Journal Articles

Zhang, L, Zhao, H, Liang, S, Liu, C (2023) Heat transfer in phase change materials for integrated batteries and power electronics systems, Applied Thermal Engineering, 232, pp.120997-120997, ISSN: 1359-4311. DOI: 10.1016/j.applthermaleng.2023.120997.

Su, Y, Zhu, J, Long, X, Zhao, L, Chen, C, Liu, C (2023) Statistical effects of pore features on mechanical properties and fracture behaviors of heterogeneous random porous materials by phase-field modeling, International Journal of Solids and Structures, 264, 112098, ISSN: 0020-7683. DOI: 10.1016/j.ijsolstr.2022.112098.

Chen, Y, Liu, C, Zhou, Z, Liu, C (2022) Transient liquid phase bonding with Ga-based alloys for electronics interconnections, Journal of Manufacturing Processes, 84, pp.1310-1319, ISSN: 1526-6125. DOI: 10.1016/j.jmapro.2022.11.005.

Jiang, H, Robertson, S, Liang, S, Zhou, Z, Zhao, L, Liu, C (2022) Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite, Materials Today Communications, 33, pp.104623-104623, ISSN: 2352-4928. DOI: 10.1016/j.mtcomm.2022.104623.

Liang, S, Zhong, Y, Robertson, S, Liu, A, Jiang, H, Liu, C, Zhou, Z, Liu, C (2022) Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding, Microelectronics Reliability, 138, 114654, ISSN: 0026-2714. DOI: 10.1016/j.microrel.2022.114654.

Jiang, H, Robertson, S, Liang, S, Zhou, Z, Zhao, L, Liu, C (2022) Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer, Microelectronics Reliability, 138, 114681, ISSN: 0026-2714. DOI: 10.1016/j.microrel.2022.114681.

Liu, C, Liu, A, Jiang, H, Liang, S, Zhou, Z, Liu, C (2022) Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging, Microelectronics Reliability, 138, 114688, ISSN: 0026-2714. DOI: 10.1016/j.microrel.2022.114688.

Liu, L, Shi, L, Peng, J, Jiang, B, Liu, S, Liu, C, Chen, Z (2022) Interfacial reaction between Sn-Ag solder and electroless Ni-Fe-P diffusion barriers with different internal microstructure, Materials Research Bulletin, 152, ISSN: 0025-5408. DOI: 10.1016/j.materresbull.2022.111854.

Liang, S, Kunwar, A, Liu, C, Jiang, H, Zhou, Z (2022) Preferential growth of intermetallics under temperature gradient at Cu-Sn interface during transient liquid phase bonding: insights from phase field simulation, Journal of Materials Research and Technology, 19, pp.345-353, ISSN: 2238-7854. DOI: 10.1016/j.jmrt.2022.05.047.

Ramachandran, S, Zhong, Y, Robertson, S, Panteli, C, Liang, S, Wu, F, Zhou, R, Marathe, S, Zhou, Z, Holmes, AS, Haigh, SJ, Liu, C, Mirihanage, W (2022) Fast in-situ synchrotron X-ray imaging of the interfacial reaction during self-propagating exothermic reactive bonding, Materialia, 23, 101444, DOI: 10.1016/j.mtla.2022.101444.

Liang, S, Liu, C, Zhou, Z (2022) Phase field study of grain boundary migration and preferential growth in non-magnetic materials under magnetic field, Materials Today Communications, 31(2022), 103408, DOI: 10.1016/j.mtcomm.2022.103408.

Chen, Z, Yang, F, Liu, S, Hu, X, Liu, C, Zhou, Z, Wang, Z, Robertson, S, Liu, L (2022) Creep behavior of intermetallic compounds at elevated temperatures and its effect on fatigue life evaluation of Cu pillar bumps, Intermetallics, 144, pp.107526-107526, ISSN: 0966-9795. DOI: 10.1016/j.intermet.2022.107526.

Liu, C, Liu, A, Su, Y, Chen, Y, Zhou, Z, Liu, C (2021) Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects, Journal of Manufacturing Processes, 73, pp.139-148, ISSN: 1526-6125. DOI: 10.1016/j.jmapro.2021.10.065.

Jiang, H, Robertson, S, Liang, S, Zhou, Z, Zhao, L, Liu, C (2021) Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array, Materials Letters, 307, 131074, ISSN: 0167-577X. DOI: 10.1016/j.matlet.2021.131074.

Liu, C, Liu, A, Su, Y, Zhou, Z, Liu, C (2021) Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging, Microelectronics Reliability, 126, 114241, ISSN: 0026-2714. DOI: 10.1016/j.microrel.2021.114241.

Liang, S, Zhong, Y, Robertson, S, Liu, A, Zhou, Z, Liu, C (2021) Thermo-mechanical characteristics and reliability of die-attach through self-propagating exothermic reaction bonding, IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(12), pp.2122-2129, ISSN: 2156-3950. DOI: 10.1109/TCPMT.2021.3108017.

Tuo, C, Yao, Z, Liu, W, Liu, S, Liu, L, Chen, Z, Huang, S, Liu, C, Cao, X (2021) Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics, Journal of Materials Processing Technology, 292, pp.117056-117056, ISSN: 0924-0136. DOI: 10.1016/j.jmatprotec.2021.117056.

Su, Y, Fu, G, Liu, C, Zhang, K, Zhao, L, Liu, C, Liu, A, Song, J (2021) Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores, Computer Methods in Applied Mechanics and Engineering, 378, 113729, ISSN: 0045-7825. DOI: 10.1016/j.cma.2021.113729.

Zhou, Z, Zhang, A, Guan, X, Liu, H, Liu, C, Wu, F (2020) Microstructural and Micromechanical Characteristics of Tin-Based Solders Under Self-Propagating Exothermic Reaction Heating, Journal of Electronic Materials, 49(10), pp.6214-6222, ISSN: 0361-5235. DOI: 10.1007/s11664-020-08363-9.

Robertson, S, Doak, S, Sun, F-L, Liu, Z-Q, Liu, C, Zhou, Z (2020) Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters, Journal of Microscopy, 279(3), pp.212-216, ISSN: 0022-2720. DOI: 10.1111/jmi.12868.

Rebelo, AMR, Liu, C, Schafer, K-H, Saumer, M, Yang, G, Liu, Y (2019) Poly(4-vinylaniline)/polyaniline bilayer functionalized bacterial cellulose for flexible electrochemical biosensors, Langmuir, 35(32), pp.10354-10366, ISSN: 0743-7463. DOI: 10.1021/acs.langmuir.9b01425.

R. Rebelo, AM, Liu, Y, Liu, C, Schäfer, K-H, Saumer, M, Yang, G (2019) Carbon Nanotube-Reinforced Poly(4-vinylaniline)/Polyaniline Bilayer-Grafted Bacterial Cellulose for Bioelectronic Applications, ACS Biomaterials Science & Engineering, 5(5), pp.2160-2172, ISSN: 2373-9878. DOI: 10.1021/acsbiomaterials.9b00039.

Zhu, W, Wang, X, Liu, C, Zhou, Z, Wu, F (2019) Formation and homogenisation of Sn-Cu interconnects by self-propagated exothermic reactive bonding, Materials & Design, 174, 107781, ISSN: 0264-1275. DOI: 10.1016/j.matdes.2019.107781.

Rebelo, AMR, Liu, Y, Liu, C, Schafer, K-H, Saumer, M, Yang, G (2018) Poly(4-vinylaniline)/polyaniline bilayer functionalized bacterial cellulose membranes as bioelectronics interfaces, Carbohydrate Polymers, 204, pp.190-201, ISSN: 0144-8617. DOI: 10.1016/j.carbpol.2018.10.017.

Mo, L, Guo, C, Zhou, Z, Wu, F, Liu, C (2018) Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test, Journal of Materials Science: Materials in Electronics, 29(14), pp.11920-11929, ISSN: 0957-4522. DOI: 10.1007/s10854-018-9293-8.

Rebelo, AMR, Archer, A, Chen, X, Liu, C, Yang, G, Liu, Y (2018) Dehydration of bacterial cellulose and the water content effects on its viscoelastic and electrochemical properties, Science and Technology of Advanced Materials, 19(1), pp.203-211, ISSN: 1468-6996. DOI: 10.1080/14686996.2018.1430981.

Chen, G, Liu, L, Silberschmidt, V, Liu, C, Wu, F, Chan, YC (2018) Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient, Journal of Materials Science: Materials in Electronics, pp.1-11, ISSN: 0957-4522. DOI: 10.1007/s10854-017-8489-7.

Wang, J, Chen, G, Sun, F, Zhou, Z, Liu, Z-Q, Liu, C (2018) Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing, Corrosion Science, 139, pp.383-394, ISSN: 0010-938X. DOI: 10.1016/j.corsci.2018.05.020.

Lim, YY, Goh, Y, Yoshida, M, Bui, TT, Aoyagi, M, Lui, C (2017) 30-GHz high-frequency application of screen printed interconnects on an organic substrate, IEEE Trans Components, Packaging and Manufacturing Technology, 7(9), ISSN: 2156-3950. DOI: 10.1109/TCPMT.2017.2718023.

Chen, Z, Zhang, X, Chen, P, Li, W, Zhou, K, Shi, L, Liu, K, Liu, C (2017) 3D multi-nozzle system with dual drives highly potential for 3D complex scaffolds with multi-biomaterials, International Journal of Precision Engineering and Manufacturing, 18(5), pp.755-761, ISSN: 2234-7593. DOI: 10.1007/s12541-017-0090-8.

Liu, L, Chen, Z, Zhou, Z, Chen, G, Wu, F, Liu, C (2017) Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects, Journal of Alloys and Compounds, ISSN: 1873-4669. DOI: 10.1016/j.jallcom.2017.06.122.

Chen, Z, Liu, C, An, B, Wu, Y, Liu, L (2017) Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing, Journal of Materials Science: Materials in Electronics, 28(23), pp.17461-17467, ISSN: 0957-4522. DOI: 10.1007/s10854-017-7680-1.

Liu, L, Chen, Z, Liu, C, Wu, Y, An, B (2016) Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bending, Intermetallics, ISSN: 0966-9795. DOI: 10.1016/j.intermet.2016.06.004.

Chen, G, Peng, H, Silberschmidt, V, Chan, YC, Liu, C, Wu, F (2016) Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: physical properties, solderability and microstructural evolution under isothermal ageing, Journal of Alloys and Compounds, 685, pp.680-689, ISSN: 0925-8388. DOI: 10.1016/j.jallcom.2016.05.245.

Gao, X, Shi, Z, Kusmierczyk, P, Liu, C, Yang, G, Sevostianov, I, Silberschmidt, V (2016) Time-dependent rheological behaviour of bacterial cellulose hydrogel, Materials Science and Engineering C, 58, pp.153-159, ISSN: 0928-4931. DOI: 10.1016/j.msec.2015.08.019.

Chen, G, Wu, F, Liu, C, Silberschmidt, V, Chan, YC (2016) Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets, Journal of Alloys and Compounds, 656, pp.500-509, ISSN: 0925-8388. DOI: 10.1016/j.jallcom.2015.09.178.

Chen, G, Liu, L, Silberschmidt, V, Chan, YC, Liu, C, Wu, F (2016) Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle, Soldering & Surface Mount Technology, ISSN: 0954-0911. DOI: 10.1108/SSMT-02-2016-0004.

Chen, G, Liu, L, Du, J, Silberschmidt, V, Chan, YC, Liu, C, Wu, F (2016) Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles, Journal of Materials Science, 51(22), pp.10077-10091, ISSN: 0022-2461. DOI: 10.1007/s10853-016-0234-8.

Gao, X, Kusmierczyk, P, Shi, Z, Liu, C, Yang, G, Sevostianov, I, Silberschmidt, V (2016) Through-thickness stress relaxation in bacterial cellulose hydrogel, Journal of the Mechanical Behavior of Biomedical Materials, 59, pp.90-98, ISSN: 1751-6161. DOI: 10.1016/j.jmbbm.2015.12.021.

Chen, Z, Zhang, X, Yang, Y, Zhou, K, Wragg, N, Liu, Y, Lewis, MP, Liu, C (2016) Fabrication and characterisation of 3D complex hydroxyapatite scaffolds with hierarchical porosity of different features for optimal bioactive performance, Ceramics International, ISSN: 0272-8842. DOI: 10.1016/j.ceramint.2016.09.160.

Zhang, Y, Liu, C, Whalley, D (2015) A mechanism of the penetration limit for producing holes in poly(4-vinyl phenol) films by inkjet etching, Journal of Physics D: Applied Physics, 48(45), 455501, ISSN: 0022-3727. DOI: 10.1088/0022-3727/48/45/455501.

Zhao, W, Shi, Z, Chen, X, Yang, G, Lenardi, C, Liu, C (2015) Microstructural and mechanical characteristics of PHEMA-based nanofibre-reinforced hydrogel under compression, Composites Part B, ISSN: 1359-8368. DOI: 10.1016/j.compositesb.2015.02.033.

Mirgkizoudi, M, Liu, C, Conway, P, Riches, S (2015) Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions, Microelectronics Reliability, ISSN: 0026-2714. DOI: 10.1016/j.microrel.2015.02.023.

Lim, Y, Goh, Y, Liu, C, Hutt, D (2015) Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces, Surface and Coatings Technology, ISSN: 0257-8972. DOI: 10.1016/j.surfcoat.2015.02.021.

Wang, J, Wilcox, G, Mortimer, RJ, Liu, C, Ashworth, M (2015) Diffusion barrier characteristics of Ni-NbOx composite electrodeposits for liquid In-Sn solder interconnects, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 162(4), ISSN: 0013-4651. DOI: 10.1149/2.0331504jes.

Mo, L, Chen, Z, Wu, F, Liu, C (2015) Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition, Intermetallics, ISSN: 1879-0216. DOI: 10.1016/j.intermet.2015.06.019.

Gao, X, Shi, Z, Liu, C, Yang, G, Sevostianov, I, Silberschmidt, V (2015) Inelastic behaviour of bacterial cellulose hydrogel: in aqua cyclic tests, Polymer Testing, 44, pp.82-92, ISSN: 0142-9418. DOI: 10.1016/j.polymertesting.2015.03.021.

Chen, G, Wu, F, Liu, C, Xia, W, Liu, H (2015) Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder, Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing, ISSN: 1873-4936. DOI: 10.1016/j.msea.2015.03.106.

Chen, Z, Liu, C, Wu, Y, An, B (2015) Perpendicular growth characteristics of Cu-Sn intermetallic compounds at the surface of Sn99Cu1/Cu solder interconnects, Journal of Electronic Materials, ISSN: 0361-5235. DOI: 10.1007/s11664-015-4043-7.

Chen, Z, Liu, C, Wu, Y, An, B, Zhou, L (2015) Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal aging, Journal of Electronic Materials, ISSN: 1543-186X. DOI: 10.1007/s11664-015-3979-y.

Ashworth, M, Wilcox, G, Higginson, R, Heath, R, Liu, C, Mortimer, RJ (2014) The effect of electroplating parameters and substrate material on tin whisker formation, Microelectronics Reliability, 55(2015), pp.180-191, ISSN: 1872-941X. DOI: 10.1016/j.microrel.2014.10.005.

Zhu, W, Wu, F, Wang, B, Hou, E, Wang, P, Liu, C, Xia, W (2014) Microstructural and mechanical integrity of Cu/Cu interconnects formed by self-propagating exothermic reaction methods, Microelectronic Engineering, 128, pp.24-30, ISSN: 0167-9317. DOI: 10.1016/j.mee.2014.05.035.

Zhao, W, Liu, C, Wu, F, Lenardi, C (2014) Investigation on the mechanical behavior of poly(2‐hydroxyethyl methacrylate) hydrogel membrane under compression in the assembly process of microfluidic system, Journal of Polymer Science Part B: Polymer Physics, 52(7), pp.485-495, ISSN: 0887-6266. DOI: 10.1002/polb.23449.

Alzahrani, A, Hu, S, Azorin-Peris, V, Kalawsky, R, Zhang, X, Liu, C (2014) A novel yet effective motion artefact reduction method for continuous physiological monitoring, Design and Quality for Biomedical Technologies VII, 8936, ARTN 89360G, ISSN: 1605-7422. DOI: 10.1117/12.2044640.

Zhao, W, Liu, C, Wu, F, Lenardi, C (2014) Investigation on the mechanical behaviour of poly(2-hydroxyethyl methacrylate) hydrogel membrane under compression in the assembly process of microfluidic system, Journal of Polymer Science Part B: Polymer Physics, 52, pp.485-495, DOI: 10.1002/polb.23449.

Tian, Y, Liu, C, Hutt, DA, Stevens, B (2014) Electrodeposition of Indium Bumps for Ultrafine Pitch Interconnection, Journal of Electronic Materials, 43(2), pp.594-603, DOI: 10.1007/s11664-013-2891-6.

Ashworth, M, Wilcox, G, Higginson, R, Heath, R, Liu, C (2014) An investigation into zinc diffusion and tin whisker growth for electroplated tin deposits on brass, Journal of Electronic Materials, 43(4), pp.1005-1016, ISSN: 1543-186X. DOI: 10.1007/s11664-014-2983-y.

Chen, Z, Zhang, XL, Zhou, K, Cai, H, Liu, C (2014) Novel fabrication of hierarchically porous hydroxyapatite scaffolds with refined porosity and suitable strength, ADVANCES IN APPLIED CERAMICS, 114(3), pp.183-187, ISSN: 1743-6753. DOI: 10.1179/1743676114Y.0000000213.

Wang, J, Wilcox, G, Mortimer, RJ, Liu, C, Ashworth, M (2014) Electrodeposition and characterization of nanocrystalline Ni-NbOx composite coatings from glycol-based electrolytes for high temperature electronics packaging, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 161(9), ISSN: 0013-4651. DOI: 10.1149/2.0131409jes.

Bunyan, D, Ashworth, MA, Wilcox, GD, Higginson, RL, Heath, RJ, Liu, C (2013) Tin whisker growth from electroplated finishes - a review, Transactions of the Institute of Metal Finishing, 91(5), pp.249-259, DOI: 10.1179/0020296713Z.000000000119.

Ashworth, MA, Wilcox, GD, Higginson, RL, Heath, RJ, Liu, C (2013) Effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substrates, Transactions of the Institute of Metal Finishing, 91(5), pp.261-268, DOI: 10.1179/0020296713Z.000000000116.

Ashworth, MA, Wilcox, GD, Higginson, RL, Heath, RJ, Liu, C (2013) Effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substrates, Transactions of the Institute of Metal Finishing, 91(5), pp.261-268.

Xiong, Z, Dong, C, Cai, H, Liu, C, Zhang, X (2013) Composite inks of poly(3,4-ethylenedioxythiophene)/poly(styrenesulfonate)/silver nanoparticles and electric/optical properties of inkjet-printed thin films, Materials Chemistry and Physics, 141(1), pp.416-422, ISSN: 0254-0584. DOI: 10.1016/j.matchemphys.2013.05.035.

Yang, Y, Balaraju, JN, Chong, SC, Xu, H, Liu, C, Silberschmidt, VV, Chen, Z (2013) Significantly retarded interfacial reaction between an electroless Ni–W–P metallization and lead-free Sn–3.5Ag solder, Journal of Alloys and Compounds, 565, pp.11-16, ISSN: 0925-8388. DOI: 10.1016/j.jallcom.2013.02.113.

Liu, J, Liu, C, Conway, PP (2013) Kinetic Monte Carlo simulation of the electrodeposition of polycrystalline copper: Effects of substrates and deposition parameters on the microstructure of deposits, Electrochimica Acta, 97, pp.132-142, ISSN: 0013-4686. DOI: 10.1016/j.electacta.2013.02.112.

Jain, S, Whalley, DC, Cottrill, M, Helland, T, Kristiansen, H, Redford, K, Liu, C (2013) The effect of coating thickness on the electrical performance of novel isotropic conductive adhesives prepared using metallised polymer micro-spheres, 2013 IEEE 63rd Electronic Components and Technology Conference, DOI: 10.1109/ectc.2013.6575664.

Wu, Z, Huang, Z, Xiong, H, Conway, PP, Liu, C (2013) Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects, Journal of Electronic Materials, 42(2), pp.263-271, ISSN: 0361-5235. DOI: 10.1007/s11664-012-2201-8.

Zhao, W, Lenardi, C, Webb, DP, Liu, C, Santaniello, T, Gassa, F (2013) A methodology to analyse and simulate mechanical characteristics of poly(2-hydroxyethyl methacrylate) hydrogel, Polymer International, 62, pp.1059-1067, DOI: 10.1002/pi.4392.

Xiong, Z, Liu, C, Dong, C, Cai, H, Zhang, X (2013) Composite inks of poly(3,4-ethylenedioxythiophene)/poly(styrenesulfonate)/silver nanoparticles and electric/optical properties of inkjet-printed thin films, Materials Chemistry and Physics, ISSN: 0254-0584. DOI: 10.1016/j.matchemphys.2013.05.035.

Zhang, Y, Liu, C, Whalley, D (2013) The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers, ISSN: 0003-6951. DOI: 10.1063/1.4795447.

Wu, Z, Huang, Z, Xiong, H, Conway, P, Liu, C (2013) Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects, Journal of Electronic Materials, 42(2), pp.263-271.

Zhang, Y, Liu, C, Whalley, DW (2013) The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers, Applied Physics Letters, 102, p.103303.

Yang, Y, Balaraju, JN, Chong, SC, Xu, H, Liu, C, Silberschmidt, V (2013) Significantly retarded interfacial reaction between an electroless Ni-W-P metallization and lead-free Sn-3.5Ag solder, Journal of Alloys and Compounds, 565, pp.11-16.

Liu, J, Liu, C, Conway, P (2013) Kinetic Monte Carlo simulation of the electrodeposition of polycrystalline copper: Effects of substrates and deposition parameters on the microstructure of deposits, Electrochimica Acta, 97, pp.132-142.

Lim, YY, Goh, YM, Liu, C (2013) Surface Treatments for Inkjet Printing onto a PTFE-based Substrate for High Frequency Applications, Industrial and Engineering Chemistry Research, 52, pp.11564-11574.

Xiong, Z, Dong, C, Cai, H, Liu, C, Zhang, X (2013) Preparation of Silver Nanoparticles Enhanced PEDOT:PSS via Two Methods and Inkjet Printing of their Thin Films, Materials Chemistry and Physics, 141, pp.416-422.

Mirgkizoudi, M, Liu, C, Conway, P, Riches, S (2013) Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics, Journal of microelectronics and electronic packaging, 10, pp.80-88.

Lim, YY, Goh, Y, Liu, C (2013) Surface treatments for inkjet printing onto a PTFE-based substrate for high frequency applications, ISSN: 0888-5885. DOI: 10.1021/ie4006639.

Sugden, MW, Hutt, DA, Whalley, DC, Liu, C (2012) A novel flip-chip interconnection process for integrated circuits, Circuit World, 38(4), pp.214-218, ISSN: 0305-6120. DOI: 10.1108/03056121211280422.

Chen, Z, An, B, Wu, Y, Liu, C, Parkin, R (2012) Dimensional change in micro-scale solder joint induced by evolution of IMCs, ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, pp.1234-1239, DOI: 10.1109/ICEPT-HDP.2012.6474829.

Mirgkizoudi, M, Liu, C, Conway, P, Riches, S (2012) Combined temperature and vibration testing for wire bond interconnections in harsh environment electronics, Proceedings - IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2012, pp.335-344.

Zhao, W, Liu, C, Lenardi, C, Santaniello, T, Wu, F (2012) Mechanical fastening to enable room temperature packaging for LOCs based on biocompatible hydrogel thin film, 14th International Conference on Electronic Materials and Packaging, EMAP 2012, DOI: 10.1109/EMAP.2012.6507899.

Xiong, Z and Liu, C (2012) Optimization of inkjet printed PEDOT:PSS thin films through annealing processes, Organic Electronics, 13(9), pp.1532-1540, ISSN: 1566-1199. DOI: 10.1016/j.orgel.2012.05.005.

Zha, X, Liu, C, Silberschmidt, VV (2012) Thermo-mechanical behaviour analysis of micro-solder joints by finite element modelling, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, DOI: 10.1109/icept-hdp.2012.6474851.

Zhao, W, Santaniello, T, Webb, P, Lenardi, C, Liu, C (2012) A new approach towards an optimum design and manufacture of microfluidic devices based on ex situ fabricated hydrogel based thin films' integration, 2012 IEEE 62nd Electronic Components and Technology Conference, DOI: 10.1109/ectc.2012.6249114.

Chen, Z, An, B, Wu, Y, Liu, C, Parkin, R (2012) Influence of IMCs volume ratio in micro-scale solder joints on their mechanical integrity, 2012 IEEE 62nd Electronic Components and Technology Conference, DOI: 10.1109/ectc.2012.6248910.

Williams, O, Webb, DP, Liu, C, Firth, P (2012) Evaluation of contamination of ceramic surfaces and its effect on epoxy bleed, International Journal of Adhesion and Adhesives, 32, pp.61-69, ISSN: 0143-7496. DOI: 10.1016/j.ijadhadh.2011.10.001.

Ng, JHG, Watson, DEG, Sigwarth, J, McCarthy, A, Prior, KA, Hand, DP, Yu, W, Kay, RW, Liu, C, Desmulliez, MPY (2012) On the use of silver nanoparticles for direct micropatterning on polyimide substrates, IEEE Transactions on Nanotechnology, 11(1), pp.139-147, ISSN: 1536-125X. DOI: 10.1109/TNANO.2011.2160092.

Zhang, Y, Liu, C, Whalley, D (2012) The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin films, ISSN: 0022-3727. DOI: 10.1088/0022-3727/45/12/125303.

Zhang, Y, Liu, C, Whalley, D (2012) The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printing, ISSN: 0003-6951. DOI: 10.1063/1.4772796.

Williams, O, Webb, DP, Liu, C, Firth, P (2012) Evaluation of contamination of ceramic surfaces and its effect on epoxy bleed, International Journal of Adhesion and Adhesives, 32, pp.61-69.

Zhang, Y, Liu, C, Whalley, DW (2012) The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via-holes in poly-4-(vinyl phenol) thin films, Journal of Physics D: Applied Physics, 45, p.125303.

Xiong, Z and Liu, C (2012) Optimisation of inkjet printed PEDOT:PSS thin films through annealing processes, Organic Electronics, 13(9), pp.1532-1540.

Zhang, Y, Liu, C, Whalley, DW (2012) The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printing, Applied Physics Letters, 101, p.253302, DOI: 10.1063/1.4772796.

Sugden, MW, Hutt, DA, Whalley, D, Liu, C (2012) A novel flip-chip interconnection process for integrated circuits, Circuit World, 38(4), pp.214-218.

Cheng, X, Liu, C, Silberschmidt, V (2012) Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures, ISSN: 0927-0256. DOI: 10.1016/j.commatsci.2010.12.026.

Xu, H, Liu, C, Silberschmidt, VV, Pramana, SS, White, TJ, Chen, Z, Acoff, VL (2011) Intermetallic phase transformations in Au–Al wire bonds, Intermetallics, 19(12), pp.1808-1816, ISSN: 0966-9795. DOI: 10.1016/j.intermet.2011.07.003.

Xu, H, Acoff, VL, Liu, C, Silberschmidt, VV, Chen, Z (2011) Facilitating intermetallic formation in wire bonding by applying a pre-ultrasonic energy, Microelectronic Engineering, 88(10), pp.3155-3157, ISSN: 0167-9317. DOI: 10.1016/j.mee.2011.06.018.

Chen, Z, An, B, Wu, Y, Liu, C, Parkin, R (2011) An investigation of the influence of intermetallic compounds on compressivecreep of SAC305/copper solder joints by modeling, 2011 International Symposium on Advanced Packaging Materials (APM), DOI: 10.1109/isapm.2011.6105726.

Xu, H, Liu, C, Silberschmidt, VV, Pramana, SS, White, TJ, Chen, Z, Acoff, VL (2011) New mechanisms of void growth in Au–Al wire bonds: Volumetric shrinkage and intermetallic oxidation, Scripta Materialia, 65(7), pp.642-645, ISSN: 1359-6462. DOI: 10.1016/j.scriptamat.2011.06.050.

Xu, H, Liu, C, Silberschmidt, VV, Pramana, SS, White, TJ, Chen, Z, Acoff, VL (2011) Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds, Acta Materialia, 59(14), pp.5661-5673, ISSN: 1359-6454. DOI: 10.1016/j.actamat.2011.05.041.

Kamaludin, KA, Mirgkizoudi, M, Liu, C, Riches, S (2011) Effects of combined thermal and vibration loadings on the wire bond integrity, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, DOI: 10.1109/icept.2011.6066958.

Liu (Changqing), C, Xu, H, Silberschmidt, VV, Pramana, SS, White, TJ, Chen, Z, Acoff, VL (2011) Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds, Acta Materialia, 59(2), pp.5661-5673, DOI: 10.1016/j.actamat.2011.05.041.

Xu, H, Acoff, VL, Liu, C, Silberschmidt, VV, Chen, Z (2011) Void growth in thermosonic copper/gold wire bonding on aluminum pads, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), DOI: 10.1109/ectc.2011.5898745.

Xu, H, Liu, C, Silberschmidt, VV, Chen, Z, Acoff, VL (2011) Effect of ultrasonic energy on nanoscale interfacial structure in copper wire bonding on aluminium pads, Journal of Physics D: Applied Physics, 44(14), pp.145301-145301, ISSN: 0022-3727. DOI: 10.1088/0022-3727/44/14/145301.

Ng, JHG, Watson, DEG, Sigwarth, J, McCarthy, A, Prior, KA, Hand, DP, Yu, W, Kay, RW, Liu, C, Desmulliez, MPY (2011) On the use of silver nanoparticles for direct micropatterning on polyimide substrates, IEEE Transactions on Nanotechnology, 11(1), pp.139-147.

Cheng, X, Liu, C, Silberschmidt, V (2011) Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures, Computational Materials Science, 52(1), pp.274-281.

Mirgkizoudi, M, Changqing Liu, Riches, S (2010) Reliability testing of electronic packages in harsh environments, 2010 12th Electronics Packaging Technology Conference, DOI: 10.1109/eptc.2010.5702637.

Knauf, BJ, Webb, DP, Liu, CC, Conway, PP (2010) Low frequency induction heating for the sealing of plastic microfluidic systems, Microfluidics and Nanofluidics, 9(Issue 2-3), pp.243-252, ISSN: 1613-4990. DOI: 10.1007/s10404-009-0539-x.

Williams, O, Liu, C, Webb, DP, Firth, P (2010) Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies, International Journal of Adhesion and Adhesives, 30(4), pp.225-235, ISSN: 0143-7496. DOI: 10.1016/j.ijadhadh.2010.02.001.

Xu, H, Liu, C, Silberschmidt, V, Chen, Z, Wei, J (2010) Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads, Journal of Materials Processing Technology, 210(8), pp.1035-1042, ISSN: 0924-0136. DOI: 10.1016/j.jmatprotec.2010.02.012.

Xu, H, Liu, C, Silberschmidt, V (2010) Growth of intermetallic compounds in thermosonic copper wire bonding on aluminum metallization, Journal of Electronic Materials, 39(1), pp.124-131, ISSN: 0361-5235.

Dou, G, Whalley, DC, Liu, CC, Chan, YC (2010) An experimental methodology for the study of co-planarity variation effects in anisotropic conductive adhesive assemblies, Soldering and Surface Mount Technology, 22(1), pp.47-55, ISSN: 0954-0911. DOI: 10.1108/09540911011015148.

Hin, TY, Liu, C, Conway, PP, Yu, W, Cargill, S, Desmulliez, MPY (2010) Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithography, IEEE Photonics Technology Letters, 22(13), pp.957-959, ISSN: 1041-1135. DOI: 10.1109/LPT.2010.2048310.

Ebbens, SJ, Hutt, DA, Liu, C (2010) The Thermal Stability of Alkanethiol Self-assembled Monolayers on Copper for fluxless Soldering Applications, IEEE Transactions on Components and Packaging Techologies, 33(2), pp.251-259, ISSN: 1521-3331. DOI: 10.1109/TCAPT.2010.2052381.

Xu, H, Liu, CC, Silberschmidt, V, Chen, Z, Wei, J, Sivakumar, M (2010) Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution, Microelectronics Reliability, 51(1), pp.113-118, ISSN: 0026-2714. DOI: 10.1016/j.microrel.2010.03.016.

Qin, Y, Wilcox, GD, Liu, C (2010) Electrodeposition and Characterisation of Sn-Ag-Cu Solder Alloys for Flip-Chip Interconnection, Electrochimica Acta, 56, pp.183-192.

Xu, H, Liu, C, Silberschmidt, V, Pramana, SS, White, TJ, Chen, Z, Sivakumar, M, Acoff, VL (2010) A micromechanism study of thermosonic gold wire bonding on aluminum pad, Journal of Applied Physics, 108(113517), p.8, DOI: 10.1063/1.3514005.

Xu, H, Liu, C, Silberschmidt, V, Chen, Z, Wei, J (2010) The role of bonding duration in wire bond formation: a study of footprints of thermosonic gold wire on aluminium pad, Microelectronics International, 27(1), pp.11-16, DOI: 10.1108/13565361011009469.

Gong, J, Liu, C, Conway, P, Silberschmidt, V (2010) Formation of Ag3Sn plates in SnAgCu solder bumps, ISSN: 0921-5093. DOI: 10.1016/j.msea.2009.12.020.

Liu (Changqing), C, Qin, Y, Wilcox, G (2010) Electrodeposition and characterisation of Sn–Ag–Cu solder alloys for flip-chip interconnection, Electrochimica Acta, 56(2), pp.183-192, DOI: 10.1016/j.electacta.2010.08.102.

Tian, Y (2010) Electrodeposition of indium bumps for ultrafine pitch interconnections.

Gong, J, Conway, PP, Liu, CC, Silberschmidt, V (2009) Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy, Journal of Electronic Materials, Vol 38(12), pp.2429-2435, ISSN: 0361-5235. DOI: 10.1007/s11664-009-0941-x.

Liu, J, Liu, C, Conway, PP, Zeng, J, Wang, C (2009) Growth and recrystallization of electroplated copper columns, 2009 International Conference on Electronic Packaging Technology & High Density Packaging, DOI: 10.1109/icept.2009.5270660.

Hin, TY, Liu, CC, Conway, PP (2009) Surface characterisation of plasma treated flexible substrates for waveguide-on-flex application, Surface and Coatings Technology, 203, pp.3741-3749, DOI: 10.1016/j.surfcoat.2009.06.015.

Liu, J, Liu, CC, Conway, PP (2009) Kinetic Monte Carlo Simulation of Kinetically-limited Copper Electro-crystallisation on an Atomically Even Surface, Electrochimica Acta, 54(27), pp.6941-6948, DOI: 10.1016/j.electacta.2009.07.019.

Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2009) Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder, Scripta Materialia, 61(7), pp.682-685, DOI: 10.1016/J.scriptamat.2009.05.034.

Kaufmann, G, Desmulliez, J, Marc, PY, Tian, Y, Price, D, Hughes, M, Strusevich, N, Bailey, C, Liu, C, Hutt, DA (2009) Megasonic agitation for enhanced electrodeposition of copper, Microsystem Technologies, 15, pp.1245-1254.

Liu, JJ, Liu, CC, Conway, PP (2009) Kinetic Monte Marlo Simulation of Electrodeposition of Polycrystalline Cu, Electrochemistry Communications, 11(11), pp.131-135, DOI: 10.1016/j.elecom.2009.09.032.

Xu, H, Liu, CC, Silberschmidt, V, Pramana, SS, White, TJ, Chen, Z (2009) A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads, Scripta Materialia, 61(2), pp.165-168, ISSN: 1359-6462. DOI: 10.1016/j.scriptamat.2009.03.034.

Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2009) Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate, Scripta Materialia, 60, pp.333-335.

Qin, Y, Wilcox, GD, Liu, C (2009) Electrodeposition and characterization of eutectic Sn-Ag alloyas solder bumps for flip-chip interconnection, Journal of the Electrochemical Society, 156(10), p.424.

Qin, Y, Wilcox, GD, Liu, C (2009) Electrodeposition and Characterization of Eutectic Sn-Ag Alloy as Solder Bumps for Flip-Chip Interconnection, Journal of The Electrochemical Society, 156(10), pp.D424-D430, DOI: 10.1149/1.3194780.

Webb, DP, Knauf, B, Liu, CC, Hutt, DA, Conway, PP (2009) Productionisation issues for commercialisation of microfluidic based devices, Sensor Review, 29(4), pp.349-354, ISSN: 0260-2288. DOI: 10.1108/02602280910986601.

Li, JF, Mannan, SH, Clode, MP, Liu, CC, Chen, K, Whalley, DC, Hutt, DA, Conway, PP (2008) Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects, IEEE Transactions on Components and Packaging Technologies, 31(3), pp.574-585, DOI: 10.1109/TCAPT.2008.2001160.

Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2008) Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate, Acta Materiala, p.7, ISSN: 1359-6454. DOI: 10.1016/j.actamat.2008.04.063.

Li, D, Conway, PP, Liu, CC (2008) Corrosion characterization of tin-lead and lead free solders in 3.5 wt.% NaCl solution, Journal of Corrosion Science, 50(4), pp.995-1004, ISSN: 0010-938X. DOI: 10.1016/j.corsci.2007.11.025.

Li, D, Liu, CC, Conway, PP (2008) Reliability of Fine Pitch Sn-3.8AG-0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB, Transactions of the ASME: Journal of Electronic Packaging, Paper 011005, 130(1), p.7, DOI: 10.1115/1.2837522.

Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2008) Mesomechanical modelling of SnAgCu solder joints in flip chip, Computational Materials Science, 43(1), pp.199-211, ISSN: 0927-0256. DOI: 10.1016/j.commatsci.2007.07.039.

Dou, G, Whalley, DC, Liu, CC (2008) Mechanical characterization of individual Ni/Au coated microsize polymer particles, Applied Physics Letters, 92(104108), 3 pages.

Chen, K, Liu, C, Whalley, DC, Hutt, DA, Li, JF, Mannan, SH (2008) A comparative study of the interfacial reaction between Electroless Ni-P coatings and molten tin, Acta Materialia, 56(), pp.5668-5676.

Liu, CC, Huang, Z, Conway, PP, Thomson, RC (2007) Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn¿Pb solder alloys, Journal of Materials Science, 42(11), pp.4076-4086, ISSN: 0022-2461. DOI: 10.1007/s10853-006-1335-6.

Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2007) Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation, Computational Materials Science, 39(1), pp.187-197, DOI: 10.1016/j.commatsci.2006.02.020.

Webb, DP, Liu, CC, Sarvar, F, Conway, PP, Williams, K (2007) Adhesion of Precision Welded Lead-Free Electrical Interconnects Formed by Molten Droplet Deposition, Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, 221(2), pp.303-315, ISSN: 0954-4054. DOI: 10.1243/09544054JEM365.

Li, JF, Mannan, SH, Clode, MP, Chen, K, Whalley, DC, Liu, CC, Hutt, DA (2007) Comparison of interfacial reactions of Ni and Ni-P in extended contact with liquid Sn-Bi-based solders, Acta Materialia, 55(2), pp.737-752, ISSN: 1359-6454. DOI: 10.1016/j.actamat.2006.09.003.

Liu, C, Hendriksen, MW, Hutt, DA, Conway, PP, Whalley, DC (2006) Materials and Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection, IEEE Transactions on Components and Packaging Technologies, 29(4), pp.869-876, ISSN: 1521-3331. DOI: 10.1109/TCAPT.2006.885973.

Li, D, Liu, C, Conway, PP (2006) Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads, 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06, pp.108-114.

Liu, C and Hutt, DA (2006) Fluxless Soldering of Copper Substrates Using Self-assembled Monolayers for Preservation, IEEE Transactions on Components and Packaging Technologies, 29(3), pp.512-521, ISSN: 1521-3331. DOI: 10.1109/TCAPT.2005.853177.

Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2006) Modelling of Ag3Sn coarsening and its effect on creep of Sn-Ag eutectics, Journal of Materials Science and Engineering A, 427(1-2), pp.60-68, ISSN: 0921-5093. DOI: 10.1016/j.msea.2006.04.034.

Huang, Z, Conway, PP, Liu, C, Thomson, RC (2006) Modeling the interdependence of processing and alloy composition on the evolution of microstructure in Sn-based lead-free solders in fine pitch flip chip, IEEE Transactions on Components and Packaging Technologies, 29(1), pp.98-104, ISSN: 1521-3331. DOI: 10.1109/TCAPT.2005.850538.

Li, D, Liu, C, Conway, PP (2006) Microstructure and Shear Strength Evolution of Sn-Ag-Cur Solder Bumps during Aging at Different Temperatures, Journal of Electronic Materials, 35(3), pp.388-398.

Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2006) Analysis of Stress Distribution in SnAgCu Solder Joint, Applied Mechanics and Materials, 5-6, pp.359-366, ISSN: 1660-9336.

Huang, Z, Conway, PP, Jung, E, Thomson, RC, Liu, C, Loeher, T, Minkus, M (2006) Reliability Issues in Pb-Free Solder Joint Miniaturization, Journal of Electronic Materials, 35(9), pp.1761-1772, ISSN: 0361-5235.

Hutt, DA and Liu, C (2005) Oxidation Protection of Copper Surfaces using Self-assembled Monolayers of Octadecanethiol, Applied Surface Science, 252(2), pp.400-411, ISSN: 0169-4332. DOI: 10.1016/j.apsusc.2005.01.019.

Li, D, Liu, C, Conway, PP (2005) Solderability of electroless deposited Ni-P coatings with Sn-3.8Ag-0.7Cu and Sn-3.5Ag lead-free solder alloys, Circuit World, 31(3), pp.32-39, ISSN: 0305-6120. DOI: 10.1108/03056120510585054.

Huang, Z, Conway, PP, Liu, C, Thomson, RC (2005) Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping, Journal of Materials Research, 20(3), pp.649-658, ISSN: 0884-2914. DOI: 10.1557/JMR.2005.0078.

Li, D, Liu, C, Conway, PP (2005) Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects, Materials Science & Engineering A, 391(1-2), pp.95-103, ISSN: 0921-5093. DOI: 10.1016/j.msea.2004.10.007.

Li, D, Liu, C, Conway, PP (2005) Solderability of electroless deposited Ni-P coatings with Sn-3.8Ag-0.7Cu and Sn-3.5Ag lead-free solder alloys, Circuit World, 13(3), pp.32-39, ISSN: 0305-6120.

Huang, Z, Conway, PP, Liu, C, Thomson, RC (2004) The effect of microstructural and geometrical features on the reliability of ultrafine flip chip microsolder joints, Journal of Electronic Materials, 33(10), pp.1227-1235, ISSN: 1543-186X. DOI: 10.1007/s11664-004-0126-6.

Liu, C, Conway, PP, Li, D, Hendriksen, M (2004) Analysis of the micro-mechanical properties in aged lead-free, fine pitch flip chip joints, Journal of Electronic Packaging, 126(3), pp.359-366, ISSN: 1043-7398. DOI: 10.1115/1.1773391.

Liu, C, Bi, Q, Matthews, A (2003) Tribological and Electrochemical Performance of PVD TiN Coatings for the Femoral Head of Ti-6Al-4V Artificial Hip Joints, Surface and Coatings Technology, 163-164, pp.597-604, ISSN: 0257-8972. DOI: 10.1016/S0257-8972(02)00630-8.

Liu, C, Bi, Q, Leyland, A, Matthews, A (2003) An Electrochemical Impedance Spectroscopy Study of the Corrosion Behaviour of PVD Coated Steels in 0.5N NaCl Aqueous Solution: Part 1: Establishment of Equivalent Circuits for EIS Data Modelling, Corrosion Science, 45/6, pp.1243-1256, ISSN: 0010-938X.

Liu, C, Bi, Q, Leyland, A, Matthews, A (2003) An Electrochemical Impedance Spectroscopy Study of the Corrosion Behaviour of PVD Coated Steels in 0.5N NaCl Aqueous Solution: Part II. EIS Interpretation of Corrosion Behaviour, Corrosion Science, 45/6, pp.1257-1273, ISSN: 0010-938X.

Liu, C, Qi, B, Ziegele, H, Leyland, A, Matthews, A (2002) Structure and Corrosion Properties of PVD CrN Coatings, Journal of Vacuum Science & Technology A, A20(3), pp.772-780, ISSN: 0734-2101.

Hutt, DA, Liu, C, Conway, PP, Whalley, DC, Mannan, SH (2002) Electroless Nickel Bumping of Aluminium Bondpads. I. Surface Pre-treatment and Activation, IEEE Transactions on Components and Packaging Technologies, 25(1), pp.87-97, ISSN: 1521-3331. DOI: 10.1109/6144.991180.

Hutt, DA, Liu, C, Conway, PP, Whalley, DC, Mannan, SH (2002) Electroless Nickel Bumping of Aluminium Bondpads. II. Electroless Nickel Plating, IEEE Transactions on Components and Packaging Technologies, 25(1), pp.98-105, ISSN: 1521-3331. DOI: 10.1109/6144.991181.

Liu, C and Hutt, DA (2002) Surface Coatings for Fluxless Soldering of Copper, Circuit World, 29(1), pp.19-23, ISSN: 0305-6120.

Liu, C, Leyland, A, Bi, Q, Matthews, A (2001) Corrosion resistance of multi-layered plasma-assisted physical vapour deposition TiN and CrN coatings, Surface and Coatings Technology, 141(2-3), pp.164-173, ISSN: 0257-8972. DOI: 10.1016/S0257-8972(01)01267-1.

Liu, C, Bi, Q, Matthews, A (2001) EIS comparison on corrosion performance of PVD TiN and CrN coated mild steel in 0.5 NNaC1 aqueous solution, Corrosion Science, 43, pp.1953-1961.

Liu, C, Hutt, DA, Whalley, DC, Conway, PP, Mannan, SH (2000) Under Bump Metallisation of Fine Pitch Flip-chip Using Electroless Nickel Deposition, Journal of Electronics Manufacturing, 10(No 3), pp.161-170.

Liu, C, Leyland, A, Lyon, S, Mathews, A (1996) Electrochemical Impedance Spectroscopy of PVD-TiN Coatings on Mild Steel and AISI316 Substrates, Surface Coatings and Technology, pp.76-77, ISSN: 0257-8972.

Liu, C, Leyland, A, Lyon, S, Matthews, A (1995) An ac Impedance Study on PVD CrN-coated Mild Steel with Different Surface Roughnesses, Surface Coatings and Technology, 76-77, pp.623-631, ISSN: 0257-8972.

Yu, ZM, Jin, ZJ, Liu, C, Yu, L, Dai, SX (1995) Preparation and Properties of Ti(Y)N Coatings, J. Vac. Sci. Technol.,, A13(5)(2303), pp.623-631, ISSN: 0734-2101.

Yu, ZM, Liu, C, Yu, L, Jin, ZJ (1994) Assessment of Adhesion of Ti(Y)N and Ti(La)N Coatings by an SEM Constant-rate Tensile Test, Journal of Adhesion Science and Technology, 8(6), pp.679-685, ISSN: 0169-4243.

Liu, C, Li, MS, Jin, ZJ, Wu, WT (1993) Tensile and Adhesive Strengths of Fine TiN Films on Ti Substrate, Acta Metallurgica Sinica, B6(2), pp.126-129, ISSN: 1000-9450.

Liu, C, Jin, ZJ, Wu, WT (1992) Electrochemical corrosion feature of ion plated Ti and TiN Coatings, Materials Protection (in Chinese), 25, pp.39-43.

Liu, C, Jin, MS, Li, JF, Huhe, JF, Wu, WT (1992) Critical Cracking and Damage Mode of Titanium Nitride Films, Acta Physica Sinica, 41, pp.1137-1142.

Liu, C, Jin, L, Yu, ZM, Wu, WT (1992) Evaluation of Adhesion and Plasticity of PVD Films, Acta Metallurgica Sinica, B5(5), pp.411-416, ISSN: 1000-9450.

Liu, C, Wu, WT, Jin, ZJ, Dai, SX, Wang, WH (1992) Local-enrichment of Active Element Y in Y-modified PVD Films on Mild Steel Substrate, Chinese Journal of Metal Science and Technology, 8, pp.204-208.

Liu, C, Wu, WT, Yu, ZM, Jin, ZJ (1992) Correlation of Interface Structure and Microstress of Yttrium-modified Ion Plated Titanium, Thin Solid Films, 207, pp.98-101, ISSN: 0040-6090.

Liu, C, Yu, ZM, Yu, ZJ, Jin, ZJ, Wu, WT (1992) Microstructure of Interface between Y-modified Ion-plated Ti(Y)N Coating and Substrate Steel A₃, Acta Metallurgica Sinica, A5(1), pp.16-20, ISSN: 1000-9442.

Liu, C, Yu, ZM, Jin, ZJ, Yu, L, Xu, JY, Wu, WT (1991) Interface Characteristics and Adhesive Mechanism of Ion Plated Titanium Nitride Films, Journal of Rare Earths, 9(4), pp.372-374.

Jin, ZJ, Yu, L, Liu, C, Dai, SX, Yu, ZM (1991) Analysis of New Method for Measuring Adhesion of PVD Films, Ionics, pp.85-88.

Liu, C, Wu, WT, Jin, ZJ (1991) Modification of Microstructure and Properties of Ion-plated Titanium Nitride Film by Adding Yttrium, Acta Physica Sinica, 40, pp.1520-1524.

Jin, ZJ, Liu, C, Yu, L, Wu, WT (1991) Corrosion Performance of Ion-plated Titanium and Yttrium-modified TiN Coatings, Surface Coatings and Technology, 46, pp.307-315, ISSN: 0257-8972.

Liu, C, Yu, ZM, Wu, WT, Yu, L, Xu, JY, Jin, ZY (1991) Interface Structure, Microstress and Adherence of Y-modified Ion-plated Titanium Nitride Film on Mild Steel, Journal of Rare Earths, Special Issue, pp.916-920.

Wu, W, Liu, C, Jin, Z, Yu, L, Shi, C (1991) Microstructure Characterisation of Yttrium-modified Reactive Ion-plated Ti(Y)N Coating by Means of Transmission Electron Microscopy, Materials Science and Engineering, A131, pp.203-213, ISSN: 0921-5093.

Jin, ZJ, Liu, C, Wu, WT (1990) Correlation of Structure of Ion plated Ti and TiN Films with its Corrosion Resistance, Journal of Chinese Society of Corrosion and Protection, 10(2), pp.177-182.

Liu, C, Jin, ZJ, Wu, WT, Dai, SX, Li, MS, Shi, CX (1990) Residual Stress and Damage Mode of Hard Ti(C,N) Coatings, Acta Metallurgica Sinica, B3(4), pp.246-251, ISSN: 1000-9450.

Dezhi Li, Changqing Liu, Conway, PP (Accepted for publication) Interfacial reactions between Pb-free solders and metallized substrate surfaces, 2005 6th International Conference on Electronic Packaging Technology, DOI: 10.1109/icept.2005.1564636.

Conferences

Zhang, L, Liang, S, Zhou, Z, Han, X, Liu, C (2020) A numerical study of heat transfer in PCM composites for the integration of batteries and power electronics. In , Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020,ISBN: 9781728162928. DOI: 10.1109/ESTC48849.2020.9229794.

Zhou, H, Jiang, H, Robertson, S, Zhou, Z, Liu, C (2020) Evaluation of microstructure and electrical property of Cu/Graphene composite coatings for electronics interconnections. In , Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020,ISBN: 9781728162928. DOI: 10.1109/ESTC48849.2020.9229882.

Jiang, H, Robertson, S, Zhou, Z, Liu, C (2020) Cu-Cu bonding with cu nanowire arrays for electronics integration. In , Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020,ISBN: 9781728162928. DOI: 10.1109/ESTC48849.2020.9229670.

Liu, C, Liu, A, Zhong, Y, Robertson, S, Zhou, Z, Liu, C (2020) Ultrasonic-assisted nano Ag-Al alloy sintering to enable high-temperature electronic interconnections. In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). DOI: 10.1109/ectc32862.2020.00311.

Zhong, Y, Liu, AY, Robertson, S, Liang, S, Liu, C, Zhou, Z, Liu, C (2020) Quasi-ambient Bonding Semiconductor Components for Power Electronics Integration. In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). DOI: 10.1109/ectc32862.2020.00232.

Liang, S, Zhong, Y, Robertson, S, Liu, A, Zhou, Z, Liu, C (2020) Investigation of Thermo-mechanical and Phase-change Behavior in the Sn/Cu Interconnects during Self-Propagating Exothermic Reaction Bonding. In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). DOI: 10.1109/ectc32862.2020.00052.

Jiang, H, Zhou, H, Robertson, S, Zhou, Z, Zhao, L, Liu, C (2019) Further enhancement of thermal conductivity through optimal uses of h-BN fillers in polymer-based thermal interface material for power electronics. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC); 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, pp.1569-1574, ISBN: 9781728114996. DOI: 10.1109/ECTC.2019.00241.

Zhang, D, Liu, S, Xiang, H, Liu, L, Zhou, Z, Robertson, S, Liu, C, Chen, Z, Liu, C (2019) Preparation and application of Cu-Ag composite preforms for power electronic packaging. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Proceedings - Electronic Components and Technology Conference, Las Vegas, pp.63-68, ISBN: 9781728114989. DOI: 10.1109/ECTC.2019.00017.

Yang, F, Liu, S, Zhou, Z, Chen, Z, Liu, L, Liu, C, Liu, C (2019) Mechanical properties of intermetallic compounds at elevated temperature by nanoindentation. In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Proceedings - Electronic Components and Technology Conference, Las Vagas, pp.850-854, ISBN: 9781728114989. DOI: 10.1109/ECTC.2019.00133.

Liang, SB, Zhang, XP, Wei, C, Ke, CB, Liu, C (2018) Interaction effects between the preferred growth of β-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling. In , 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings,ISBN: 9781538668139. DOI: 10.1109/ESTC.2018.8546386.

Zhou, Z, Liu, L, Liu, C (2018) Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy. In 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings,, ISBN: 9781538668146. DOI: 10.1109/ESTC.2018.8546440.

Wang, J, Zhou, Z, Lin, W-F, Liu, C, Ahmadi, B, Empringham, L (2018) Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging. In 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings,, ISBN: 9781538668139. DOI: 10.1109/ESTC.2018.8546493.

Liu, C (2017) Mechanical property of Cu-Sn-Ni intermetallics in the full intermetallic micro-joints formed with transient liquid phase soldering. In ICEPT, 18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, pp.1046-1050, ISBN: 9781538629727. DOI: 10.1109/ICEPT.2017.8046622.

Liu, L, Cui, J, Wang, J, Zhou, Z, Johnson, RW, Liu, C (2017) Interfacial reaction and microstructural evolution between Au-Ge solder and electroless Ni-W-P metallization in high temperature electronics interconnects. In Proceedings - Electronic Components and Technology Conference, pp.417-422, ISBN: 9781509043323. DOI: 10.1109/ECTC.2017.61.

Wang, J, Chen, G, Forbes, H, Christopoulos, K, Liu, C, Sun, L, Shang, P (2017) An investigation into the effect of dry bake on the solderability degradation of electrodeposited tin finishes. In 2017 18th International Conference of Electronic Packaging Technology (ICEPT), Harbin, China,ISBN: 9781538629727. DOI: 10.1109/ICEPT.2017.8046473.

Lim, YY, Aoyagi, M, Goh, YM, Liu, C (2016) High frequency performance characterization of super-fine inkjet printed silver traces. In 2016 IEEE CPMT Symposium Japan, ICSJ 2016, Japan, pp.239-242, ISBN: 9781509020379. DOI: 10.1109/ICSJ.2016.7801272.

Sugden, MW, Tao, J, Liu, C, Hutt, DA, Whalley, DC, Lietaer, N (2016) Characterisation of thermocompression bonds formed using metal coated polymer core particles for fine pitch interconnections. In 2016 6th Electronic System-Integration Technology Conference (ESTC), Grenoble. DOI: 10.1109/estc.2016.7764690.

Tao, J, Whally, DC, Liu, C (2016) Electrophoretic Deposition of Ni/Au Coated Particles for Ultra-Fine Pitch Interconnection. In , Proceedings - Electronic Components and Technology Conference, pp.2119-2125, ISBN: 9781509012039. DOI: 10.1109/ECTC.2016.360.

Flowers, J, Liu, C, Mitchell, S, Harland, A, Esliger, D (2016) Conductive microfluidic interconnects to enable scalable 3D manufacturing of wearable electronics. In ECTC: IEEE Electronic Components and Technology Conference, Las Vegas, Nevada USA,ISBN: 9781509012053. DOI: 10.1109/ECTC.2016.24.

Robbins, H, Liu, C, Hu, S, Bui, TT, Aoyagi, M (2016) Integration of a microfluidic chip with multiplexed optical fluorescence detector through anisotropic etching of Si using Tetramethylammonium hydroxide (TMAH). In , Grenoble, France,ISBN: 9781509014026. DOI: 10.1109/ESTC.2016.7764496.

Gao, X, Shi, Z, Liu, C, Yang, G, Silberschmidt, V (2016) Fracture behaviour of bacterial cellulose hydrogel: Microstructural effect. In Procedia Structural Integrity, pp.1237-1243, DOI: 10.1016/j.prostr.2016.06.158.

Mo, L, Wu, F, Liu, C (2015) Growth kinetics of IMCs in Cu-Sn intermetallic joints during isothermal soldering process. In , Proceedings - Electronic Components and Technology Conference, pp.1854-1858, ISBN: 9781479986095. DOI: 10.1109/ECTC.2015.7159852.

Chen, G, Wu, F, Liu, C, Chan, YC (2015) Effect of fullerene-C60&C70 on the microstructure and properties of 96.5Sn-3Ag-0.5Cu solder. In , Proceedings - Electronic Components and Technology Conference, pp.1262-1267, ISBN: 9781479986095. DOI: 10.1109/ECTC.2015.7159759.

Wang, J, Wilcox, GD, Mortimer, RJ, Liu, C, Ashworth, MA (2015) Electrodeposition and Characterisation of Novel Ni-NbO_x Composite Coatings as a Diffusion Barrier for Liquid Solder Interconnects - Part II: Diffusion Barrier Performance. In , ECS Transactions, pp.109-121, DOI: 10.1149/06440.0109ecst.

Tao, J, Whalley, D, Liu, C, Wu, F, Kristiansen, H (2015) Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections. In 2015 Electronic Components & Technology Conference, San Diego, pp.1154-1159, DOI: 10.1109/ECTC.2015.7159740.

Robbins, H, Hu, S, Liu, C (2015) A scalable engineering approach to improve performance of a miniaturized optical detection system for in vitro point-of-care testing. In Progress in Biomedical Optics and Imaging - Proceedings of SPIE,, DOI: 10.1117/12.2077526.

Lim, YY, Goh, YM, Yoshida, M, Bui, TT, Vincent, T, Aoyagi, M, Liu, C (2014) Silver screen printed transmission lines- analyzing the influence of substrate roughness on the RF performance up to 30 GHz. In 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). DOI: 10.1109/eptc.2014.7028386.

Liu, L, Mirgkizoudi, M, Zhang, P, Zhou, L, Liu, C (2014) Mechanical and interfacial characteristics of Zn-Al solder joints under elevated temperature and vibration conditions. In , ESTC 2014 - 5th Electronics System-Integration Technology Conference,ISBN: 9781479940264. DOI: 10.1109/ESTC.2014.6962818.

Zhu, W, Wu, F, Xu, Y, Liu, C (2014) Hermetical package of infrared sensors by Al/Ni self-propagating joining process. In , ESTC 2014 - 5th Electronics System-Integration Technology Conference,ISBN: 9781479940264. DOI: 10.1109/ESTC.2014.6962721.

Chen, G, Wu, F, Xia, W, Liu, H, Liu, C (2014) Effect of Ni-coated graphene on the performance of SAC305 solder. In , Proceedings of the Electronic Packaging Technology Conference, EPTC, pp.209-213, ISBN: 9781479947072. DOI: 10.1109/ICEPT.2014.6922638.

Liu, L, Zhou, L, Liu, C (2014) Electroless Ni-W-P alloy as a barrier layer between Zn-based high temperature solders and Cu substrates. In , Proceedings - Electronic Components and Technology Conference, pp.1348-1353, ISBN: 9781479924073. DOI: 10.1109/ECTC.2014.6897467.

Wang, J, Wilcox, G, Mortimer, RJ, Liu, C, Ashworth, M (2014) Electrodeposition and characterisation of novel Ni-NbOx composite coatings from glycol-based electrolytes as a diffusion barrier for high temperature electronics packaging. In ECS (The Electrochemical Society) and SMEQ (Sociedad Mexicana de Electroquímica) Joint International Meeting, Cancun, Mexico, pp.1710-1710.

Lim, Y, Goh, Y, Tsuda, H, Akedo, J, Aoyagi, M, Liu, C (2014) Adhesion of aerosol deposition traces targeted for flexible electronics applications. In International Conference on Advanced Manufacturing for Multifunctional Miniaturised Devices (ICAM3D), Ibaraki, Japan.

Lim, Y, Goh, Y, Yoshida, M, Bui, TT, Vincent, T, Aoyagi, M, Liu, C (2014) Silver screen printed transmission lines- influence of substrate porosity on the RF performance and modelling up to 30GHz. In 2014 IEEE 15th Electronics Packaging Technology Conference - (EPTC 2014), Singapore,ISBN: 9781479969944. DOI: 10.1109/EPTC.2014.7028386.

Man, R, Liu, C, Mirgkizoudi, M, Riches, S (2014) Modeling of thermomechanical behaviour of wire bonded electronic devices under combined thermal and vibration loads. In , International Conference and Exhibition on High Temperature Electronics, HiTEC 2014, pp.369-376, ISBN: 9781634391153.

Tao, J, Whalley, D, Liu, C (2014) Magnetic deposition of Ni/Au coated polymer core particles for flip-chip interconnection. In 2014 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, pp.409-413, DOI: 10.1109/ICEPT.2014.6922684.

Tao, J, Whalley, D, Liu, C, He, JY (2014) Process and performance modelling for individual ACA conductor particles. In Electronics System-Integration Technology Conference (ESTC), 2014, Helsinki, pp.1-6, DOI: 10.1109/ESTC.2014.6962798.

Jain, S, Whalley, DC, Cottrill, M, Kristiansen, H, Redford, K, Helland, S, Helland, T, Kalland, E, Liu, C (2013) Factors affecting conduction in novel isotropic conductive adhesives filled with silver coated polymer spheres. In EMPC, Grenoble, pp.1-6.

Jain, S, Whalley, DC, Cottrill, M, Helland, T, Kristiansen, H, Redford, K, Liu, C (2013) The Effect of Coating Thickness on the Electrical Performance of Novel Isotropic Conductive Adhesives Prepared Using Metallised Polymer Micro-Spheres. In Electronic Components and Technology Conference, Las Vegas, NV, USA, pp.796-796.

Mirgkizoudi, M, Liu, C, Conway, P, Riches, S (2013) Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics. In International Conference and Exhibition on High Temperature Electronics Network, St. Catherine’s College Oxford, United Kingdom, pp.000-000.

Jain, S, Whalley, DC, Cottrill, M, Kristiansen, H, Redford, K, Helland, S, Helland, T, Kalland, E, Liu, C (2013) Factors Affecting Conduction in Novel Isotropic Conductive Adhesives Filled with Silver Coated Polymer Spheres. In European Microelectronics and Packaging Conference, Grenoble, France, pp.000-000.

Xiong, Z, Liu, C, Zhang, X (2012) Inkjet printing of silver nano particles doped PEDOT:PSS thin film. In , ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, pp.177-181, ISBN: 9781467316804. DOI: 10.1109/ICEPT-HDP.2012.6474595.

Wilcox, GD, Ashworth, MA, Higginson, RL, Heath, RJ, Mortimer, RJ, Liu, C (2012) Manufacturing and In-service Tin Whisker Mitigation Strategies : The Co-deposition of Particulates and Conformal Coating. In 6th International Symposium on Tin Whiskers, Loughborough University, pp.1-1.

Wilcox, GD, Ashworth, MA, Higginson, RL, Heath, RJ, Mortimer, RJ, Liu, C (2012) The Mitigation of Tin Whiskers by Optimisation of Electroplating Process Methodologies. In 6th International Symposium on Tin Whiskers, Loughborough University, pp.1-1.

Wilcox, GD, Ashworth, MA, Higginson, RL, Heath, RJ, Mortimer, RJ, Liu, C (2012) The effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substrates. In Interfinish 2012, Milan, Italy, pp.1-1.

Cheng, X, Liu, C, Silberschmidt, VV (2012) Thermo-mechanical characteristics of indium micro-joint under various low-temperature excursions. In 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging. DOI: 10.1109/icept-hdp.2012.6474726.

Wilcox, GD, Ashworth, MA, Higginson, RL, Heath, RJ, Mortimer, RJ, Liu, C, Wang, J, Stuttle, C (2012) WHISKERMIT : Manufacturing and in-service tin whisker mitigation strategies for high value electronics. In PERM Meeting No 12, Marseille, France, pp.1-1.

Qi, S, Litchfield, R, Hutt, DA, Vaidhyanathan, B, Liu, C, Webb, P, Ebbens, S (2012) Copper conductive adhesives for printed circuit interconnects. In 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd Electronic Components and Technology Conference. DOI: 10.1109/ectc.2012.6249059.

Mo, L, Wu, F, Liu, C, Xia, W (2012) The size dependency of full IMC solder joint for 3D interconnection. In 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd Electronic Components and Technology Conference. DOI: 10.1109/ectc.2012.6248931.

Sugden, MW, Liu, C, Hutt, D, Whalley, D, Kristiansen, H (2012) Metal-coated mono-sized polymer core particles for fine pitch flip-chip interconnects. In 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd Electronic Components and Technology Conference. DOI: 10.1109/ectc.2012.6248831.

Lim, YY, Goh, YM, Liu, C (2012) RF Performance of Inkjet and Stencil Printed Traces for Flexible Electronics Applications. In 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012), Singapore, pp.1-10`.

Mirgkizoudi, M, Liu, C, Conway, P, Riches, S (2012) Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics. In International Conference on High Temperature Electronics, Albuquerque, New Mexico, p.335.

Qi, S, Litchfield, R, Hutt, DA, Vaidhyanathan, B, Liu, C, Webb, DP, Ebbens, S (2012) Copper Conductive Adhesives for Printed Circuit Interconnects. In Electronic Components and Technology Conference, San Diego, CA, pp.000-000.

Mo, L, Wu, F, Liu, C (2012) The Size Dependency of Full IMC Solder Joint for 3D Interconnection. In Electronic Components and Technology Conference, San Diego, CA, pp.000-000.

Chen, Z, An, B, Wu, Y, Liu, C, Parkin, RM (2012) Influence of IMCs volume ratio in micro-scale solder joints on their mechanical integrity. In Electronic Components and Technology Conference, San Diego, CA, pp.000-000.

Zhao, W, Santaniello, T, Webb, P, Lenardi, C, Liu, C (2012) A new approach towards an optimum design and manufacture of microfluidic devices based on ex situ fabricated hydrogel based thin films integration. In Electronic Components and Technology Conference, San Diego, CA, pp.1997-2004.

Sugden, MW, Liu, C, Hutt, DA, Whalley, DC (2012) Metal-Coated Mono-sized Polymer Core Particles for Fine Pitch Flip-Chip Interconnects. In Electronic Components and Technology Conference, San Diego, CA, pp.000-000.

Zhang, Y, Liu, C, Whalley, DC (2012) Factors influencing the size evolution of inkjet-etched micro-via-holes in thin polymer. In Large-area Organic & Printed Electronics, Munich, Germany, pp.000-000.

Chen, Z, An, B, Wu, Y, Liu, C, Parkin, RM (2012) Dimensional change in micro-scale solder joint induced by evolution of IMCs. In Proceedings of 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, pp.000-000.

Xiong, Z, Liu, C, Zhang, X (2012) Inkjet Printing of Silver Nano Particles doped PEDOT:PSS Thin Film. In Proceedings of 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, pp.177-177.

Zha, X, Liu, C, Silberschmidt, V (2012) Thermo-mechanical Behaviour Analysis of Micro-solder Joints by Finite Element Modelling. In Proceedings of 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, pp.1329-1329.

Cheng, X, Liu, C, Silberschmidt, V (2012) Thermo-mechanical characteristics of indium micro-joint under various low-temperature excursions. In Proceedings of 13th International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, pp.776-776.

Cheng, X, Liu, C, Firth, P (2012) Thermal Stabiity of Self-assembled Monolayers for Epoxy Control of Opto-electronics Assembly. In Proceedings of the 4th IEEE International Conference on Electronics Systems and Integration Technologies, Amsterdam RAI, Netherland, pp.34-36.

Zhang, X, Hu, S, Liu, C, Azorin-Peris, V, Imms, R (2012) Electrically conductive adhesive enable to manufacture high performance patch probe for non-invasive physiological assessment. In Proceedings of the 4th IEEE International Conference on Electronics Systems and Integration Technologies, Amsterdam RAI, Netherland, pp.000-000.

Lim, YY, Goh, YM, Liu, C (2012) RF Performance of Inkjet and Stencil Printed Traces for Flexible Electronics Applications. In Proceedings of the 14th IEEE Electronics Packaging Technology Conference, Resorts World Sentosa, Singapore, pp.572-572.

Zhao, W, Liu, C, Lenardi, C, Santaniello, T, Wu, F (2012) Mechanical fastening to enable room temperature packaging for LOCs based on biocompatible hydrogel thin film. In Proceedings of the 14th IEEE International Conference on Electronic Materials and Packaging, Lantau Island, Hong Kong, pp.316-316.

Zhang, X, Hu, S, Liu, C, Azorin-Peris, V, Imms, R (2012) Electrically conductive adhesive enable to manufacture high performance patch probe for non-invasive physiological assessment. In , Amsterdam, NETHERLANDS,ISBN: 9781467346450. DOI: 10.1109/ESTC.2012.6542187.

Jain, S, Whalley, DC, Cottrill, M, Kristiansen, H, Redford, K, Nilsen, CB, Helland, T, Liu, C (2011) Electrical properties of an Isotropic Conductive Adhesive filled with silver coated polymer spheres. In , EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings,ISBN: 9780956808608.

Wilcox, GD, Ashworth, MA, Higginson, RL, Heath, RJ, Mortimer, RJ, Liu, C (2011) WHISKERMIT - understanding and mitigating against tin whiskers. In SMART Group, (ed) Tin whiskers in electronics, Ford College, Loughborough, pp.1-5.

Jain, S, Whalley, DC, Cottrill, MCW, Kristiansen, H, Redford, K, Nilsen, CB, Helland, T, Liu, CC (2011) Electrical properties of an Isotropic Conductive Adhesive filled with silver coated polymer spheres. In Proceedings of the 18th IMAPS European Microelectronics and Packaging Conference (EMPC), Brighton, UK, pp.240-246, ISBN: 978-0-9568086-0-8.

Tian, Y, Liu, C, Hutt, D, Stevens, B, Flynn, D, Desmulliez, MPY (2011) Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation. In High Density Packaging (ICEPT-HDP), 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging. DOI: 10.1109/icept.2011.6066937.

Xiong, Z and Liu, C (2011) The application of inkjet direct writing in solar cell fabrication: An overview. In High Density Packaging (ICEPT-HDP), 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging. DOI: 10.1109/icept.2011.6066820.

Jain, S, Whalley, DC, Cottrill, MCW, Kristiansen, H, Redford, K, Nilsen, CB, Helland, T, Liu, C (2011) Electrical properties of an Isotropic Conductive Adhesive filled with silver coated polymer spheres. In Proceedings of the 18th IMAPS European Microelectronics and Packaging Conference, Brighton, pp.240-246.

Xiong, Z and Liu, C (2011) Effect of substrates surface condition on the morphology of silver patterns formed by inkjet printing. In Proceedings of the 18th IMAPS European Microelectronics and Packaging Conference, Brighton, pp.1-4.

Xu, H, Acoff, VL, Liu, C, Silberschmidt, V, Chen, Z (2011) Void Growth in Thermosonic Copper/Gold Wire Bonding on Aluminum Pads. In Electronic Components and Technology Conference, Lake Buena Vista, FL, pp.1729-1735.

Xiong, Z and Liu, C (2011) The Application of Inkjet Direct Writing in Solar Cell Fabrication: An Overview. In International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, pp.739-744.

Tian, Y, Liu, C, Hutt, DA, Stevens, B, Flyn, D, Desmulliez, MPY (2011) Investigation of High Speed Micro-bump Formation through Electrodeposition Enhanced by Megasonic Agitation. In International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, pp.739-744.

Kamaludin, KA, Mirgkizoudi, M, Liu, C, Riches, S (2011) Effects of Combined Thermal and Vibration Loadings on the Wire Bond Integrity. In International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, pp.828-831.

Wassay, A, Liu, C, Williams, O, Webb, DP, Firth, P (2010) Accuracy and Repeatability of Laser Micromachined Passive Alignment Features on Ceramic Optoelectronic Substrates. In 12th Electronics Packaging Technology Conference, Singapore, pp.1-6.

Wassay, A, Liu, C, Williams, O, Webb, DP, Firth, P (2010) Accuracy and repeatability of laser micromachined passive alignment features on ceramic optoelectronic substrates. In 2010 12th Electronics Packaging Technology Conference - (EPTC 2010), 2010 12th Electronics Packaging Technology Conference. DOI: 10.1109/eptc.2010.5702693.

Knauf, BJ, Liu, C, Webb, DP, Conway, PP (2010) Polymer Bonding by Induction Heating for Microfluidic Applications. In Proceedings of the 3rd IEEE International Conference on Electronics Systems and Integration Technologies (ESTC 2010), Berlin, p.8.

Qin, Y, Liu, C, Wilcox, GD, Zhao, K, Wang, C (2010) Near-eutectic Sn-Ag-Cu Solder Bump Formation for Flip-chip Interconnection by Electrodeposition. In Proc. Electronic Components and Technology Conference (60th ECTC 2010), Las Vegas, USA, pp.1-7.

Yan, H, Tan, YY, Liang, MH, Chen, Z, Ng, CM, Xu, H, Liu, C, Silberschmidt, VV (2010) Amorphous metallic thin films as copper diffusion barrier for advanced interconnect applications. In Proceedings of 11th Electronics Packaging Technology Conference (EPTC '09), Singapore, Singapore, pp.567-572, ISBN: 978-1-4244-5099-2. DOI: 10.1109/EPTC.2009.5416485.

Xu, H, Liu, C, Silberschmidt, V, Sivakumar, M, Chen, Z (2010) Effect of ultrasonic energy on interfacial structure and bond strength in copper wire bonding. In Proceedings of the 60th Electronic Components and Technology Conference (ECTC), Las Vegas, Nevada USA, pp.336-341, DOI: 10.1109/ECTC.2010.5490952.

Zhang, Y, Liu, C, Whalley, DC (2010) The effect of droplet ejection frequency on inkjet-etched micro via holes. In Electronics Packaging Technology Conference (EPTC), Singapore, pp.236-239.

Mirgkizoudi, M, Liu, C, Riches, S (2010) Reliability Testing of Electronic Packages in Harsh Environments. In 12th Electronics Packaging Technology Conference, Singapore, p.224.

Zhang, Y, Liu, C, Whalley, D (2010) The effect of droplet ejection frequency on inkjet-etched micro via holes. In ,ISBN: 9781424485604. DOI: 10.1109/EPTC.2010.5702639.

Yan, H, Tay, YY, Liang, MH, Chen, Z, Ng, CM, Pan, S, Xu, H, Liu, CC, Silberschmidt, V (2009) Amorphous metallic thin films as copper diffusion barrier for advanced interconnect applications. In Proceedings of 11th Electronic Pacakging Technology Conference, Singapore, pp.567-572, ISBN: 9781424451005.

Xu, H, Liu, C, Silberschmidt, V, Chen, Z, Sivakumar, M (2009) TEM interfacial characteristics of thermosonic gold wire bnonding on aluminium metallization. In Proceedings of 11th Electronics Packaging Technology Conference (EPTC '09), Singapore, Singapore, pp.512-517, ISBN: 978-1-4244-5099-2. DOI: 10.1109/EPTC.2009.5416495.

Qin, Y, Liu, C, Wilcox, GD, Zhao, K, Wang, C (2009) Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection. In Proceedings of the Electronics Pacaging Technology Conference (EPTC '09), Singapore, Singapore, pp.278-282, ISBN: 978-1-4244-5099-2.

Williams, O, Williams, M, Liu, C, Webb, DP, Firth, P (2009) Laser micromachining of polycrystalline alumina and aluminium nitride to enable compact optoelectronic interconnects. In Proceedings of the 11th Electronics Packaging Technology Conference, EPTC '09, Singapore, pp.920-925, DOI: 10.1109/EPTC.2009.5416413.

Williams, O, Liu, C, Webb, DP, Firth, P (2009) Adsorbed contamination of ceramic surfaces stored in industrial ambient conditions and its effect on epoxy bleed. In Proceedings of the 11th Electronics Packaging Technology Conference, EPTC '09, Singapore, pp.500-505, DOI: 10.1109/EPTC.2009.5416497.

Tian, Y, Liu, C, Hutt, DA, Steven, B, Flynn, D, Desmulliez, MPY (2009) High density indium bumping using electrodeposition enhanced by megasonic agitation. In (EPTC '09), Proceedings of the 11th Electronics Packaging Technology Conference, Singapore, pp.31-35, DOI: 10.1109/EPTC.2009.5416576.

Cheng, X, Liu, C, Silberschmidt, VV (2009) Intermetallics formation and evolution in pure indium joint for cryogenic application. In 2009 11th Electronics Packaging Technology Conference (EPTC), 2009 11th Electronics Packaging Technology Conference. DOI: 10.1109/eptc.2009.5416484.

Tian, Y, Hutt, DA, Liu, C, Stevens, B (2009) High density indium bumping through pulse plating used for pixel X-ray detectors. In (ICEPT-HDP) '09, Proceedings of the International Conference on Electronic Packaging Technology and High Density Packaging, Beijing, China, pp.456-460, DOI: 10.1109/ICEPT.2009.5270712.

Webb, DP, Conway, PP, Hutt, DA, Knauf, BJ, Liu, CC (2009) Processes for Integration of Microfluidic Based Devices. In 17th European Microelectronics and Packaging Conference (EMPC), Rimini, Italy, pp.1-7.

Knauf, BJ, Webb, DP, Liu, CC, Conway, PP (2009) Packaging for Polymer Microfluidic Systems Using Low Frequency Induction Heating (LFIH). In Proceedings of the 3rd Annual Lab-on-a-Chip European Congress (LOACEC2009), Stockholm, Sweden, p.27.

Cheng, X, Liu, CC, Silberschmidt, V (2009) Mechanical response of indium micro-joints to low temperature cycling. In Electronic Components and Technology Conference (ECTC 2009), San Diego, CA, pp.1792-1795, ISBN: 9781424444755. DOI: 10.1109/ECTC.2009.5074260.

Webb, DP, Knauf, BJ, Liu, CC, Hutt, DA, Conway, PP (2009) Productionisation issues for commercialisation of microfluidic based devices. In Proceedings of Microtech 2009, Edinburgh, UK, pp.1-10.

Qin, Y, Wassey, A, Liu, C, Wilcox, GD, Zhao, K, Wang, C (2009) Electrodeposition of Sn-Cu solder alloy for electronics interconnection. In ICEPT-HDP '09, Proceedings of the International Conference on Electronic Packaging Technology and High Density Packaging, Beijing, China, pp.772-777, ISBN: 978-1-4244-4658-2. DOI: 10.1109/ICEPT.2009.5270643.

Zhang, Y, Liu, C, Whalley, DC (2009) Direct-write techniques for maskless production of microelectronics: A review of current state-of-the-art technologies. In International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP '09), Beijing, China, pp.497-503, ISBN: 978 1 4244 4658 2. DOI: 10.1109/ICEPT.2009.5270702.

Cheng, X, Liu, CC, Silberschmidt, V (2009) Numerical analysis of response of indium micro-joint to low-temperature cycling. In ICEPT-HDP, In: 2009 International Conference on Electronic Packaging Technology and High Density Packaging, Beijing, China, pp.290-293, ISBN: 978-1-4244-4658-2. DOI: 10.1109/ICEPT.2009.5270745.

Zhang, Y, Liu, C, Whalley, DC (2009) Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologies. In Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), China, pp.497-503.

Xu, H, Liu, C, Silberschmidt, V, Chen, Z (2008) TEM Microstructural Analysis of As-bonded Copper Ball Bonds on Aluminum Metallization. In Proceedings of 10th Electronics Packaging Technology Conference (EPTC '08), Singapore, Singapore, pp.789-794, ISBN: 978-1-4244-2117-6.

Qin, Y, Wilcox, GD, Liu, CC (2008) Electrodeposition of Sn-Ag Solder Alloy for Electronics Interconnection. In Proc. Electronics System-Integration Technology Conference, Greenwich, London, pp.833-837.

Xu, H, Liu, C, Silberschmidt, V (2008) Effect of thermal aging on interfacial behaviour of copper ball bonds. In Proceedings of the 2nd Electronic System-Integration Technology Conference (ESTC '08), Greenwich, UK, pp.891-896, ISBN: 978-1-4244-2813-7. DOI: 10.1109/ESTC.2008.4684470.

Knauf, JB, Webb, DP, Liu, CC, Conway, PP (2008) Packaging of polymer based microfluidic systems using low frequency induction heating (LFIH). In Proceedings of the 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2008), Shanghai, PRC, pp.1-6.

Xu, H, Liu, C, Silberschmidt, V, wANG, H (2008) Effects of process parameters on bondability in thermosonic copper ball bonding. In Proceedings of 58th Electronic Components and Technology Conference (ECTC '08), Florida, USA, pp.1424-1430, ISBN: 978-1-4244-2230-2. DOI: 10.1109/ECTC.2008.4550164.

Williams, O, Liu, CC, Webb, DP, Firth, P (2008) Epoxy adhesion strength to ceramic surfaces in commercial optoelectronic assemblies. In Proceedings of the 58th Electronics Components and Technology Conference, 2008, ECTC 2008, Lake Buena Vista, Florida, USA, pp.1673-1678.

Williams, O, Liu, CC, Webb, DP, Firth, P (2008) Epoxy adhesion strength to ceramic surfaces in commercial optoelectronic assemblies. In Proceedings of the 58th Electronic Components and Technology Conference (ECTC 2008), Lake Buena Vista, USA, pp.1673-1678.

Tian, Y, Liu, C, Hutt, DA, Stevens, B (2008) Electrodeposition of indium for bump bonding. In (ECTC '08), Proceedings of 58th Electronic Components and Technology Conference, Florida, USA, pp.2096-2100, DOI: 10.1109/ECTC.2008.4550274.

Liu, J, Liu, CC, Conway, PP (2008) Growth Mechanism of Copper Column by Electrodesposition for Electronic Interconnections. In 2nd International IEEE Electronics System-Integration Technology Conference, Proceedings of 2nd International IEEE Electronics System-Integration Technology Conference, London, 1st - 4th September 2008, pp.679-684, ISBN: 9781424428144.

Hin, TY, Liu, CC, Conway, PP (2008) The Effect of Surface Modification on Adhesion of Polymer Waveguide on Flexible Substrate. In 2nd International IEEE Electronics System-Integration Technology Conference, Proceedings of the 2nd International IEEE Electronics System-Integration Technology Conference, London, 1st - 4th September 2008, pp.969-976, ISBN: 9781424428144.

Knauf, BJ, Webb, DP, Liu, CC, Conway, PP (2008) Plastic Packaging Using Low Frequency Induction Heating (LFIH) for Microsystems. In 10th International IEEE Electronics Packaging Technology Conference, Proceedings of the 10th International IEEE Electronics Packaging Technology Conference, Singapore, 9th - 12th December 2008, pp.172-180, ISBN: 9781424421183.

Hin, TY, Liu, CC, Conway, PP (2008) Controlling Interfacial Interpenetration of Polymer Waveguide Deposited on Plasma Treated Flexible Substrate. In 10th International IEEE Electronics Packaging Technology Conference, Proceedings of the 10th International IEEE Electronics Packaging Technology Conference, Singapore, 9th - 12th December 2008, pp.828-833, ISBN: 9781424421183.

Tian, Y, Kaufmann, J, Liu, C, Hutt, DA, Desmulliez, MPY (2008) Megasonic enhanced wafer bumping process to enable high density electronics interconnection. In (ESTC '08), Proceedings of 2nd Electronics System-Integration Technology Conference, Greenwich, UK, pp.725-729, DOI: 10.1109/ESTC.2008.4684440.

Ebbens, SJ, Hutt, DA, Liu, CC (2007) Patterning copper using ink jet printing of self-assembled monolayers. In Proceedings of the 9th Electronics Packaging Technology Conference, EPTC, Singapore, pp.114-119, ISBN: 1-4244-1323-0.

Hin, TY, Liu, C, Conway, PP (2007) 3D approaches of optical waveguide fabrication on flexible substrate and its application. In , 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007, pp.50-55, ISBN: 9781622764662.

Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2007) Modeling of thermal stress in Sn-Ag-Cu solder joint in flip chip. In Chao, CK and eds, CYL (ed) Proceedings of the Seventh International Congress on Thermal Stresses, TS2007, Taipei, Taiwan, pp.433-436, ISBN: 978-986-00-9556-2.

Ebbens, SJ, Hutt, DA, Liu, CC, Williams, O (2007) Surface Micro-patterning with Self-assembled Monolayers Selectively Deposited on Copper Substrates by Ink-jet Printing. In Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, USA, pp.1362-1367, ISBN: 1-4244-0985-3.

Gong, J, Liu, CC, Conway, PP, Silberschmidt, V (2007) Crystallographic Structure and Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate. In Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, USA, pp.677-683, ISBN: 1-4244-0985-3.

Liu, J, Liu, CC, Conway, PP (2007) Crystallographic Features of Copper Column Growth by Reversible Pulse Current Electrodeposition. In Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, USA, pp.892-897, ISBN: 1-4244-0985-3.

Him, TY, Liu, CC, Conway, PP (2007) A Review on 3D Integrated Approaches in Multimode Optical Polymeric Waveguide Fabrication. In Proceedings of the 57th IEEE Electronic Components and Technology Conference, Reno, Nevada, USA, pp.1737-1741, ISBN: 1-4244-0985-3.

Dou, G, Whalley, DC, Liu, CC (2006) Mechanical and Electrical Characterisation of Individual ACA Conductor Particles. In Proceedings of the 8th IEEE CPMT International Symposium on Electronics Materials and Packaging (EMAP), Hong Kong, pp.667-675, ISBN: 1-4244-0834-2.

Ebbens, SJ, Hutt, DA, Liu, CC (2006) Investigation of Ink-Jet Printing of Self-assembled Monolayers for Copper Circuit Patterning. In Proceedings of the 8th Electronics Packaging Technology Conference (EPTC 2006), Singapore, pp.46-52, ISBN: 1-4244-0664-1.

Chen, K, Liu, C, Whalley, DC, Hutt, DA, Li, JF, Mannan, SH (2006) Electroless Ni-W-P Alloys as Barrier Coatings for Liquid Solder Interconnects. In Proceedings of the 1st IEEE Electronic Systemintegration Technology Conference, Dresden, Sept 5 - 7 ology Conference, Dresden, Germany, pp..p.421-427, ISBN: 1-4244-0553-X.

Dou, G, Whalley, DC, Liu, C (2006) Deformation Property Measurement for Single Anisotropic Conductive Adhesive Particles. In Proceedings of the 1st IEEE Electronic Systemintegration Technology Conference,Dresden,Sept 5 - 7, 2006, Dresden, pp..p. 840-847, ISBN: 1-4244-0553-X.

Ebbens, SJ, Hutt, DA, Liu, C (2006) Thermal Stability Of Self-Assembled Monolayer Copper Preservatives For Fluxless Soldering. In Proceedings of the 1st IEEE Electronic Systemintegration Technology Conference, Dresden, Sept 5 - 7, 2006, Dresden, pp..p. 1360-1366, ISBN: 1-4244-0553-X.

Li, D, Liu, C, Conway, PP (2006) Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads. In Proceedings of the 2006 IEEE High Density Microsystem Design and Packaging and Component Failure Analysis (HDP, 2006), Shanghai, China, pp.159-165, ISBN: 1-4244-0488-6.

Dou, G, Whalley, DC, Liu, C (2006) Effects of Co-planarity Variation on Conduction in Antisotropic conductive Adhesive Assemblies. In Proceedings of the 56th IEEE Electronics Components and Technology Conference (ECTC'55), San Diego, pp.932-938.

Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2006) Grain features of SnAgCu solder and their effect on mechanical behaviour of microjoints. In Proceedings of the IEEE Electronics Components and Technology Conference (ECTC'56), San Diego, CA, USA, pp.250-257.

Ebbens, SJ, Hutt, DA, Liu, C (2006) Effect of Temperature and Storage Environment on the Preservation of Copper Surfaces for Fluxless Soldering. In Proceedings of the 56th IEEE Electronics Components and Technology Conference (ECTC'56), San Diego, USA, pp.1847-1852.

Gong, J, Liu, C, Conway, P, Silberschmidt, V (2006) Mechanical behaviour of grains in SnAgCu solder joints. In ,ISBN: 9781424408344. DOI: 10.1109/EMAP.2006.4430595.

Chen, K, Liu, C, Whalley, DC, Hutt, DA (2005) Stablility of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tin. In Proceedings of the 7th IEEE CPMT International Symposium on Electronics Materials and Packaging (EMAP), Tokyo, pp.107-111, ISBN: 1-4244-0107-0.

Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2005) Micromechanical modelling of Sn-Ag-Cu solder joint under cycling loading. In Proceedings of the 15th International Workshop on Computational Mechanics of Materials (IWCMM15), Dussledorf, Germany.

Li, J, Mannan, SH, Clode, MP, Liu, C, Chen, K, Whalley, DC, Hutt, DA, Conway, PP (2005) Molten Solder Interconnects I: Evaluation of Sn-Bi-X/Cu systems and failure mechanisms of LGA assemblies. In Proceedings of The International Conference on High Temperature Electronics, Paris, France.

Chen, K, Li, J, Liu, C, Whalley, DC, Hutt, DA, Conway, PP, Mannan, SH, Clode, MP, Lobato, HM (2005) Molten Solder Interconnects II: Reactions between Ni-P substrates and Sn-Bi based solders. In Proceedings of The International Conference on High Temperature Electronics, Paris, France.

Li, D, Liu, C, Conway, PP (2005) Interfacial reactions between Pb-free solders and metallised substrate surfaces, IEEE Catalog No 05EX1194. In Proceedings of International Conference on Electronics Packaging Technology (ICEPT'05), Shenzhen, China, pp.360-365, ISBN: 0-7803-9449-6.

Gong, J, Liu, C, Conway, PP, Silberschmidt, V (2005) Modelling of Ag3Sn coarsening and its effect on creep of Sn-Ag eutectics. In Proceedings of EUROMECH 466 Computational and Experimental Mechanics of Advanced Materials, Loughborough, UK.

Liu, C, Hutt, DA, Li, D, Conway, PP (2005) Effect of microstructural characteristics of electroless nickel metallization on solderability to Pb-free solder alloys. In ASME InterPACK2005, Proceedings of the Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS adn Electronic Systems, San Francisco, USA, pp.-, ISBN: 0-7918-3762-9.

Kay, RW, de Gouruff, E, Desmulliez, MPY, Jackson, GJ, Steen, HAH, Liu, C, Conway, PP (2005) Stencil printing technology for wafer level bumping at sub-100 micron pitch using Pb-free alloys. In ECTC, Proceedings of the 55th Electronics Components and Technology Conference (ECTC'55), Lake Buena Vista, FL, USA, pp.848-854.

Li, J, Mannan, SH, Clode, MP, Lobato, HM, Liu, C, Whalley, DC, Lawrence, FT, Jackson, GJ, Steen, HAH (2005) Interactions between liquid Sn-Bi based solders and contact metals in high temperature applications. In Proceedings of the 55th Electronics Components and Technology Conference (ECTC'55), Lake Buena Vista, Fl, USA, pp.441-451.

Kay, RW, de Gourff, E, Abraham, E, Desmulliez, MPY, Jackson, GJ, Steen, HAH, Liu, C, Conway, PP (2005) Stencil printing for fine pitch wafer level bumping. In Proceedings of the SEMICON Europa 2005 : Advanced Packaging Conference, Munich, Germany.

Desmulliez, MPY, Kay, RW, Abraham, E, de Gourcuff, E, Jackson, GJ, Steen, HAH, Liu, C, Conway, PP (2005) Sub-100 micron pitch stencil printing for wafer scale bumping. In , High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on, pp.1-7, ISBN: 0780392922.

Dou, G, Whalley, DC, Liu, CC (2004) Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles. In Proceedings of the 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC, Binghamton, USA, pp.132-136, ISBN: 0-7803-8744-9.

Huang, Z, Liu, C, Conway, PP, Thomson, RC (2004) Characterisation of Intermetallics and Mechanical Behaviour in the Reaction between SnAgCu and Sn-Pb Solder Alloys. In IEE Catalog No. 04EX905C, Proceedings of 6th Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04), Shanghai, China, pp.359-366, ISBN: 0-7803-8621-3.

Dou, G, Whalley, DC, Liu, C (2004) Electrical Conductive Characteristics of ACA Bonding: A Review of the Literature, Current Challenges and Future Prospects. In IEE Catalog No 04EX905C, Proceedings of 6th Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04), Shanghai, China, pp.359-366, ISBN: 0-7803-8621-3.

Liu, C, Hendriksen, MW, Hutt, DA, Conway, PP, Whalley, DC (2004) Materials and Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection. In IEE Catalog No 04EX905C, Proceedings of 6th Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04), Shanghai, China, pp.290-293, ISBN: 0-7803-8621-3.

Li, D, Liu, C, Conway, PP (2004) Micromechanical Characterisation of Sn-Ag-Cu Solder FCOB Interconnects at Ambient and Elevated Temperatures. In Proceedings of the 54th Electronics Components and Technology Conference (ECTC'54), Las Vegas, Nevada, USA, pp.128-133.

Liu, C, Huang, Z, Conway, PP, Thomson, RC (2004) Materials Behaviour and Intermetallics Characteristics in the Reaction Between SnAgCu and Sn-Ph Solder Alloys. In Proceedings of the 54th Electronics Components and Technology Conference (ECTC'54), Las Vegas, Nevada, USA, pp.1347-1353.

Li, D, Liu, C, Conway, PP (2003) Direct Soldering onto the UBM of Electroless Deposited Ni-Pb-free Alloys. In Proceedings of EMAP 2003 (International Symposium on Electronic Materials and Packaging), Singapore, pp.269-276, ISBN: 981-05-0078-5.

Huang, Z, Conway, PP, Liu, C, Thomson, RC (2003) Thermodynamic and Kinetic Behaviour of Materials in Micro Joints Formed with Sn-Pb and Pb free Solders. In Proceedings of EMAP 2003 (International Symposium on Electronic Materials and Packaging), Winner of Cookson Electronics Paper Award, Singapore, pp.33-40, ISBN: 981-05-0078-5.

Liu, C, Conway, PP, Li, D, Hendriksen, M (2003) Analysis of the Micro-Mechanical Properties in Aged Lead-Free Fine Pitch Flip Chip Joints. In Proceedings of the ASME/JSME IPACK03 International Electronic Packaging Technical Conference, ASME Catalogue No I644CD, Maui, Hawaii, USA, p.7, ISBN: 0-7918-3674-6.

Huang, Z, Conway, PP, Liu, C, Thomson, RC (2003) Inter-dependence of Processing and Alloy Composition on the Reliability of Sn-based Lead Free Solders in Fine Pitch FCOB Interconnection. In Proceedings of the IEEE 28th International Electronics Manufacturing Technology Symposium, Winner of an IEEE/CPMT/SEMI Best Paper Award, San Jose, California, USA, p.7, ISBN: 0-7803-7933-0.

Liu, C, Li, D, Conway, PP (2003) Characterisation of Intermetallic Ageing in Flip Chip Solder Bumps. In Proceedings of the IEEE 53rd Electronic Components and Technology Conference, IEEE Catalog No 03CH37438, New Orleans, Louisiana, USA, pp.1767-1771, ISBN: 0-7803-7430-4.

Liu, C, Geggel, M, Conway, PP, Hendriksen, M (2002) Micro-scale Mechanical Properties of Fine Feature Flip Chip with Lead Free Solders. In Proceedings of the 4th International IEEE Symposium on Electronics Materials and Packaging (EMAP2002), IEEE Catalogue 02EX634, Kaohsiung, Taiwan, pp.259-266, ISBN: 0-7803-7682-X.

Liu, C and Hutt, DA (2002) Novel Surface Coatings to Enable Fluxless Soldering of Copper Surfaces. In IEEE 52nd ECTC (52nd International Electronic Components & Technology Conference), San Diego, CA, USA, pp.138-145.

Liu, C, Bi, Q, Matthews, A (2002) Tribological and Electrochemical Performance of PVD TiN Coatings for the Femoral Head of Ti-6A1-4V Artificial Hip Joints. In International Conference on Metallurgical Coatings and Thin Films (ICMCTF), Session EP, San Diego, California, USA, Paper No. 199.

Liu, C, Bi, Q, Ziegle, A, Leyland, A, Matthews, A (2001) Structure and Corrosion Properties of PVD Cr-N Coatings. In AVS 48th International Symposium, Moscone Centre, San Francisco, California, USA, pp.Paper No.AS-TuP10.

Liu, C, Hutt, DA, Whalley, DC, Conway, PP, Mannan, SH (2000) Under Bump Metallisation of Fine Pitch Flip-chip Using Electroless Nickel Deposition. In Proceedings of the International Symposium on Electronic Materials and Packaging 2000 (EMAP2000), IEEE Catalog No 00EX458, Hong Kong, pp.64-71, ISBN: 0-7803-6654-9.

Liu, C, Leyland, A, Lyon, S, Matthews, A (1995) Electromechanical Impedance Spectroscopy of PVD-TiN Coatings on Mild Steel and AIS13 16 Substrates. In International Conference on Metallurgical Coatings and Thin Films (ICMCTF), San Diego, California, USA, pp.64-71.

Liu, C, Leyland, A, Lyon, S, Matthews, A (1995) An ac Impedance Study on PVD CrN-coated Mild Steel with Different Surface Roughnesses. In International Conference on Metallurgical Coatings and Thin Films (ICMCTF), San Diego, California, USA, pp.64-71.

Liu, C, Yu, ZM, Xu, JY, Jin, ZJ (1991) Interface Structure, Mictrostress and Adherence of Y-modified Ion-plated Titanium Nitride Film on Mild Steel. In al, EBGXE (ed) Proceedings of the 2nd International Conference on Rare Earth Development and Application, Beijing, China, pp.916-920.

Liu, C, Yu, L, Yu, ZM, Jin, ZJ, Wu, WT (1991) Measurement of Microstrain of Yttrium Modified Ion-plated Hard Coatings. In Ed, LH (ed) C-MRS International 1990 Symposia Proceedings, Thin Films and Beam-Solid Interactions, Beijing, China, pp.41-46.

Jin, ZJ, Yu, L, Liu, C, Dai, SX, Yu, ZM (1991) Analysis of New Method for Measuring Adhesion of PVD Films. In Ed, LH (ed) C-MRS International 1990 Symposia Proceedings, Thin Films and Beam-Solid Interactions, Beijing, China, pp.47-52.

Liu, C, Jin, ZJ, Wu, WT (1990) Correlation of Structure and Corrosion Resistance of Yttrium-modified Ion-plated Coatings. In Metallurgia, EBAID (ed) Proceedings of 11th International Conference of Corrosion Control, Florence, pp.1.251-1.258.

Wu, WT, Liu, C, Yu, L, Yu, ZM, Jin, ZJ, Wu, WT (1990) Microstructure Characteristics of Y-modified TiN Film by TEM. In The Tenth International Conference on Vac. Metallurgy (10th ICVM), Beijing, China, p.5.

Liu, C, Yu, L, Yu, ZM, Jin, ZJ, Wu, WT (1988) Microstructure and Corrosion Resistance of Ion Plated Mild Steel. In First Symposium of Sino-Japanese Ion Surface Modification Association, Shangjiajie, China, p.5.

Liu, C, Jin, ZJ, Yu, L, Yu, ZM, Wu, WT (1988) Residual Stresses and Failure of Hard Ti(C,N) Coatings. In First Symposium of Sino-Japanese Ion Surface Modification Association, Zhangjiajie, China, p.5.

CD Objects

Li, D, Liu, C, Conway, PP (2006) Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads,, ISBN: 1-4244-0488-6.

Kay, RW, de Gouruff, E, Desmulliez, MPY, Jackson, GJ, Steen, HAH, Liu, C, Conway, PP (2005) Stencil printing technology for wafer level bumping at sub-100 micron pitch using Pb-free alloys,.

Li, J, Mannan, SH, Clode, MP, Lobato, HM, Liu, C, Whalley, DC, Lawrence, FT, Jackson, GJ, Steen, HAH (2005) Interactions between liquid Sn-Bi based solders and contact metals in high temperature applications,.

Kay, RW, de Gourff, E, Abraham, E, Desmulliez, MPY, Jackson, GJ, Steen, HAH, Liu, C, Conway, PP (2005) Stencil printing for fine pitch wafer level bumping,.

Liu, C, Conway, PP, Li, D, Hendriksen, M (2003) Analysis of the Micro-Mechanical Properties in Aged Lead-Free Fine Pitch Flip Chip Joints,, ISBN: 0-7918-3674-6.

Huang, Z, Conway, PP, Liu, C, Thomson, RC (2003) Inter-dependence of Processing and Alloy Composition on the Reliability of Sn-based Lead Free Solders in Fine Pitch FCOB Interconnection,, ISBN: 0-7803-7933-0.

Liu, C, Li, D, Conway, PP (2003) Characterisation of Intermetallic Ageing in Flip Chip Solder Bumps,.

Reports

Wang, J and Liu, C (2017) Preconditioning and solderability testing of component termination finishes, Huawei China.

Conway, PP, Fu, EKY, Liu, C, Sarvar, F, Webb, DP, Williams, K (2002) Droplet Weld: Low Cost Lead Free Joining with Droplet Technology, Final Report, Contract G1RD-CT-2000-00209.

Other

Hutt, DA and Liu, C (2002) Surface Coatings to Enable Fluxless Soldering of Copper Substrates.