y, Kaufmann, J, Liu, C,
Hutt, DA, Desmulliez, MPY (2008)
Megasonic enhanced wafer bumping process to enable high density electronics interconnection. In
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Cui, X,
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Li, J, Sarvar, F, Whalley, DC,
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Failure Mechanisms of Dummy IGBT Assembles Constructed Using Liquid In-Sn/Nb System. In
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Chen, K, Liu, C, Whalley, DC,
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Modelling of the Power Cycling Performance of a Si on Si Flip Chip Assembly. In
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Hutt, DA, Hopkinson, N, Palmer, PJ, Conway, PP (2006) Integration and packaging of microsystems by polymer overmoulding. In
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Chen, K, Liu, C, Whalley, DC,
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Hutt, DA, Teh, NJ, Sarvar, F, Whalley, DC, Palmer, PJ, Anderson, P, Kandasubramanian, B, Morris, P, Prosser, S, O'Brien, P (2005)
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Li, J, Mannan, SH, Clode, MP, Liu, C, Chen, K, Whalley, DC,
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Thermo-mechanical Modeling of Polymer Encapsulated Electronics. In
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