Journal Articles

Sinclair, M, Siemieniuch, C, Palmer, P (2018) The identification of knowledge gaps in the technologies of cyber-physical systems with recommendations for closing these gaps, Systems Engineering, ISSN: 1098-1241.

Phaal, R and Palmer, PJ (2010) Technology Management—Structuring the Strategic Dialogue, Engineering Management Journal, 22(1), pp.64-74, ISSN: 1042-9247. DOI: 10.1080/10429247.2010.11431854.

Webb, P, Jaggernauth, WA, Cottrill, MCW, Palmer, P, West, A, Conway, P (2010) Design and construction of large-area flexible printed-circuit automotive electrical interconnection harnesses, ISSN: 0954-4070. DOI: 10.1243/09544070JAUTO1175.

Webb, P, Hutt, D, Hopkinson, N, Conway, P, Palmer, P (2009) Packaging of microfluidic devices for fluid interconnection using thermoplastics, ISSN: 1057-7157. DOI: 10.1109/JMEMS.2009.2013404.

Sarvar, F, Whalley, DC, Hutt, DA, Palmer, PJ, Teh, NJ (2007) Thermal and Thermo-Mechanical Modelling of Polymer Overmoulded Electronics, Microelectronics International, 24(3), pp.66-75, ISSN: 1356-5362. DOI: 10.1108/13565360710818439.

Hyslop, SM, Palmer, PJ, Whalley, DC (2005) A software tool for estimation of PCB substrate utilisation efficiency statistics from scanned images, Circuit World, 31(3), pp.10-16, ISSN: 0305-6120. DOI: 10.1108/03056120510585018.

Webb, P, Jaggernauth, WA, Cottrill, MCW, West, A, Conway, P, Palmer, P (2004) Electromagnetic compatibility performance of large area flexible printed circuit automotive harness, ISSN: 0954-4070. DOI: 10.1243/0954407041580102.

Stokes, CA and Palmer, P (2004) Framework for a technology-watch relay station.

Webb, DP, Cottrill, MCW, Jaggernauth, WA, West, AA, Palmer, PJ, Conway, PP (2003) Foresight Vehicle: Physical Media for Automotive Multiplex Networks Implemented on Large Area Flexible Printed Circuit Boards, SAE Transactions 2002: Journal of Passenger Cars - Electronic and Electrical Systems, Paper No 2002-01-1130, pp.638-642.

Teh, NJ, Conway, PP, Palmer, PJ, Kioul, A, Prosser, S (2001) Statistical Optimisation of Thermoplastic Injection Moulding Process for the Encapsulation of Electronic Subassembly, Journal of Electronics Manufacturing, 10(3), pp.171-179, ISSN: 0960-3131. DOI: 10.1142/S0960313100000150.

TEH, NJ, CONWAY, PP, PALMER, PJ, PROSSER, S, KIOUL, A (2000) STATISTICAL OPTIMISATION OF THERMOPLASTIC INJECTION MOULDING PROCESS FOR THE ENCAPSULATION OF ELECTRONIC SUBASSEMBLY, Journal of Electronics Manufacturing, 10(03), pp.171-179, ISSN: 0960-3131. DOI: 10.1142/s0960313100000150.

Palmer, PJ and Williams, DJ (2000) An Analysis of Technology Trends within the Electronics Industry, Microelectronics International, 17(1), pp.13-16, ISSN: 1356-5362.

Palmer, PJ, Williams, DJ, Hughes, C (1999) Observations and models of technology trends within the electronics industry, Engineering Science and Education Journal, 8(5), pp.233-240, ISSN: 0963-7346.

Palmer, PJ and Williams, DJ (1999) The Constraints of Vias and Layers and their Effect on PCB Design, Circuit World, 25(4), pp.22-24.

Williams, DJ, Edwards, TC, Palmer, PJ (1997) Technology Trends in Electronics and Photonics and their Effect on Manufacturing and Assembly, Journal of Electronics Manufacturing, 7, pp.69-77.

Conferences

Palmer, P and Rathbone, N (2017) Can technology inspire the smartphone population to connect with the great outdoors?. In European Conference on Heritage Interpretation, Inverness, Scotland.

Palmer, P, Henshaw, M, Siemieniuch, C, Sinclair, M (2016) A practical example of a software factory: building a custom application for analysing EU Cyber Physical System (CPS) projects using Open Source software components. In 26th Annual INCOSE International Symposium, Edinburgh.

Webb, P, Hutt, D, Whalley, D, Palmer, P (2008) A substrateless process for sustainable manufacture of electronic assemblies. In ,ISBN: 9781424428137. DOI: 10.1109/ESTC.2008.4684401.

Stokes, C and Palmer, PJ (2006) 3D micro-fabrication processes: A review. In , Institution of Engineering and Technology Seminar on MEMS Sensors and Actuators, ICEPT, pp.289-298, ISBN: 9780863416279.

Webb, DP, Hutt, DA, Hopkinson, N, Palmer, PJ, Conway, PP (2006) Integration and packaging of microsystems by polymer overmoulding. In Proceedings of the 1st Electronics Systemintegration Technology Conference, Dresden, Germany, pp.567-574.

Webb, DP, Hsu, CC, Hutt, DA, Hopkinson, N, Conway, PP, Palmer, PJ (2005) Polymer overmoulding for microfluidic device packaging and system integration. In Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, pp.134-139, ISBN: 0-7803-9553-0.

Palmer, PJ, Sarvar, F, Conway, PP, Jaggernauth, WA, Olseger, M (2005) A Roadmap for an Efficient Urban Delivery System - A case study of a technical project in a rapidly developing market. In Proceedings of the Japanese Society of Automotive Engineers Conference, JSAE 2005, Tokyo, Japan, pp.25-27.

Hutt, D, Teh, N-J, Sarvar, F, Whalley, D, Palmer, P, Anderson, P, Kandasubramanian, B, Morris, P, Prosser, S, O'Brien, P (2005) Overmoulding of electronics for end of life recovery. In ,ISBN: 0780395530.

Hutt, DA, Whalley, DC, Sarvar, F, Palmer, PJ, Teh, NJ (2004) Overmoulding of electronics with recyclable polymers. In Lead Free Technologies Conference, SSTC Winter Meeting, NPL, pp.-.

Price, S, Summers, R, Conway, PP, Palmer, PJ (2004) Technology Roadmapping: A New Perspective. In Scapolo, F and Cahill, EE (ed) EU-US Scientific Seminar on New Technology Foresight, Forecasting and Assessment Methods, Seville, Spain, pp.67-76.

Sarvar, F, Teh, N-J, Whalley, D, Hutt, D, Palmer, P (2004) Thermo-mechanical modelling of polymer encapsulated electronics. In ,ISBN: 0780383575.

Palmer, PJ and Williams, DJ (2004) Deep Design for Component and Process. In Proceedings of the 5th International Conference on Integrated Design and Manufacturing in Mechanical Engineering, University of Bath, UK, 71 / 6, ISBN: 1-85790-129-0.

Palmer, P, Mason, LA, Dunn, M (2004) A case study in healthcare quality management: a practical methodology for auditing total patient X-ray dose during a diagnostic procedure. In Proceedings of ESDA04 7th Biennial Conference on Engineering Systems Design and Analysis, Manchester, United Kingdom, pp.469-473, ISBN: 9780791837412. DOI: 10.1115/ESDA2004-58349.

Teh, NJ, Jones, MD, Bevan, D, Cleathero, IC, Kioul, A, Schmidt, O, Conway, PP, Prosser, S, Palmer, PJ (2003) Re-engineering of Thermoplastic Injection Moulding Process for Electronics Encapsulation in Automotive Applications. In Proceedings of the 5th International Conference on Electronics Materials and Packaging (EMAP 2003), Singapore, pp.46-53, ISBN: 981-05-0078-5.

Palmer, PJ (2003) Towards Incorporating Technology Trends into a Maintainable Roadmap for the PRIME Faraday Partnership. In Transferring Microsystems Technology Through the Commercial Markets, NPL, Teddington, pp.96-97, ISBN: 1861-940947.

Cottrill, MC, Jaggernauth, WA, Webb, DP, Palmer, PJ, Conway, PP, West, AA (2002) Foresight Vehicle: Large Area Flexible Circuits for Automotive Applications Manufacturing Technology - A Review of Process Options. In Proceedings of the Society of Automotive Engineers World Congress and Exposition, SAE Paper No 2002-01-1127, Detroit, USA, pp.1-9.

Jaggernauth, WA, Webb, DP, Cottrill, MC, Palmer, PJ, Conway, PP, West, AA (2002) Foresight Vehicle: Specification and Acceptability Criteria for Copper-Clad Dielectric Materials Used in Large Automotive Flexible Printed Circuits. In Proceedings of the Society of Automotive Engineers World Congress and Exposition, SAE Paper No 2002-01-1129, Detroit, USA, pp.1-5.

Webb, DP, Cottrill, MC, Jaggernauth, WA, West, AA, Palmer, PJ, Conway, PP (2002) Foresight Vehicle: Multiplex Networks Implemented on Large Area Flexible Printed Circuit Boards. In Proceedings of the Society of Automotive Engineers World Congress and Exposition, SAE Paper No 2002-01-1130, Detroit, USA, p.5.

Palmer, PJ and Hyslop, SM (2001) Cost Expert - A Demonstrator for Advanced Methodologies for the Monitoring and Assessment of Lifecycle Costs. In Proceedings of InterPACK'01, The PACIFIC RIM/International, Intersociety, Electronic Packaging Mechanical/Business Conference & Exhibition, Kauai, Hawaii, USA, pp.IPACK2001-15655.

Teh, NJ, Conway, PP, Palmer, PJ, Kioul, A, Prosser, S (2000) Embedding of Electronics within Thermoplastic Polymers using Injection Moulding Technique. In Proceedings from the 26th IEMT Symposium, Santa Clara, CA, USA, pp.10-18, ISBN: 0-7803-6482-1.

Palmer, PJ and Hyslop, SM (2000) Strategic Re-use of IP in a modern business environment. In IEE Intellectual Property Seminar Publication No. 00/082, Edinburgh, pp.8/1-8/4.

Teh, NJ, Palmer, PJ, Conway, PP (2000) Low-cost automatic embedding of electronics within injection moulded polymers. In , ADVANCES IN MANUFACTURING TECHNOLOGY - XIV, pp.375-379, ISBN: 1-86058-267-2.

Palmer, PJ and Williams, DJ (1999) A Model of the Distribution of Interconnectivity Through Multiple System Levels and the Impact of Different Design Stratagies and IP re-Use of Design Effort. In Proceedings of the Twenty-Fourth IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, Austin, Texas, pp.170-177.

Hyslop, SM, Palmer, PJ, Williams, DJ (1999) Tools for System Specific Packaging for Electro-Mechanical Systems. In Proceedings of the Twenty-Fourth IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, Austin, Texas, pp.395-401.

Palmer, PJ and Williams, DJ (1999) The Constraints of Vias and Layers and Their Effect on PCB Design Strategy. In Proceedings of 12th European Microelectronics and Packaging Conference, Harrogate, Yorkshire, pp.343-348, ISBN: 0953585808.

Palmer, PJ and Williams, DJ (1999) An Analysis of Technology Trends within the Electronics Industry. In Proceedings of 12th European Microelectronics and Packaging Conference, Keynote Paper, Harrogate, Yorkshire, pp.xxvii-xxxiii, ISBN: 0953585808.

Palmer, PJ and Williams, DJ (1998) Understanding Models of Substrate Behaviour for the Routing of High I/O Packages. In Proceedings of the IEEE Symposium on IC/Package Design Integration, Santa Cruz, USA, pp.58-63, ISBN: 0-8186-8433-X.

Palmer, PJ, Williams, DJ, Dixon, AC (1997) Web Based Tools in Support of Life Cycle Engineering of Telecommunications Products. In Proceedings of the 21st IEEE International Electronic Manufacturing Technology Symposium, Austin, Texas, pp.134-139, ISBN: 0-7803-3929-0.

Stokes, CA and Palmer, PJ (Accepted for publication) 3D Micro-fabrication Processes: A Review. In MEMS Sensors and Actuators, 2006: The Institution of Engineering and Technology Seminar, London, UK, pp.289-298, ISBN: 0-86341-627-6.

Books

Palmer, PJ and Rathbone, N (2017) Interpretation In A Digital Age: Understanding the range of technologies available to the heritage interpretation industry, Printed by Amazon CreateSpace, ISBN: 978-1533253071.

Reimann, M, Ruckriegel, C, Mortimer, S, Bageritz, S, Henshaw, M, Siemieniuch, C, Sinclair, MA, Palmer, PJ, Fitzgerald, J, Ingram, C, Servat, D, Stock, D, Rauschecker, U, Gotz, B, Ordonez, D, Butler, T, de Lama, N, Rico, J, Alonso, J (2017) Road2CPS priorities and recommendations for research and innovation in cyber-physical systems, © Steinbeis-edition, ISBN: 9783956631177.

Palmer, PJ (2016) How to Build Your Own Moth Trap Step by Step Instructions on How to Build a Low Cost Moth Trap, Createspace Independent Publishing Platform, ISBN: 9781523690633.

CD Objects

Palmer, PJ and Hyslop, SM (2001) Cost Expert - A Demonstrator for Advanced Methodologies for the Monitoring and Assessment of Lifecycle Costs,.

Internet Publications

Palmer, PJ, de C Henshaw, MJ, Lock, R, Cann, A, Nicholls, D (2020) Does Citizen Science Biological Recording Tell Us As Much About The Recorders As Biodiversity?. DOI: 10.31219/osf.io/bsye5.

Datasets

Sinclair, M, Palmer, P, Siemieniuch, C, Henshaw, M (2017) Spreadsheet of Gaps and Impacts, DOI: 10.17028/rd.lboro.5082082.

Figures

Palmer, P, Henshaw, M, Sinclair, M, Siemieniuch, C (2017) Networks of Cyber Physical System (CPS) Gaps.

Filesets

Palmer, P, Siemieniuch, C, Sinclair, M, Henshaw, M (2017) Source Network Data, DOI: 10.17028/rd.lboro.5082088.

Other

Palmer, PJ, de C Henshaw, MJ, Lock, R (2019) A Modular Task Orientated Approach for the Analysis of Large Datasets,

We introduce a novel conceptual framework using task orientated templates, for the analysis of large data that effectively separates: data curation, analysis, and reporting of large datasets, creating a reproducible analysis. Outputs saved include calculated secondary data, with associated metadata capturing all the transformations that have been applied, to provide an auditable connection to the source data. Data sharing is encouraged by many research funders and academic publishers, but supplying provenance is not mandatory. Enhancing data sharing will benefit many sectors as the pool of trusted data increases and is used with confidence in downstream analysis. While such benefits are likely to initially impact academic research due to active encouragement of data sharing, business intelligence processes will also benefit through increased confidence of source data. Using task orientated templates will allow a more structured approach to data analysis, and facilitate reuse of data through the use of verifiable digital signatures. This template based approach will reduce the programmatic skills required for the analysis large data for a wide range of commercial, academic and social applications on desktop computers.

. DOI: 10.31219/osf.io/ys2vw.